Semiconductor Group
1
1998-10-01
4 194 304 words by 4-bit organization
0 to 70
C operating temperature
Fast Page Mode operation
Performance:
Power Dissipation, Refresh & Addressing:
Read, write, read-modify-write, CAS-before-RAS refresh, RAS-only refresh, hidden refresh
and test mode
All inputs, outputs and clocks fully TTL (5 V versions) and LV-TTL (3.3 V version)-compatible
Plastic Package: P-SOJ-26/24-1
300 mil
P-TSOPII-26/24-1 300 mil
-50
-60
t
RAC
RAS access time
50
60
ns
t
CAC
CAS access time
13
15
ns
t
AA
Access time from address
25
30
ns
t
RC
Read/Write cycle time
84
104 ns
t
PC
Fast page mode cycle time
35
40
ns
HYB 5116400
HYB 3116400
HYB 5117400
HYB 3117400
-50
-60
-50
-60
-50
-60
-50
-60
Power Supply
5 V
10%
3.3 V
0.3 V
5 V
10%
3.3 V
0.3 V
Addressing
12/10
12/10
11/11
11/11
Refresh
4096 cycles / 64 ms
2048 cycles / 32 ms
Active
275
220
180
144
440
385
288
252
mW
TTL Standby
11
7.2
11
7.2
mW
CMOS Standby
5.5
3.6
5.5
3.6
mW
4M
4-Bit Dynamic RAM
2k & 4k Refresh
(Fast Page Mode)
Advanced Information
HYB 5116400BJ-50/-60
HYB 5117400BJ-50/-60
HYB 3116400BJ/BT-50/-60
HYB 3117400BJ-50/-60
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
2
1998-10-01
The HYB 5(3)116(7)400 are 16 MBit dynamic RAMs based on die revisions "G" & "F" and organized
as 4 194 304 words by 4-bits. The HYB 5(3)116(7)400BJ/BT utilizes a submicron CMOS silicon
gate process technology, as well as advanced circuit techniques to provide wide operating margins,
both internally and for the system user. Multiplexed address inputs permit the HYB 5(3)116(7)400
to be packaged in a standard SOJ-26/24 and TSOPII-26/24 plastic package with 300 mil width.
These packages provide high system bit densities and are compatible with commonly used
automatic testing and insertion equipment.
Ordering Information
Type
Ordering Code
Package
Descriptions
2k-Refresh Versions
HYB 5117400BJ-50
Q67100-Q1086
P-SOJ-26/24-1 300 mil
5 V 50 ns FPM-DRAM
HYB 5117400BJ-60
Q67100-Q1087
P-SOJ-26/24-1 300 mil
5 V 60 ns FPM-DRAM
HYB 3117400BJ-50
on request
P-SOJ-26/24-1 300 mil
3.3 V 50 ns FPM-DRAM
HYB 3117400BJ-60
on request
P-SOJ-26/24-1 300 mil
3.3 V 60 ns FPM-DRAM
4k-Refresh Versions
HYB 5116400BJ-50
Q67100-Q1049
P-SOJ-26/24-1 300 mil
5 V 50 ns FPM-DRAM
HYB 5116400BJ-60
Q67100-Q1050
P-SOJ-26/24-1 300 mil
5 V 60 ns FPM-DRAM
HYB 3116400BJ-50
on request
P-SOJ-26/24-1 300 mil
3.3 V 50 ns FPM-DRAM
HYB 3116400BJ-60
on request
P-SOJ-26/24-1 300 mil
3.3 V 60 ns FPM-DRAM
HYB 3116400BT-50
on request
P-TSOPII-26/24-1 300 mil
3.3 V 50 ns FPM-DRAM
HYB 3116400BT-60
on request
P-TSOPII-26/24-1 300 mil
3.3 V 60 ns FPM-DRAM
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
3
1998-10-01
Pin Configuration
Pin Names
HYB 5(3)116400
4k-Refresh
HYB 5(3)117400
2k-Refresh
Row Address Inputs
A0 - A11
A0 - A10
Column Address Inputs
A0 - A9
A0 - A10
Row Address Strobe
RAS
Column Address Strobe
CAS
Output Enable
OE
Data Input/Output
I/O1 - I/O4
Read/Write Input
WE
Power Supply
V
CC
Ground (0 V)
V
SS
Not Connected
N.C.
