Semiconductor Group
1
07/96
BUZ 73 L
SIPMOS
Power Transistor
N channel
Enhancement mode
Avalanche-rated
Logic Level
Pin 1
Pin 2
Pin 3
G
D
S
Type
V
DS
I
D
R
DS(on)
Package
Ordering Code
BUZ 73 L
200 V
7 A
0.4
TO-220 AB
C67078-S1328-A2
Maximum Ratings
Parameter
Symbol
Values
Unit
Continuous drain current
T
C
= 28 C
I
D
7
A
Pulsed drain current
T
C
= 25 C
I
Dpuls
28
Avalanche current,limited by
T
jmax
I
AR
7
Avalanche energy,periodic limited by
T
jmax
E
AR
6.5
mJ
Avalanche energy, single pulse
I
D
= 7 A,
V
DD
= 50 V,
R
GS
= 25
L = 3.67 mH, T
j
= 25 C
E
AS
120
Gate source voltage
V
GS
14
V
Gate-source peak voltage,aperiodic
V
gs
20
Power dissipation
T
C
= 25 C
P
tot
40
W
Operating temperature
T
j
-55 ... + 150
C
Storage temperature
T
stg
-55 ... + 150
Thermal resistance, chip case
R
thJC
3.1
K/W
Thermal resistance, chip to ambient
R
thJA
75
DIN humidity category, DIN 40 040
E
IEC climatic category, DIN IEC 68-1
55 / 150 / 56
Semiconductor Group
2
07/96
BUZ 73 L
Electrical Characteristics, at
T
j
= 25C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
Static Characteristics
Drain- source breakdown voltage
V
GS
= 0 V,
I
D
= 0.25 mA,
T
j
= 25 C
V
(BR)DSS
200
-
-
V
Gate threshold voltage
V
GS=
V
DS,
I
D
= 1 mA
V
GS(th)
1.2
1.6
2
Zero gate voltage drain current
V
DS
= 200 V,
V
GS
= 0 V,
T
j
= 25 C
V
DS
= 200 V,
V
GS
= 0 V,
T
j
= 125 C
I
DSS
-
-
10
0.1
100
1
A
Gate-source leakage current
V
GS
= 20 V,
V
DS
= 0 V
I
GSS
-
10
100
nA
Drain-Source on-resistance
V
GS
= 5 V,
I
D
= 3.5 A
R
DS(on)
-
0.3
0.4
Semiconductor Group
3
07/96
BUZ 73 L
Electrical Characteristics, at
T
j
= 25C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
Dynamic Characteristics
Transconductance
V
DS
2
*
I
D *
R
DS(on)max,
I
D
= 3.5 A
g
fs
5
6.5
-
S
Input capacitance
V
GS
= 0 V,
V
DS
= 25 V,
f = 1 MHz
C
iss
-
630
840
pF
Output capacitance
V
GS
= 0 V,
V
DS
= 25 V,
f = 1 MHz
C
oss
-
120
200
Reverse transfer capacitance
V
GS
= 0 V,
V
DS
= 25 V,
f = 1 MHz
C
rss
-
60
90
Turn-on delay time
V
DD
= 30 V,
V
GS
= 5 V,
I
D
= 3 A
R
GS
= 50
t
d(on)
-
15
20
ns
Rise time
V
DD
= 30 V,
V
GS
= 5 V,
I
D
= 3 A
R
GS
= 50
t
r
-
60
90
Turn-off delay time
V
DD
= 30 V,
V
GS
= 5 V,
I
D
= 3 A
R
GS
= 50
t
d(off)
-
100
130
Fall time
V
DD
= 30 V,
V
GS
= 5 V,
I
D
= 3 A
R
GS
= 50
t
f
-
40
50
Semiconductor Group
4
07/96
BUZ 73 L
Electrical Characteristics, at
T
j
= 25C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
Reverse Diode
Inverse diode continuous forward current
T
C
= 25 C
I
S
-
-
7
A
Inverse diode direct current,pulsed
T
C
= 25 C
I
SM
-
-
28
Inverse diode forward voltage
V
GS
= 0 V,
I
F
= 14 A
V
SD
-
1.1
1.7
V
Reverse recovery time
V
R
= 100 V,
I
F=
l
S,
d
i
F
/d
t = 100 A/s
t
rr
-
140
-
ns
Reverse recovery charge
V
R
= 100 V,
I
F=
l
S,
d
i
F
/d
t = 100 A/s
Q
rr
-
0.7
-
C
Semiconductor Group
5
07/96
BUZ 73 L
Power dissipation
