EDGE HIGH-PERFORMANCE PRODUCTS
1
www.semtech.com
Edge647
Pin Electronics Driver, Window
Comparator, and Switch Matrix
Description
Features
Functional Block Diagram
Applications
Revision 2 / October 27, 2000
The Edge647 is an integrated trinary driver, window
comparator, and switch matrix pin electronics solution
manufactured in a wide voltage CMOS process. It is
designed for automatic test equipment and
instrumentation where cost, functional density, and power
are all at a premium.
The tristatable driver is capable of generating 3 levels -
one for a logic high, one for a logic low, and one for either
a termination voltage or a special programming voltage.
The on-board window comparator effectively determines
whether the DUT is in a high, low, or intermediate state.
The switches are included to allow such functions as PMU,
pull up, and pull down connections.
The Edge647 is intended to offer an extremely low leakage,
low cost, low power, small footprint, per pin solution for
100 MHz and below pin electronics applications. It is a
higher performance, pin and functionally compatible
version of the Edge646
.
Pin Compatible with the Edge646
100 MHz Operation
12V I/O Range
Programmable Output Levels
Flex In digital Inputs (Technology Independent)
Three Level Driver
Extremely Low Leakage Currents (~0 nA)
Small Footprint (32 Pin, 7 mm X 7 mm,
TQFP Package
)
Low Cost Automatic Test Equipment
COMPA
HIGH LEVEL
LOW LEVEL
COMPB
LOAD
CVA
VINP
CVB
SW0
SW0 EN*
SW1
SW1 EN*
SW2
SW2 EN*
VBB
VH
VL
DOUT
VTT
DATA
DATA*
DVR EN
DVR EN*
VTT EN
VTT EN*
2
2000 Semtech Corp.
www.semtech.com
EDGE HIGH-PERFORMANCE PRODUCTS
Edge647
PIN Description
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3
2000 Semtech Corp.
www.semtech.com
EDGE HIGH-PERFORMANCE PRODUCTS
Edge647
PIN Description (continued)
32-Pin, 7mm x 7mm TQFP
1
25
17
9
DVR EN
DVR EN*
D
ATA
D
ATA
*
VEE
VCC
VTT
VL
VH
DOUT
VCC
VEE
CVA
VINP
CVB
LOAD
VTT EN*
VTT EN
VCC
VEE
COMPA
HIGH LEVEL
LOW LEVEL
COMPB
N/C
VBB
SW0 EN*
SW0
SW1 EN*
SW1
SW2 EN*
SW2
4
2000 Semtech Corp.
www.semtech.com
EDGE HIGH-PERFORMANCE PRODUCTS
Edge647
the DUT. In this environment, the driver can withstand a
short to any legal DUT voltage for an indefinite period.
In a low impedance application with no additional output
series resistance, care must be exercised and systems
should be designed to check for this condition and tristate
the driver if a short is detected.
The driver does NOT have on-chip short circuit protection
or limitation circuitry.
VBB
VBB is an analog input which establishes the threshold
for all single ended digital input signals. If SW0 EN*,
SW1 EN*, or SW2 EN* are more positive than VBB, these
inputs are a digital "1". Conversely, if they are more
negative than VBB, they are a "0".
All digital inputs are wide voltage comparator inputs, so
they are technology independent. By establishing the
appropriate VBB level for the switch control inputs, and
the appropriate differential input levels for the driver digital
control inputs, the Edge647 may be driven by TTL, ECL,
CMOS, or any custom level circuitry.
Figure 1. Driver Digital Inputs
Figure 2. Driver Differential Digital Inputs
Circuit Description
Driver Description
The Edge647 driver supports three distinct programmable
driver
levels; high, low, and termination, and high
impedance. There are no restrictions between any of these
three levels in that all three may vary independently over
the entire operating voltage range between VCC and VEE.