P-SOJ-26/24-1 300 mil
P-TSOPII-26/24-1 300 mil
CC
V
A0
9
10
12
11
2
3
4
5
1
13
14
26
18
17
16
15
22
23
24
25
SPP03454
6
8
19
21
A10
SS
V
A4
I/O3
I/O4
CAS
OE
SS
V
I/O1
A11 / N.C.
RAS
WE
V
CC
I/O2
A1
A2
A3
A5
A6
A7
A8
A9
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
4
1998-10-01
Block Diagram for HYB 5(3)116400 (4k-refresh)
SPB03455
&
No.2 Clock
Generator
Address
Column
Buffers (10)
Controller
Refresh
Refresh
Counter (12)
Buffers (12)
Row
Address
Generator
No.1 Clock
12
10
A0
A1
A2
A3
A4
A5
A6
A7
A8
12
Row
Decoder
RAS
4096 x 1024 x 4
Memory Array
4096
1024
x 4
Sense Amplifier
I/O Gating
10
Column
Decoder
Buffer
Data IN
Data OUT
Buffer
I/O1
4
4
OE
Voltage Down
V
CC
V
CC
12
4
A9
(internal)
Generator
CAS
WE
A10
I/O2 I/O3 I/O4
A11
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
5
1998-10-01
Block Diagram for HYB 5(3)117400 (2k-refresh)
Data In
Buffer
Data Out
Buffer
I/O1 I/O2
I/O4
OE
Column
Decoder
Sense Amplifier
I/O Gating
&
No.2 Clock
Generator
Column
Address
Buffers (11)
Refresh
Controller
Refresh
Counter (11)
Buffers (11)
Address
Row
No.1 Clock
Generator
11
Memory Array
Decoder
Row
2048
.
.
.
.
.
.
2048
. .
.
.. .
4
4
4
11
11
WE
CAS
RAS
11
2048
2048
x
4
x
x 4
I/O3
(internal)
V
Generator
Voltage Down
CC
CC
V
SPB02823
11
A10
A9
A8
A7
A6
A5
A4
A3
A2
A1
A0
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
6
1998-10-01
Absolute Maximum Ratings
Operating temperature range ........................................................................................... 0 to 70
C
Storage temperature range........................................................................................ 55 to 150
C
Input/output voltage (5 V versions) ................................................... 0.5 to min (
V
CC
+ 0.5, 7.0) V
Input/output voltage (3.3 V versions) ................................................ 0.5 to min (
V
CC
+ 0.5, 4.6) V
Power supply voltage (5 V versions) ....................................................................... 1.0 V to 7.0 V
Power supply voltage (3.3 V versions) .................................................................... 1.0 V to 4.6 V
Power dissipation( 5 V versions) ............................................................................................. 1.0 W
Power dissipation (3.3 V versions) .......................................................................................... 0.5 W
Data out current (short circuit) ................................................................................................ 50 mA
Note: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent
damage of the device. Exposure to absolute maximum rating conditions for extended periods
may affect device reliability.
DC Characteristics
T
A
= 0 to 70
C,
V
SS
= 0 V,
t
T
= 2 ns
Parameter
Symbol
Limit Values
Unit Test
Condition
min.
max.
5 V Versions
Power supply voltage
V
CC
4.5
5.5
V
Input high voltage
V
IH
2.4
V
CC
+ 0.5 V
1
Input low voltage
V
IL
0.5
0.8
V
1
Output high voltage (
I
OUT
= 5 mA)
V
OH
2.4
V
1
Output low voltage (
I
OUT
= 4.2 mA)
V
OL
0.4
V
1
3.3 V Versions
Power supply voltage
V
CC
3.0
3.6
V
Input high voltage
V
IH
2.0
V
CC
+ 0.5 V
1
Input low voltage
V
IL
0.5
0.8
V
1
TTL Output high voltage (
I
OUT
= 2 mA)
V
OH
2.4
V
1
TTL Output low voltage (
I
OUT
= 2 mA)
V
OL
0.4
V
1
CMOS Output high voltage (
I
OUT
= 100
A)
V
OH
V
CC
0.2
V
CMOS Output low voltage (
I
OUT
= 100
A)
V
OL
0.2
V
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
7
1998-10-01
DC Characteristics (cont'd)
T
A
= 0 to 70
C,
V
SS
= 0 V,
t
T
= 2 ns
Parameter
Symbol
Limit Values
Unit
Notes
min.
max.
