PROTECTION PRODUCTS
1
www.semtech.com
PROTECTION PRODUCTS - MicroClamp
TM
uClamp3301D
Low Voltage
Clamp
TM
for ESD and CDE Protection
Description
Features
Schematic & PIN Configuration
Revision 10/25/2004
Applications
Mechanical Characteristics
The
Clamp
TM
series of Transient Voltage Suppressors
(TVS) are designed to replace multilayer varistors
(MLVs) in portable applications such as cell phones,
notebook computers, and PDA's. They offer superior
electrical characteristics such as lower clamping
voltage and no device degradation when compared to
MLVs. They are are designed to protect sensitive
semiconductor components from damage or upset due
to electrostatic discharge (ESD), lightning, electrical
fast transients (EFT), and cable discharge events
(CDE).
The
Clamp
TM
3301D is constructed using Semtech's
proprietary EPD process technology. The EPD process
provides low standoff voltages with significant reduc-
tions in leakage currents and capacitance over silicon-
avalanche diode processes. They feature a true
operating voltage of 3.3 volts for superior protection
when compared to traditional pn junction devices.
The
Clamp3301D is in a SOD-323 package and will
protect one unidirectional line. They give the designer
the flexibility to protect one line in applications where
arrays are not practical.
They may may be used to meet the ESD immunity
requirements of IEC 61000-4-2, Level 4 (15kV air, 8kV
contact discharge).
200 Watts peak pulse power (tp = 8/20s)
Transient protection for data lines to
IEC 61000-4-2 (ESD) 15kV (air), 8kV (contact)
IEC 61000-4-4 (EFT) 40A (tp = 5/50ns)
IEC 61000-4-5 (Lightning) 12A (tp = 8/20s)
Small package for use in portable electronics
Suitable replacement for MLV's in ESD protection
applications
Protects one line
Low clamping voltage
Working voltages: 3.3V
3.3V
3.3V
3.3V
3.3V
Low leakage current
Solid-state silicon-avalanche technology
EIAJ SOD-323 package
Molding compound flammability rating: UL 94V-0
Marking: Marking code, cathode band
Packaging: Tape and Reel per EIA 481
Lead Finish: Matte tin
Cell Phone Handsets and Accessories
Laser Diode Protection
Personal Digital Assistants (PDA's)
Notebooks, Desktops, & Servers
Portable Instrumentation
Analog Inputs
SOD-323 (Top View)
Equivalent Circuit Diagram
2
2004 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
PROTECTION PRODUCTS
uClamp3301D
Absolute Maximum Rating
Electrical Characteristics
g
n
i
t
a
R
l
o
b
m
y
S
e
u
l
a
V
s
t
i
n
U
)
s
0
2
/
8
=
p
t
(
r
e
w
o
P
e
s
l
u
P
k
a
e
P
P
k
p
0
0
2
s
t
t
a
W
)
s
0
2
/
8
=
p
t
(
t
n
e
r
r
u
C
e
s
l
u
P
k
a
e
P
I
P
P
2
1
A
)
2
-
4
-
0
0
0
1
6
C
E
I
r
e
p
m
r
o
f
e
v
a
W
M
B
H
(
e
g
a
tl
o
V
D
S
E
V
P
P
0
3
V
k
e
r
u
t
a
r
e
p
m
e
T
g
n
it
a
r
e
p
O
T
J
5
2
1
+
o
t
5
5
-
C
e
r
u
t
a
r
e
p
m
e
T
e
g
a
r
o
t
S
T
G
T
S
0
5
1
+
o
t
5
5
-
C
r
e
t
e
m
a
r
a
P
l
o
b
m
y
S
s
n
o
i
t
i
d
n
o
C
m
u
m
i
n
i
M
l
a
c
i
p
y
T
m
u
m
i
x
a
M
s
t
i
n
U
e
g
a
tl
o
V
f
f
O
-
d
n
a
t
S
e
s
r
e
v
e
R
V
M
W
R
3
.
3
V
e
g
a
tl
o
V
h
g
u
o
r
h
T
-
h
c
n
u
P
V
T
P
I
T
P
A
2
=
5
.
3
V
e
g
a
tl
o
V
k
c
a
B
-
p
a
n
S
V
B
S
I
B
S
A
m
0
5
=
8
.
2
V
t
n
e
r
r
u
C
e
g
a
k
a
e
L
e
s
r
e
v
e
R
I
R
V
M
W
R
C
5
2
=
T
,
V
3
.
3
=
5
.
0
A
e
g
a
tl
o
V
g
n
i
p
m
a
l
C
V
C
I
P
P
s
0
2
/
8
=
p
t
,
A
1
=
2
o
t
1
n
i
P
5
.
4
V
e
g
a
tl
o
V
g
n
i
p
m
a
l
C
V
C
I
P
P
s
0
2
/
8
=
p
t
,
A
5
=
2
o
t
1
n
i
P
8
.
6
V
e
g
a
tl
o
V
g
n
i
p
m
a
l
C
V
C
I
P
P
s
0
2
/
8
=
p
t
,
A
2
1
=
2
o
t
1
n
i
P
5
.
9
V
e
g
a
tl
o
V
d
r
a
w
r
o
F
e
d
o
i
D
g
n
ir
e
e
t
S
)
e
g
a
tl
o
V
g
n
i
p
m
a
l
C
e
s
r
e
v
e
R
(
V
F
I
P
P
s
0
2
/
8
=
p
t
,
A
1
=
1
o
t
2
n
i
P
7
.
