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Электронный компонент: U4SB20

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U4SB20
200V 4A
Copyright & Copy;2000 Shindengen Electric Mfg.Co.Ltd
Case : 3S
OUTLINE DIMENSIONS
(Unit : mm)
RATINGS
SHINDENGEN
Switching power supply
Home Appliances, Office Equipment
Telecommunication, Factory Automation
APPLICATION
Thin Single In-Line Package
UL Recognized
(UL File No.E142422)
High IFSM
Applicable to Automatic Insertion
FEATURES
Case : 3S
General Purpose Rectifiers
UL Bridges
Absolute Maximum Ratings (If not specified Tc=25)
Item
Symbol
Conditions
Ratings
Unit
Storage Temperature
Tstg
-40150
Operating Junction Temperature
Tj
150
Maximum Reverse Voltage
V
RM
200
V
Average Rectified Forward Current
I
O
50Hz sine wave, R-load With heatsink Tc=108
4
A
50Hz sine wave, R-load Without heatsink Ta=25
2.3
Peak Surge Forward Current
I
FSM
50Hz sine wave, Non-repetitive 1cycle peak value, Tj=25
120
A
Current Squared Time
I
2
t
1mst10msTj=25
60
A
2
s
Dielectric Strength
Vdis
Terminals to case, AC 1 minute
2
kV
Mounting Torque
TOR
Recommended torque : 0.5Nm
0.8
N
m
Electrical Characteristics (If not specified Tc=25)
Item
Symbol
Conditions
Ratings
Unit
Forward Voltage
V
F
I
F
=2A, Pulse measurement, Rating of per diode
Max.1.05
V
Reverse Current
I
R
V
R
=V
RM
,
Pulse measurement, Rating of per diode
Max.10
A
jc
junction to case With heatsink
Max.5.5
Thermal Resistance
jl
junction to lead Without heatsink
Max.6
/W
ja
junction to ambient Without heatsink
Max.30
Forward Voltage
0.1
1
10
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
U4SBx
Tc=150
C [TYP]
Tc=25
C [TYP]
Pulse measurement per diode
Forward Voltage V
F
[V]
Forward Current I
F
[A]
0
2
4
6
8
10
0
1
2
3
4
5
U4SBx
Forward Power Dissipation
Tj= 150
C
Sine wave
SIN
Average Rectified Forward Current I
O
[A]
Forward Power Dissipation P
F
[W]
0
1
2
3
4
5
6
7
80
90
100
110
120
130
140
150
160
U4SBx
Derating Curve
SIN
Sine wave
R-load
with heatsink
Case Temperature Tc [
C]
Average Rectified Forward Current I
O
[A]
Tc
Tc
Heatsink
0
0.4
0.8
1.2
1.6
2
2.4
2.8
3.2
0
20
40
60
80
100
120
140
160
U4SBx
Derating Curve
SIN
Sine wave
R-load
Free in air
Glass-epoxy substrate
Soldering land 5mm
Ambient Temperature Ta [
C]
Average Rectified Forward Current I
O
[A]
PCB