2k
4k
Common Parameters
Input leakage current
(0 V
V
IH
V
CC
+ 0.3 V, all other pins = 0 V)
I
I(L)
10
10
A
1
Output leakage current
(DO is disabled, 0 V
V
OUT
V
CC
+ 0.3 V)
I
O(L)
10
10
A
1
Average
V
CC
supply current
-50 ns version
-60 ns version
(RAS, CAS, address cycling:
t
RC
=
t
RC MIN.
)
I
CC1
80
70
50
40
mA
mA
2, 3, 4
2, 3, 4
Standby
V
CC
supply current (RAS = CAS =
V
IH
)
I
CC2
2
mA
Average
V
CC
supply current, during RAS-only refresh
cycles
-50 ns version
-60 ns version
(RAS cycling, CAS =
V
IH
,
t
RC
=
t
RC MIN.
)
I
CC3
80
70
50
40
mA
mA
2, 4
2, 4
Average
V
CC
supply current,during fast page mode
-50 ns version
-60 ns version
(RAS =
V
IL
, CAS, address cycling:
t
PC
=
t
PC MIN.
)
I
CC4
25
20
mA
mA
2, 3, 4
2, 3, 4
Standby
V
CC
supply current
(RAS = CAS =
V
CC
0.2 V)
I
CC5
1
mA
1
Average
V
CC
supply current, during CAS-before-RAS
refresh mode
-50 ns version
-60 ns version
(RAS, CAS cycling:
t
RC
=
t
RC MIN.
)
I
CC6
80
70
50
40
mA
mA
2, 4
2, 4
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
8
1998-10-01
Capacitance
T
A
= 0 to 70
C,
f
= 1 MHz
Parameter
Symbol
Limit Values
Unit
min.
max.
Input capacitance (A0 to A11)
C
I1
5
pF
Input capacitance (RAS, CAS, WE, OE)
C
I2
7
pF
I/O capacitance (I/O1 - I/O4)
C
IO
7
pF
AC Characteristics
5, 6
T
A
= 0 to 70
C,
V
CC
= 5 V
10 % /
V
CC
= 3.3 V
0.3 V,
t
T
= 5 ns
Parameter
Symbol
Limit Values
Unit Note
-50
-60
min.
max. min.
max.
Common Parameters
Random read or write cycle time
t
RC
90
110
ns
RAS precharge time
t
RP
30
40
ns
RAS pulse width
t
RAS
50
10k
60
10k
ns
CAS pulse width
t
CAS
13
10k
15
10k
ns
Row address setup time
t
ASR
0
0
ns
Row address hold time
t
RAH
8
10
ns
Column address setup time
t
ASC
0
0
ns
Column address hold time
t
CAH
10
15
ns
RAS to CAS delay time
t
RCD
18
37
20
45
RAS to column address delay time
t
RAD
13
25
15
30
ns
RAS hold time
t
RSH
13
15
ns
CAS hold time
t
CSH
50
60
ns
CAS to RAS precharge time
t
CRP
5
5
ns
Transition time (rise and fall)
t
T
3
50
3
50
ns
7
Refresh period for 2k refresh version
t
REF
32
32
ms
Refresh period for 4k refresh version
t
REF
64
64
ms
Read Cycle
Access time from RAS
t
RAC
50
60
ns
8, 9
Access time from CAS
t
CAC
13
15
ns
8, 9
Access time from column address
t
AA
25
30
ns
8, 10
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
9
1998-10-01
OE access time
t
OEA
13
15
ns
Column address to RAS lead time
t
RAL
25
30
ns
Read command setup time
t
RCS
0
0
ns
Read command hold time
t
RCH
0
0
ns
11
Read command hold time referenced to RAS
t
RRH
0
0
ns
11
CAS to output in low-Z
t
CLZ
0
0
ns
8
Output buffer turn-off delay
t
OFF
0
13
0
15
ns
12
Output buffer turn-off delay from OE
t
OEZ
0
13
0
15
ns
12
Data to OE low delay
t
DZO
0
0
ns
13
CAS high to data delay
t
CDD
13
15
ns
14
OE high to data delay
t
ODD
13
15
ns
14
Write Cycle
Write command hold time
t
WCH
8
10
ns
Write command pulse width
t
WP
8
10
ns
Write command setup time
t
WCS
0
0
ns
15
Write command to RAS lead time
t
RWL
13
15
ns
Write command to CAS lead time
t
CWL
13
15
ns
Data setup time
t
DS
0
0
ns
16
Data hold time
t
DH
10
10
ns
16
Data to CAS low delay
t
DZC
0
0
ns
13
Read-Modify-Write Cycle
Read-write cycle time
t
RWC
126
150
ns
RAS to WE delay time
t
RWD
68
80
ns
15
CAS to WE delay time
t
CWD
31
35
ns
15
Column address to WE delay time
t
AWD
43
50
ns
15
OE command hold time
t
OEH
13
15
ns
AC Characteristics (cont'd)
5, 6
T
A
= 0 to 70
C,
V
CC
= 5 V
10 % /
V
CC
= 3.3 V
0.3 V,
t
T
= 5 ns
Parameter
Symbol
Limit Values
Unit Note
-50
-60
min.