The DVR EN*, DATA, and VTT EN pins are digital inputs
that control the driver (see Table 1). With DVR EN* low,
DATA determines whether the driver will force VH or VL at
DOUT. With DVR EN* high, VTT EN* controls whether the
driver goes into high impedance or drives VTT.
Table 1. Driver Truth Table
VH, VL, and VTT
VH, VL, and VTT define the logical "1", "0", and
"termination" levels of the driver and can be adjusted
anywhere over the range spanned by VCC to VEE. There
is no restriction between VH, VL, and VTT, in that they can
all vary independently over the entire voltage range
determined by the power supply levels.
The VH, VL, and VTT inputs are unbuffered in that they
also provide the driver output current, so the sources of
these voltages must have ample current drive capability.
While VTT is referred to as the termination voltage, it may
also be used as a very high "programming" level on many
memory devices.
Driver Output Protection
The Edge647 is designed to operate in a functional testing
environment where a controlled impedance (typically 50
) is maintained between the pin electronics and the DUT.
In general, there will be an external resistor at the driver
output which series terminates the transmission line to
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DATA
DATA*
DVR EN*
DVR EN
VTT EN
VTT EN*
5
2000 Semtech Corp.
www.semtech.com
EDGE HIGH-PERFORMANCE PRODUCTS
Edge647
Load
The Edge647 provides a total of 3 analog switches.
Individual switches vary in both their on resistance and
their on/off time (see Table 4).
Like the driver digital inputs, the switch matrix control inputs
SW0-3 EN* are technology independent as VBB
determines their threshold level. The switch control is
documented in Table 3.
Table 3. Switch Matrix Truth Table
Table 4. Switch Matrix Characteristics
Do NOT leave any digital input pins floating.
Circuit Description
(continued)
Receiver Functionality
The Edge647 supports an on-board window comparator.
CVB and CVA are high impedance analog inputs which
establish the threshold voltages. COMPA and COMPB are
the digital outputs which reflect the real time status of
VINP. Table 2 summarizes the relationship between the
threshold levels, VINP, and the output signals.
Table 2. Comparator Truth Table
Comparator Outputs
The comparator outputs are 50
output impedance non-
tristatable drivers designed to cleanly drive 50
transmission lines without requiring any external series
termination resistors. Input pins LOW LEVEL and HIGH
LEVEL establish the logic 0 and 1 levels respectively. In
normal operation, LOW LEVEL would be connected to
ground and HIGH LEVEL would be connected to a system
VDD supply, producing CMOS digital swings at the output.
However, the comparator outputs are technology
independent in that they can drive PECL, 3V CMOS, ECL,
LV CMOS, GTL, and custom levels by varying LOW LEVEL
and HIGH LEVEL. For example, should a 3V swing be
desired, HIGH LEVEL could be connected to a 3.0V power
supply.
Notice that HIGH LEVEL and LOW LEVEL provide both the
voltage level and the current for the comparator outputs.
HIGH LEVEL and LOW LEVEL may be varied between +5V
and -2V.
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6
2000 Semtech Corp.
www.semtech.com
EDGE HIGH-PERFORMANCE PRODUCTS
Edge647
Application Information
Power Supplies Decoupling
A .1
F capacitor is recommended between VCC and
VEE.
In addition, solid VCC and VEE planes are recommended
to provide a low inductance path for the power supply
currents. These planes will reduce any inductive supply
drops associated with switching currents on the power
supply pins. If solid planes are not possible, then wide
power busses are preferable.
VH, VL, and VTT Decoupling
As the VH, VL, and VTT inputs are unbuffered and must
supply the driver output current, decoupling capacitors
for these inputs are recommended in proportion to the
amount of output current the application requires. In
general, a surge current of 50 mA (5V swings series
terminated with 50
into a 50
transmission line) are
the maximum dynamic output currents the driver should
see. The decoupling capacitors should be able to provide
this current for the duration of the round trip time between
the pin electronics and the DUT, and then recharge
themselves before the next such transition would occur.