1
V
e
c
n
a
ti
c
a
p
a
C
n
o
it
c
n
u
J
C
j
V
R
z
H
M
1
=
f
,
V
0
=
0
3
0
4
F
p
3
2004 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
PROTECTION PRODUCTS
uClamp3301D
Typical Characteristics
Non-Repetitive Peak Pulse Power vs. Pulse Time
Power Derating Curve
0
10
20
30
40
50
60
70
80
90
100
110
0
25
50
75
100
125
150
Ambient Temperature - T
A
(
o
C)
%
of
Ra
t
e
d P
o
w
e
r or I
PP
Clamping Voltage vs. Peak Pulse Current
Capacitance vs. R
Capacitance vs. R
Capacitance vs. R
Capacitance vs. R
Capacitance vs. Reeeeevvvvver
er
er
er
erse V
se V
se V
se V
se Voltage
oltage
oltage
oltage
oltage
0.01
0.1
1
10
0.1
1
10
100
1000
Pulse Duration - tp (
s)
Peak Pu
l
se Po
wer
- P
PP
(kW
)
START . 030 MHz
3
STOP 000 . 000 000 MHz
CH1 S21 LOG
6 dB / REF 0 dB
Insertion Loss S21
0
2
4
6
8
10
12
14
0
2
4
6
8
10
12
Peak Pulse Current - I
PP
(A)
C
l
amp
i
n
g
Vo
l
t
ag
e
- V
C
(V)
Waveform
Parameters:
tr = 8s
td = 20s
20.0
21.0
22.0
23.0
24.0
25.0
26.0
27.0
28.0
29.0
30.0
0
0.5
1
1.5
2
2.5
3
3.5
Reverse Voltage - V
R
(V)
C
a
p
aci
tan
ce -
C
j
(p
F
)
f = 1 MHz
4
2004 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
PROTECTION PRODUCTS
uClamp3301D
Device Connection Options
The
Clamp3301D is designed to protect one I/O, or
power supply line. It will present a high impedance to
the protected line up to 3.3 volts. It will "turn on"
when the line voltage exceeds 3.5 volts. The device is
unidirectional and may be used on lines where the
signal polarity is above ground. The cathode band
should be placed towards the line that is to be
protected.
EPD TVS
Characteristics
These devices are constructed using Semtech's
proprietary EPD technology. The structure of the EPD
TVS is vastly different from the traditional pn-junction
devices. At voltages below 5V, high leakage current
and junction capacitance render conventional ava-
lanche technology impractical for most applications.
However, by utilizing the EPD technology, these devices
can effectively operate at 3.3V while maintaining
excellent electrical characteristics.
The EPD TVS employs a complex nppn structure in
contrast to the pn structure normally found in tradi-
tional silicon-avalanche TVS diodes. The EPD mecha-
nism is achieved by engineering the center region of
the device such that the reverse biased junction does
not avalanche, but will "punch-through" to a conduct-
ing state. This structure results in a device with supe-
rior dc electrical parameters at low voltages while
maintaining the capability to absorb high transient
currents.
Matte Tin Lead Finish
Matte tin has become the industry standard lead-free
replacement for SnPb lead finishes. A matte tin finish
is composed of 100% tin solder with large grains.
Since the solder volume on the leads is small com-
pared to the solder paste volume that is placed on the
land pattern of the PCB, the reflow profile will be
determined by the requirements of the solder paste.
Therefore, these devices are compatible with both
lead-free and SnPb assembly techniques. In addition,
unlike other lead-free compositions, matte tin does not
have any added alloys that can cause degradation of
the solder joint.
Device Schematic & Pin Configuration
Applications Information
I
PP
I
SB
I
PT
I
R
V
RWM
V
V
PT
V
C
V
F
I
F
SB
EPD TVS IV Characteristic Curve
5
2004 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
PROTECTION PRODUCTS
uClamp3301D
Outline Drawing - SOD-323
c
.010
.005
.014
-
.000
.012
0.36
-
-
-
0.35
.018
.008
0.25
0.13
.046
.004
.016 0.30
0.00
0.91
0.45
0.20
-
0.40
1.17
0.10
-
-
-
A
H
2. DIMENSIONS "E1" AND "D" DO NOT INCLUDE MOLD FLASH, PROTRUSIONS
OR GATE BURRS.
CONTROLLING DIMENSIONS ARE IN INCHES (ANGLES IN DEGREES).
NOTES:
1.
SIDE VIEW
NOM
INCHES
DIMENSIONS
DIM
b
E1
L
N
E
D
c
A1
A2
A
MIN
MILLIMETERS
MAX MIN NOM MAX
.097
.102 .107 2.46
2.59 2.72
2
SEE DETAIL
A1
A
A2
D
A
E1
E
.060
.044
.065
.050
.013
-
2
1.64
1.28
.070
.054
1.50
1.18
.017 0.33
1.78
1.37
0.43
-
L
GAGE
PLANE
0.008
DETAIL
Land Pattern - SOD-323
(.085)
(2.15)
Z
G
Y
(C)
0.90
.035
0.53
.021
1.25
.049
3.40
.134
X
INCHES
DIMENSIONS
Z
Y
X
DIM
C
G
MILLIMETERS
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
NOTES:
1.
6
2004 Semtech Corp.
www.semtech.com
PROTECTION PRODUCTS
PROTECTION PRODUCTS
uClamp3301D
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
r
e
b
m
u
N
t
r
a
P
g
n
i
k
r
o
W
e
g
a
t
l
o
V
r
e
p
y
t
Q
l
e
e
R
e
z
i
S
l
e
e
R
T
C
T
.
D
1
0
3
3
p
m
a
l
C
u
V
3
.
3
0
0
0
,
3
"
7
Marking Code
Ordering Information
3U
MicroClamp, uClamp, and
Clamp are marks of Semtech Corporation
PDF 
ZIP