max. min.
max.
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
10
1998-10-01
Fast Page Mode Cycle
Fast page mode cycle time
t
PC
35
40
ns
CAS precharge time
t
CP
10
10
ns
Access time from CAS precharge
t
CPA
30
35
ns
7
RAS pulse width
t
RAS
50
200k 60
200k ns
CAS precharge to RAS Delay
t
RHPC
30
35
ns
Fast Page Mode Read-Modify-Write Cycle
Fast page mode read-write cycle time
t
PRWC
71
80
ns
CAS precharge to WE
t
CPWD
48
55
ns
CAS-before-RAS Refresh Cycle
CAS setup time
t
CSR
10
10
ns
CAS hold time
t
CHR
10
10
ns
RAS to CAS precharge time
t
RPC
5
5
ns
Write to RAS precharge time
t
WRP
10
10
ns
Write hold time referenced to RAS
t
WRH
10
10
ns
CAS-before-RAS Counter Test Cycle
CAS precharge time
t
CPT
35
40
ns
Test Mode
CAS hold time
t
CHRT
30
30
ns
Write command setup time
t
WTS
10
10
ns
Write command hold time
t
WTH
10
10
ns
RAS hold time in test mode
t
RAHT
30
30
ns
AC Characteristics (cont'd)
5, 6
T
A
= 0 to 70
C,
V
CC
= 5 V
10 % /
V
CC
= 3.3 V
0.3 V,
t
T
= 5 ns
Parameter
Symbol
Limit Values
Unit Note
-50
-60
min.
max. min.
max.
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
11
1998-10-01
Notes
1. All voltages are referenced to
V
SS
.
2.
I
CC1
,
I
CC3
,
I
CC4
and
I
CC6
depend on cycle rate.
3.
I
CC1
and
I
CC4
depend on output loading. Specified values are measured with the output open.
4. Address can be changed once or less while RAS =
V
IL
. In the case of
I
CC4
it can be changed once
or less during a fast page mode cycle (
t
PC
).
5. An initial pause of 200
s is required after power-up followed by 8 RAS cycles of which at least
one cycle has to be a refresh cycle, before proper device operation is achieved. In case of using
internal refresh counter, a minimum of 8 CAS-before-RAS initialization cycles instead of 8 RAS
cycles are required.
6. AC measurements assume
t
T
= 5 ns.
7.
V
IH (MIN.)
and
V
IL (MAX.)
are reference levels for measuring timing of input signals. Transition times
are also measured between
V
IH
and
V
IL
.
8. Measured with a load equivalent to 2 TTL loads and 100 pF.
9. Operation within the
t
RCD (MAX.)
limit ensures that
t
RAC (MAX.)
can be met.
t
RCD (MAX.)
is specified as
a reference point only: If
t
RCD
is greater than the specified
t
RCD (MAX.)
limit, then access time is
controlled by
t
CAC
.
10.Operation within the
t
RAD (MAX.)
limit ensures that
t
RAC (MAX.)
can be met.
t
RAD (MAX.)
is specified as
a reference point only: If
t
RAD
is greater than the specified
t
RAD (MAX.)
limit, then access time is
controlled by
t
AA
.
11.Either
t
RCH
or
t
RRH
must be satisfied for a read cycle.
12.
t
OFF (MAX.)
and
t
OEZ (MAX.)
define the time at which the outputs achieve the open-circuit condition
and are not referenced to output voltage levels.