Once this condition is satisfied, the VH, VL, and VTT supply
voltages are more responsible for establishing the DC levels
associated with each function and recharging the
capacitors, rather than providing the actual dynamic
currents required to drive the DUT transmission line.
Ideally, VH, VL, and VTT would each have a dedicated
power layer on the PC board for the lowest possible
inductance power supply distribution.
Power Supply Rules
1)
VEE
All I/O Pins
VCC
2)
VCC
0V
3)
VEE
0V
Power Up Sequencing
1)
VCC (all other inputs @ ground)
2)
VEE (all other inputs @ ground)
3)
Digital Inputs
Analog Inputs
VH, VL, VTT
Latchup Protection
The Edge647 has several power supply requirements to
protect the part in power supply fault situations, as well
as during power up and power down sequences. VCC
must remain greater than or equal to VDD (external supply
for the digital logic) at all times. Both VCC and VDD must
always be positive (above ground), and VEE must always
be negative (at or below ground).
The three diode configuration shown in Figure 3 should
be used on a once-per-board basis.
Figure 3.
Power Supply Protection Scheme
gure 5.
Warning: It is extremely important that the voltage on any
device pin does not exceed the range of VEE 0.5V to VCC
+0.5V at any time, either during power up, normal
operation, or during power down. Failure to adhere to this
requirement could result in latchup of the device, which
could be destructive if the system power supplies are
capable of supplying large amounts of current. Even if the
device is not immediately destroyed, the cumulative
damage caused by the stress of repeated latchup may
affect device reliability.
VCC
VDD
VEE
1N5820 or
Equivalent
7
2000 Semtech Corp.
www.semtech.com
EDGE HIGH-PERFORMANCE PRODUCTS
Edge647
Package Information
b
D
3
4
4
e
N / 4 TIPS
4 X
E / 2
D / 2
SEE DETAIL "A"
E
0.20
C
A B
D
TOP VIEW
D1
E1
5
7
5
7
4 X
D1 / 2
E1 / 2
0.20
H
A B
D
BOTTOM VIEW
C
OO
8
2000 Semtech Corp.
www.semtech.com
EDGE HIGH-PERFORMANCE PRODUCTS
Edge647
Package Information
(continued)
3
DETAIL "A"
e / 2
b
0 MIN.
0.08 / 0.20 R.
GAUGE PLANE
0.25
0 7
L
C.08
R. MIN.
0.20 MIN.
1.00 REF.
DATUM
PLANE
H
A1
0.05
A2
S
DETAIL "B"
9
;;;
;;;
S
S
D
C
ddd
M
A B
WITH LEAD FINISH
Lead
Cross Section
0.09 / 0.20
0.09 / 0.16
b
b
1
BASE METAL
2
8 PLACES
11 / 13
A
0.10
/ /
C
M
SEE DETAIL "B"
0.05
ccc
H
C
SECTION CC
JEDEC VARIATION
All Dimensions in Millimeters
AC
Min.
Nom.
Max.
Note
A
1.60
A1
0.05
0.10
0.15
A2
1.35
1.40
1.45
D
9.00
BSC.
4
D1
7.00
BSC.
7,8
E
9.00
BSC.
4
E1
7.00 BSC.
7,8
L
0.45
0.60
0.75
M
0.15
N
32
e
0.80 BSC.
b
0.30
0.37
0.45
9
b1
0.30
0.35
0.40
ccc
0.10
ddd
0.20
Notes:
1.
All dimensions and tolerances conform to ANSI
Y14.5-1982.
2.
Datum plane -H- located at mold parting line and
coincident with lead, where lead exits plastic
body at bottom of parting line.
3.
Datums A-B and -D- to be determined at
centerline between leads where leads exit
plastic body at datum plane -H-.
4.
To be determined at seating plane -C-.
5.
Dimensions D1 and E1 do not include mold
protrusion.
6.
