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Электронный компонент: LH28F160SGED-L10

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LH28F160SGED-L10
LH28F160SGED-L10
16 M-bit (512 kB x 16 x 2-Bank)
SmartVoltage Dual Work Flash Memory
DESCRIPTION
The LH28F160SGED-L10 Dual Work flash memory
with SmartVoltage technology is a high-density,
low-cost, nonvolatile, read/write storage solution for
a wide range of applications. The LH28F160SGED-
L10 is the highest density, highest performance
non-volatile read/write solution for solid-state
storage applications. LH28F160SGED-L10 can
read/write/erase at V
CC
= 2.7 V and V
PP
= 2.7 V.
Its low voltage operation capability realizes longer
battery life and suits for cellular phone application.
Its symmetrically-blocked architecture, flexible
voltage and enhanced cycling capability provide for
highly flexible component suitable for resident flash
arrays, SIMMs and memory cards. Its enhanced
suspend capabilities provide for an ideal solution for
code + data storage applications. For secure code
storage applications, such as networking, where
code is either directly executed out of flash or
downloaded to DRAM, the LH28F160SGED-L10
offers three levels of protection : absolute protection
with V
PP
at GND, selective hardware block locking,
or flexible software block locking. These alternatives
give designers ultimate control of their code security
needs.
FEATURES
SmartVoltage Dual Work technology
2.7 V, 3.3 V or 5 V V
CC
2.7 V, 3.3 V, 5 V or 12 V V
PP
Capable of performing erase, write and read
for each bank independently (Impossible to
perform read from both banks at a time).
High performance read access time
100 ns (5.00.5 V)/100 ns (3.30.3 V)/
120 ns (2.7 to 3.6 V)
Enhanced automated suspend options
Word write suspend to read
Block erase suspend to word write
Block erase suspend to read
Enhanced data protection features
Absolute protection with V
PP
= GND
Flexible block locking
Block erase/word write lockout during power
transitions
SRAM-compatible write interface
High-density symmetrically-blocked architecture
Thirty-two 32 k-word erasable blocks
Enhanced cycling capability
100 000 block erase cycles
1.6 million block erase cycles/bank
Low power management
Deep power-down mode
Automatic power saving mode decreases Icc
in static mode
Automated word write and block erase
Command user interface
Status register
ETOX
TM
V nonvolatile flash technology
Package
48-pin TSOP Type I (TSOP048-P-1220)
Normal bend
ETOX is a trademark of Intel Corporation.
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In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books,
etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
LH28F160SGED-L10
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PIN CONNECTIONS
48-PIN TSOP (Type I)
(TSOP048-P-1220)
A
15
A
14
A
13
A
12
A
11
A
10
A
9
A
8
NC
NC
WE#
RP#
V
PP
WP#
NC
A
18
A
17
A
7
A
6
A
5
A
4
A
3
A
2
A
1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
A
16
GND
DQ
15
DQ
7
DQ
14
DQ
6
DQ
13
DQ
5
DQ
12
DQ
4
V
CC
DQ
11
DQ
3
DQ
10
DQ
2
DQ
9
DQ
1
DQ
8
DQ
0
OE#
GND
BE
1
#
BE
0
#
A
0
TOP VIEW
LH28F160SGED-L10
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BLOCK DIAGRAM
Bank0
Bank1
DQ
0
-DQ
15
V
CC
WE#
OE#
WP#
RP#
A
0
-A
18
V
CC
GND
V
PP
BE
1
#
BE
0
#
I/O
LOGIC
COMMAND
USER
INTERFACE
INPUT
BUFFER
DATA
REGISTER
WRITE
STATE
MACHINE
PROGRAM/ERASE
VOLTAGE SWITCH
IDENTIFIER
REGISTER
OUTPUT
BUFFER
Y GATING
DATA
COMPARATOR
STATUS
REGISTER
OUTPUT
MULTIPLEXER
16
32 k-WORD
BLOCKS
Y DECODER
INPUT
BUFFER
ADDRESS
LATCH
ADDRESS
COUNTER
X DECODER
LH28F160SGED-L10
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PIN DESCRIPTION
SYMBOL
TYPE
NAME AND FUNCTION
A
0
-A
18
INPUT
ADDRESS INPUTS : Inputs for addresses during read and write operations. Addresses
are internally latched during a write cycle.
DATA INPUT/OUTPUTS : Inputs data and commands during CUI write cycles; outputs
data during memory array, status register, and identifier code read cycles. Data pins
float to high-impedance when the chip is deselected or outputs are disabled. Data is
internally latched during a write cycle.
BANK ENABLE : Activates the device's control logic, input buffers, decoders, and
sense amplifiers. When BE
0
# are "low", bank0 is in active. When BE
1
# are "low", bank1
is in active. Both BE
0
# and BE
1
# must not be low at the same time. BE
0
#, BE
1
#-high
deselects the device and reduces power consumption to standby levels.
RESET/DEEP POWER-DOWN : Puts the device in deep power-down mode and resets
internal automation. RP#-high enables normal operation. When driven low, RP# inhibits
write operations which provide data protection during power transitions. Exit from deep
power-down sets the device to read array mode.
