LHF16KAP
Rev. 2.0
Handle this document carefully for it contains material protected by international copyright
law. Any reproduction, full or in part, of this material is prohibited without the express
written permission of the company.
When using the products covered herein, please observe the conditions written herein
and the precautions outlined in the following paragraphs. In no event shall the company
be liable for any damages resulting from failure to strictly adhere to these conditions and
precautions.
(1) The products covered herein are designed and manufactured for the following
application areas. When using the products covered herein for the equipment listed
in Paragraph (2), even for the following application areas, be sure to observe the
precautions given in Paragraph (2). Never use the products for the equipment listed
in Paragraph (3).
Office electronics
Instrumentation and measuring equipment
Machine tools
Audiovisual equipment
Home appliance
Communication equipment other than for trunk lines
(2) Those contemplating using the products covered herein for the following equipment
which demands high reliability, should first contact a sales representative of the
company and then accept responsibility for incorporating into the design fail-safe
operation, redundancy, and other appropriate measures for ensuring reliability and
safety of the equipment and the overall system.
Control and safety devices for airplanes, trains, automobiles, and other
transportation equipment
Mainframe computers
Traffic control systems
Gas leak detectors and automatic cutoff devices
Rescue and security equipment
Other safety devices and safety equipment, etc.
(3) Do not use the products covered herein for the following equipment which demands
extremely high performance in terms of functionality, reliability, or accuracy.
Aerospace equipment
Communications equipment for trunk lines
Control equipment for the nuclear power industry
Medical equipment related to life support, etc.
(4) Please direct all queries and comments regarding the interpretation of the above
three Paragraphs to a sales representative of the company.
Please direct all queries regarding the products covered herein to a sales representative
of the company.
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LHF16KAP
1
Rev. 2.0
CONTENTS
PAGE
1 INTRODUCTION ...................................................... 3
1.1 Product Overview ................................................ 3
2 PRINCIPLES OF OPERATION ................................ 6
2.1 Data Protection ................................................... 7
3 BUS OPERATION.................................................... 7
3.1 Read ................................................................... 7
3.2 Output Disable .................................................... 7
3.3 Standby ............................................................... 7
3.4 Deep Power-Down .............................................. 7
3.5 Read Identifier Codes Operation ......................... 8
3.6 Query Operation.................................................. 8
3.7 Write.................................................................... 8
4 COMMAND DEFINITIONS ....................................... 8
4.1 Read Array Command....................................... 11
4.2 Read Identifier Codes Command ...................... 11
4.3 Read Status Register Command....................... 11
4.4 Clear Status Register Command....................... 11
4.5 Query Command ............................................... 12
4.5.1 Block Status Register .................................. 12
4.5.2 CFI Query Identification String..................... 13
4.5.3 System Interface Information ....................... 13
4.5.4 Device Geometry Definition ......................... 14
4.5.5 SCS OEM Specific Extended Query Table .. 14
4.6 Block Erase Command...................................... 15
4.7 Full Chip Erase Command ................................ 15
4.8 Word/Byte Write Command............................... 16
4.9 Multi Word/Byte Write Command ...................... 16
4.10 Block Erase Suspend Command..................... 17
4.11 (Multi) Word/Byte Write Suspend Command... 17
4.12 Set Block Lock-Bit Command.......................... 18
4.13 Clear Block Lock-Bits Command..................... 18
4.14 STS Configuration Command ......................... 19
PAGE
5 DESIGN CONSIDERATIONS .................................30
5.1 Three-Line Output Control .................................30
5.2 STS and Block Erase, Full Chip Erase, (Multi)
Word/Byte Write and Block Lock-Bit Configuration
Polling................................................................30
5.3 Power Supply Decoupling ..................................30
5.4 V
PP
Trace on Printed Circuit Boards ..................30
5.5 V
CC
, V
PP
, RP# Transitions.................................31
5.6 Power-Up/Down Protection................................31
5.7 Power Dissipation ..............................................31
6 ELECTRICAL SPECIFICATIONS...........................32
6.1 Absolute Maximum Ratings ...............................32
6.2 Operating Conditions .........................................32
6.2.1 Capacitance .................................................32
6.2.2 AC Input/Output Test Conditions ..................33
6.2.3 DC Characteristics........................................34
6.2.4 AC Characteristics - Read-Only Operations .36
6.2.5 AC Characteristics - Write Operations ..........39
6.2.6 Alternative CE#-Controlled Writes ................41
6.2.7 Reset Operations .........................................43
6.2.8 Block Erase, Full Chip Erase, (Multi)
Word/Byte Write and Block Lock-Bit
Configuration Performance...........................44
7 ADDITIONAL INFORMATION ................................45
7.1 Ordering Information ..........................................45
8 PACKAGE AND PACKING SPECIFICATION........46
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LHF16KAP
2
Rev. 2.0
LH28F160S5HNS-L70
16M-BIT (2MBx8/1MBx16)
Smart 5 Flash MEMORY
Smart 5 Technology
5V V
CC
5V V
PP
Common Flash Interface (CFI)
Universal & Upgradable Interface
Scalable Command Set (SCS)
High Speed Write Performance
32 Bytes x 2 plane Page Buffer
2s/Byte Write Transfer Rate
High Speed Read Performance
70ns(5V0.25V), 90ns(5V0.5V)
Operating Temperature
-40C to +85C
Enhanced Automated Suspend Options
Write Suspend to Read
Block Erase Suspend to Write
Block Erase Suspend to Read
High-Density Symmetrically-Blocked
Architecture
Thirty-two 64K-byte Erasable Blocks
SRAM-Compatible Write Interface
User-Configurable x8 or x16 Operation
Enhanced Data Protection Features
Absolute Protection with V
PP
=GND
Flexible Block Locking
Erase/Write Lockout during Power
Transitions
Extended Cycling Capability
100,000 Block Erase Cycles
3.2 Million Block Erase Cycles/Chip
Low Power Management
Deep Power-Down Mode
Automatic Power Savings Mode
Decreases I
CC
in Static Mode
Automated Write and Erase
Command User Interface
Status Register
Industry-Standard Packaging
56-Lead SSOP
ETOX
TM*
V Nonvolatile Flash
Technology
CMOS Process
(P-type silicon substrate)
Not designed or rated as radiation
hardened
SHARP's LH28F160S5HNS-L70 Flash memory with Smart 5 technology is a high-density, low-cost, nonvolatile,
read/write storage solution for a wide range of applications. Its symmetrically-blocked architecture, flexible voltage
and extended cycling provide for highly flexible component suitable for resident flash arrays, SIMMs and memory
cards. Its enhanced suspend capabilities provide for an ideal solution for code + data storage applications. For
secure code storage applications, such as networking, where code is either directly executed out of flash or
downloaded to DRAM, the LH28F160S5HNS-L70 offers three levels of protection: absolute protection with V
PP
at
GND, selective hardware block locking, or flexible software block locking. These alternatives give designers
ultimate control of their code security needs.
The LH28F160S5HNS-L70 is conformed to the flash Scalable Command Set (SCS) and the Common Flash
Interface (CFI) specification which enable universal and upgradable interface, enable the highest system/device
data transfer rates and minimize device and system-level implementation costs.
The LH28F160S5HNS-L70 is manufactured on SHARP's 0.35m ETOX
TM
* V process technology. It come in
industry-standard package: the 56-Lead SSOP, ideal for board constrained applications.
*ETOX is a trademark of Intel Corporation.
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