"N" is the total # of terminals.
7.
These dimensions to be determined at the
datum plane -H-.
8.
Package top dimensions are smaller than
bottom dimensions and top of package will
not overhang bottom of package.
9.
Dimension b does not include dambar
protrusion. Allowable dambar protrusion
shall be 0.08 mm total in excess of the b
dimension at maximum material condition.
Dambar cannot be located on the lower
radius or the foot.
10.
Controlling dimension: millimeter.
11.
Maximum allowable die thickness to be
assembled in this package family is 0.30
millimeters.
12.
This outline conforms to JEDEC publication 95,
registration MO-136, variations AC, AE, and AF.
9
2000 Semtech Corp.
www.semtech.com
EDGE HIGH-PERFORMANCE PRODUCTS
Edge647
Recommended Operating Conditions
Absolute Maximum Ratings
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5
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+
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D
5
.
-
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5
.
+
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C
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g
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b
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A
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T
5
5
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5
2
1
+
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e
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t
a
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p
m
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e
g
a
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o
t
S
5
6
-
0
5
1
+
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u
t
a
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p
m
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n
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t
c
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0
5
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g
n
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0
6
2
o
C
Stresses above listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at these or any other conditions above
those listed in the operational sections of this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
10
2000 Semtech Corp.
www.semtech.com
EDGE HIGH-PERFORMANCE PRODUCTS
Edge647
DC Characteristics
r
e
t
e
m
a
r
a
P
l
o
b
m
y
S
n
i
M
p
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T
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(
7
2
F
p
Driver/Receiver Characteristics
11
2000 Semtech Corp.
www.semtech.com
EDGE HIGH-PERFORMANCE PRODUCTS
Edge647
DC Characteristics
(continued)
r
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t
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m
a
r
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P
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d
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i
D
B
B
V
4
.
1
-
4
.
4
V
Note 1: This parameter is guaranteed by design and characterization. Production testing is performed
against a
250 nA limit.
Note 2: Measured at 0V.
Note 3: Measured at HIGH LEVEL = +3.3V, LOW LEVEL = 0V.
Note 4: Production tested at +5V and 0V against
10 nA limits. Also tested at VCC and VEE against
250
nA limits.
*-2V or (VEE + 2.0V), whichever is more positive.
Digital Inputs
DATA / DATA*, DVR EN* / DVR EN, VTT EN / VTT EN*
SW0 EN*, SW1 EN*, SW2 EN*, SW3 EN*
12
2000 Semtech Corp.
www.semtech.com
EDGE HIGH-PERFORMANCE PRODUCTS
Edge647
AC Characteristics
r
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t
e
m
a
r
a
P
l
o
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m
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S
n
i
M
p
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T
x
a
M
s
t
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n
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r
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v
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r
D
)
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Note 1:
Into 1M of 50
transmission line terminated with 1K
and 5 pF with the proper series termination
resistor.
Note 2:
LOW LEVEL = 0V, HIGH LEVEL = 3.3V.
Note 3:
Measured at 2.5V with VH = +5V, VL = 0V.
Note 4:
Guaranteed by design and characterization. This parameter is not tested in production.
Note 5:
Tested with a 30 mA load.
Note 6:
Guaranteed by characterization. This parameter is tested in production against 40 MHz limits.
Note 7:
The region around the threshold where the comparator may have difficulty resolving the input state
.
13
2000 Semtech Corp.
www.semtech.com
EDGE HIGH-PERFORMANCE PRODUCTS
Edge647
AC Characteristics
(continued)
Contact Information
Semtech Corporation
Edge High-Performance Division
10021 Willow Creek Rd., San Diego, CA 92131
Phone: (858)695-1801 FAX (858)695-2633
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Ordering Information
INPUT
OUTPUT
Tpd RiseTpd Fall
| Tpd Rise Tpd Fall | 2.0 ns
Figure 4. Tpd Rise, Tpd Fall Errors
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