P
tot
=
(
T
C
)
0
20
40
60
80
100
120
C
160
T
C
0
5
10
15
20
25
30
35
W
45
P
tot
Drain current
I
D
=
(
T
C
)
parameter:
V
GS
5 V
0
20
40
60
80
100
120
C
160
T
C
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
6.5
A
7.5
I
D
Safe operating area
I
D
=
(
V
DS
)
parameter:
D = 0.01, T
C
= 25C
-1
10
0
10
1
10
2
10
A
I
D
10
0
10
1
10
2
V
V
DS
R
DS(on)
=
V
DS
/
I
D
DC
10 ms
1 ms
100 s
t
p = 15.0s
Transient thermal impedance
Z
th JC
=
(
t
p
)
parameter:
D = t
p
/
T
-3
10
-2
10
-1
10
0
10
1
10
K/W
Z
thJC
10
-7
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
s
t
p
single pulse
0.01
0.02
0.05
0.10
0.20
D = 0.50
Semiconductor Group
6
07/96
BUZ 73 L
Typ. output characteristics
I
D
=
(
V
DS
)
parameter:
t
p
= 80 s
0
2
4
6
8
V
12
V
DS
0
2
4
6
8
10
12
A
16
I
D
V
GS
[V]
a
a
2.0
b
b
2.5
c
c
3.0
d
d
3.5
e
e
4.0
f
f
4.5
g
g
5.0
h
h
5.5
i
i
6.0
j
j
7.0
k
k
8.0
l
P
tot
= 40W
l
10.0
Typ. drain-source on-resistance
R
DS (on)
=
(
I
D
)
parameter:
V
GS
0
2
4
6
8
10
A
13
I
D
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.3
R
DS (on)
V
GS
[V] =
a
2.0
V
GS
[V] =
a
a
2.5
b
b
3.0
c
c
3.5
d
d
4.0
e
e
4.5
f
f
5.0
g
g
5.5
h
h
6.0
i
i
7.0
j
j
8.0
k
k
10.0
Typ. transfer characteristics
I
D
=
f (V
GS
)
parameter:
t
p
= 80 s
V
DS
2 x
I
D
x
R
DS(on)max
0
1
2
3
4
5
6
7
8
V
10
V
GS
0
2
4
6
8
10
12
14
A
18
I
D
Typ. forward transconductance
g
fs
=
f
(
I
D
)
parameter:
t
p
= 80 s,
V
DS
2 x
I
D
x R
DS(on)max
0
2
4
6
8
10
12
A
15
I
D
0
1
2
3
4
5
6
7
8
9
10
S
12
g
fs
7
07/96
Semiconductor Group
BUZ 73 L
Drain-source on-resistance
R
DS (on)
=
(
T
j
)
parameter:
I
D
= 3.5 A,
V
GS
= 5 V
-60
-20
20
60
100
C
160
T
j
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.3
R
DS (on)
typ
98%
Gate threshold voltage
V
GS (th)
=
(
T
j
)
parameter:
V
GS
=
V
DS
,
I
D
= 1 mA
0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
3.6
4.0
V
4.6
V
GS(th)
-60
-20
20
60
100
C
160
T
j
2%
typ
98%
Typ. capacitances
C = f (V
DS
)
parameter:
V
GS
= 0V,
f = 1MHz
0
5
10
15
20
25
30
V
40
V
DS
1
10
2
10
3
10
4
10
pF
C
C
iss
C
oss
C
rss
Forward characteristics of reverse diode
I
F
=
(
V
SD
)
parameter:
T
j
, t
p
= 80 s
-1
10
0
10
1
10
2
10
A
I
F
0.0
0.4
0.8
1.2
1.6
2.0
2.4
V
3.0
V
SD
T
j
= 25 C typ
T
j
= 25 C (98%)
T
j
= 150 C typ
T
j
= 150 C (98%)
Semiconductor Group
8
07/96
BUZ 73 L
Avalanche energy
E
AS
=
(
T
j
)
parameter:
I
D
= 7 A,
V
DD
= 50 V
R
GS
= 25
,
L = 3.67 mH
20
40
60
80
100
120
C
160
T
j
0
10
20
30
40
50
60
70
80
90
100
110
mJ
130
E
AS
Typ. gate charge
V
GS
=
(
Q
Gate
)
parameter:
I
D puls
= 63 A
0
10
20
30
40
50
60
70
80
nC 100
Q
Gate
0
2
4
6
8
10
12
V
16
V
GS
DS max
V
0,8
DS max
V
0,2
Drain-source breakdown voltage
V
(BR)DSS
=
(
T
j
)
-60
-20
20
60
100
C
160
T
j
180
185
190
195
200
205
210
215
220
225
230
V
240
V
(BR)DSS
Semiconductor Group
9
07/96
BUZ 73 L
Package Outlines
TO-220 AB
Dimension in mm
PDF 
ZIP