13.Either
t
DZC
or
t
DZO
must be satisfied.
14.Either
t
CDD
or
t
ODD
must be satisfied.
15.
t
WCS
,
t
RWD
,
t
CWD
,
t
AWD
and
t
CPWD
are not restrictive operating parameters. They are included in the
data sheet as electrical characteristics only. If
t
WCS
>
t
WCS (MIN.)
, the cycle is an early write cycle
and the I/O pin will remain open-circuit (high impedance) through the entire cycle; if
t
RWD
>
t
RWD (MIN.)
,
t
CWD
>
t
CWD (MIN.)
,
t
AWD
>
t
AWD (MIN.)
and
t
CPWD
>
t
CPWD (MIN.)
, the cycle is a read-
write cycle and I/O pins will contain data read from the selected cells. If neither of the above sets
of conditions is satisfied, the condition of the I/O pins (at access time) is indeterminate.
16.These parameters are referenced to the CAS leading edge in early write cycles and to the WE
leading edge in read-write cycles.
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
12
1998-10-01
Read Cycle
SPT03025
"H" or "L"
OEA
CAC
RAL
t
OH
OL
V
(Inputs)
(Outputs)
I/O
I/O
V
IH
V
IL
V
OE
WE
V
IL
V
IH
V
IL
V
IH
RAC
t
Hi
DZO
Z
t
CLZ
t
t
DZC
t
RCS
AA
t
t
V
Address
V
IL
V
IH
IL
CAS
RAS
IL
V
IH
V
V
IH
t
RAD
ASR
t
Row
t
Column
RAH
ASC
t
CAH
t
t
RCD
t
CSH
t
t
RAS
t
t
ODD
RRH
Valid Data OUT
OEZ
t
t
CDD
OFF
t
Hi Z
t
t
RSH
CAS
t
RC
t
RCH
ASR
t
Row
CRP
t
t
RP
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
13
1998-10-01
Write Cycle (Early Write)
SPT03026
"H" or "L"
RWL
RAL
WCS
OH
(Inputs)
(Outputs)
I/O
I/O
IL
V
OL
V
V
V
IH
OE
WE
IH
V
IL
V
V
IL
V
IH
t
Valid
DS
t
DH
Data IN
WCH
t
t
WP
t
V
Address
IH
V
V
IL
IL
CAS
RAS
V
IH
IH
V
V
IL
t
RAD
ASR
t
t
RAH
Row
t
Column
ASC
t
CWL
t
CAH
t
t
RCD
t
CSH
t
t
RAS
t
Z
Hi
t
RC
CAS
RSH
t
ASR
t
Row
CRP
t
t
RP
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
14
1998-10-01
Write Cycle (OE Controlled Write)
SPT03027
"H" or "L"
DS
RAL
CAS
V
OH
V
(Inputs)
(Outputs)
I/O
I/O
V
V
OL
IL
V
IH
OE
WE
V
IL
IL
V
IH
V
IH
t
DZO
Hi Z
t
CLZ
t
OEA
t
OEZ
t
DZC
ODD
t
t
V
Address
IL
V
V
IH
CAS
RAS
V
IL
V
IH
IL
V
IH
RAD
ASR
t
RAH
t
Row
t
t
Column
ASC
t
CAH
RCD
t
t
t
CSH
t
RAS
t
Hi
Valid Data
t
DH
OEH
t
Z
RWL
CWL
t
t
WP
t
RSH
t
ASR
t
Row
CRP
t
t
RC
t
RP
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
15
1998-10-01
Read-Write (Read-Modify-Write) Cycle
SPT03028
"H" or "L"
AWD
OEA
CSH
RWD
OH
I/O
(Outputs) V
OL
(Inputs)
I/O
IL
V
V
V
IH
OE
WE
V
IL
V
IH
V
IL
V
IH
RAC
t
t
DZC
t
DZO
t
CLZ
t
CAC
t
RCS
t
AA
t
V