RP# at V
HH
allows to set permanent lock-bit. Block erase, word write, or lock-bit
configuration with V
IH
RP#
V
HH
produce spurious results and should not be
attempted.
OE#
INPUT
OUTPUT ENABLE : Controls the device's outputs during a read cycle.
WE#
INPUT
WRITE ENABLE : Controls writes to the CUI and array blocks. Addresses and data are
latched on the rising edge of the WE# pulse.
WP#
INPUT
WRITE PROTECT : Master control for block locking. When V
IL
, locked blocks cannot be
erased and programmed, and block lock-bits cannot be set and reset.
BLOCK ERASE, WORD WRITE, LOCK-BIT CONFIGURATION POWER SUPPLY :
For erasing array blocks, writing words, or configuring lock-bits. With V
PP
V
PPLK
,
memory contents cannot be altered. Block erase, word write, and lock-bit configuration
with an invalid V
PP
(see Section 6.2.3 "DC CHARACTERISTICS") produce spurious
results and should not be attempted.
DEVICE POWER SUPPLY : Internal detection configured the device for 2.7 V, 3.3 V or
5 V operation. To switch from one voltage to another, ramp V
CC
down to GND and then
ramp V
CC
to the new voltage. Do not float any power pins. With V
CC
V
LKO
, all write
attempts to the flash memory are inhibited. Device operations at invalid V
CC
voltage
(see Section 6.2.3 "DC CHARACTERISTICS") produce spurious results and should
not be attempted.
GND
SUPPLY
GROUND : Do not float any ground pins.
NC
NO CONNECT : Lead is not internal connected; recommend to be floated.
DQ
0
-DQ
15
INPUT/
OUTPUT
BE
0
#,
BE
1
#
INPUT
RP#
INPUT
V
PP
V
CC
SUPPLY
SUPPLY
LH28F160SGED-L10
1 INTRODUCTION
This datasheet contains LH28F160SGED-L10
specifications. Section 1 provides a flash memory
overview. Sections 2, 3, 4, and 5 describe the
memory organization and functionality. Section 6
covers electrical specifications. LH28F160SGED-
L10 flash memory documentation also includes
ordering information which is referenced in
Section 7.
1.1
New Features
Key enhancements of LH28F160SGED-L10
SmartVoltage Dual Work flash memory are :
SmartVoltage Dual Work Technology
Enhanced Suspend Capabilities
In-System Block Locking
Permanent Lock Capability
Note following important differences :
V
PPLK
has been lowered to 1.5 V to support
3.3 V and 5 V block erase, word write, and lock-
bit configuration operations. Designs that switch
V
PP
off during read operations should make sure
that the V
PP
voltage transitions to GND.
To take advantage of SmartVoltage technology,
allow V
CC
connection to 2.7 V, 3.3 V or 5 V.
Once set the permanent lock bit, the blocks
which have been set block lock-bit can not be
erased, written forever.
1.2
Product Overview
The LH28F160SGED-L10 is a high-performance
16 M-bit SmartVoltage Dual Work flash memory
organized as 1 024 k-word of 16 bits. The 1 024 k-
word of data is arranged in thirty-two 32 k-word
blocks which are individually erasable, lockable,
and unlockable in-system. The memory map is
shown in Fig. 1.
All pins except of BE# are shared by both banks,
and BE# is divided to BE
0
# and BE
1
# in order to
select one of banks. BE
0
# is assigned to No. 26
pin which is CE# in LH28F800SGE-L10, BE
1
#
is assigned to No. 27 pin which is GND in
LH28F800SGE-L10. To select either bank (bank0)
BE
0
# must be "L", and to select another bank
(bank1) BE
1
# must be "L". Selecting both banks
(bank0 and bank1) at a time, except of read
operation (array read, status register read), turns
both BE
0
# and BE
1
# to "L".
Operation mode of bank0 and bank1 as follows :
1) Both bank0 and bank1 are in deep power-down
(RP# = "L").
2) Both bank0 and bank1 are in standby
(BE
0
# = BE
1
# = "H").
3) Bank0 is in standby and bank1 is in active state
of programming or erase, or bank0 is in active
state of programming or erase and bank1 is in
standby.
4) Both bank0 and bank1 are in active state
(impossible to perform simultaneous read from
both banks). In this case bank0 and bank1
perform independent operation, for example,
after input Erase command to bank0 erase or
program command to bank1 is succeeded,
bank0 and bank1 perform each operation
concurrently.
SmartVoltage technology provides a choice of V
CC
and V
PP
combinations, as shown in Table 1, to
meet system performance and power expectations.
2.7 to 3.6 V V
CC
consumes approximately one-fifth
the power of 5 V V
CC
. But, 5 V V
CC
provides the
highest read performance. V
PP
at 3.3 V and 5 V
eliminates the need for a separate 12 V converter,
while V
PP
= 12 V maximizes block erase and word
write performance. In addition to flexible erase and
program voltages, the dedicated V
PP
pin gives
complete data protection when V
PP
V
PPLK
.
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