Address
V
IL
V
IH
CAS
RAS
IH
V
IL
V
V
IL
IH
RAH
Row
ASR
t
t
RAD
t
Column
ASC
t
t
t
CAH
t
RCD
t
t
t
WP
Data
OUT
DS
ODD
OEZ
t
t
t
t
Data IN
Valid
t
DH
OEH
Row
t
CWD
t
CAS
t
t
RSH
RWL
t
t
CWL
ASR
t
CRP
t
RP
t
RWC
t
RAS
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
16
1998-10-01
Fast Page Mode Read Cycle
SPT03029
"H" or "L"
Column
WE
OH
OL
IH
IH
(Outputs)
I/O
V
V
(Inputs)
I/O
V
IL
V
OE
V
IL
V
V
IL
t
CLZ
t
CAC
Data
Valid
OUT
RAC
t
t
DZC
t
DZO
t
OEZ
OFF
t
ODD
t
OEA
AA
t
t
DZC
t
IH
IH
IH
IH
Address
V
V
IL
V
CAS
V
IL
V
RAS
V
IL
V
t
Column
t
t
Row
ASR
RAD
RCS
t
t
ASC
t
RAH
RCD
t
t
t
RCH
ASC
PC
CAH
CSH
t
t
CAS
t
CP
t
t
OUT
OFF
t
t
CLZ
t
CAC
Valid
Data OUT
CLZ
t
CAC
Data
Valid
t
DZO
OEZ
t
OFF
t
ODD
t
AA
t
CPA
t
OEA
t
DZC
t
t
DZO
t
OEZ
t
t
ODD
OEA
AA
t
CPA
t
t
CDD
t
t
RCS
ASC
Column
RCS
t
t
t
CAH
t
CAS
t
t
RRH
CAH
t
RHCP
t
t
t
RSH
CAS
CRP
RASP
RP
t
t
t
RCH
Row
ASR
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
17
1998-10-01
Fast Page Mode Early Write Cycle
SPT03030
"H" or "L"
Data IN
ASC
Column
WCS
t
t
WCS
IL
IH
IL
IH
OH
IH
IL
(Outputs) V
OE
I/O
(Inputs)
I/O
V
V
V
V
WE
V
V
V
Data IN
DS
t
Valid
DH
t
DS
t
WCH
WP
t
t
IH
IL
IL
IH
IH
IL
Address
V
V
RAS
CAS
V
V
V
V
Column
Row
ASR
t
RAD
t
ASC
RAH
t
t
t
RCD
CWL
t
CAH
t
t
PC
t
CAS
t
CP
t
t
t
WCS
Valid
Hi Z
DH
t
t
DS
WCH
WP
t
t
Valid
Data IN
DH
t
WCH
WP
t
t
ASR
CRP
RASP
ASC
Column
t
CWL
CAH
t
t
t
CAS
t
RWL
CWL
t
RAL
CAH
t
t
t
t
RSH
CAS
t
t
t
RP
Row
OL
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
18
1998-10-01
Fast Page Mode Late Write and Read-Modify Write Cycle
SPT03031
"H" or "L"
IL
Data
RAC
(Outputs)
I/O
V
OH
OL
V
OUT
Data
OEZ
t
I/O
(Inputs)
OE
CLZ
t
V
IL
V
IH
DZC
t
t
CAC
t
DS
DZO
t
ODD
t
V
IL
IH
V
t
AWD
t
AA
t
OEA
t
t
OEH
AA
DS
AA
OUT
Data
t
OUT
Data
OEZ
OEZ
t
ODD
IN
DH
t
t
CPA
t
DZC
t
t
IN
Data
DH
t
t
t
CAC
t
DZC
t
t
CPA
OEH
CLZ
t
WP
t
t
OEA
t
AWD
t
CLZ
t
WP
t
OEA
t
AWD
t
IN
Data
DS
t
DH
t
ODD
t
WP
t
OEH
t
Address
WE
CAS
V
RCS
V
V
IH
t
Row
V
IL
IH
t
CWD
t
CWL
RWD
t
Column
IL
V
ASR
t
t
RAH
ASC
t
RAD
t
IH
V
RCD
t
t
CAH
CAS
t
RAS
IL
V
V
IH
t
CSH
CWD
CWL
t
CWD
t
Column
CPWD
t
t
t
CPWD
Column
PRWC
ASC
t
CAH
t
t
CP
CAS
t
t
ASC
t
t
CAH
CWL
t
RWL
t
Row
CRP
t
RAL
RSH
CAS
t
t
t
ASR
t
RAS
t
t
RP
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
19
1998-10-01
RAS-only Refresh Cycle
SPT03032
"H" or "L"
OH
OL
(Outputs)
Address
I/O
V
V
V
IL
IH
V
Row
CAS
RAS
IL
V
V
IH
V
IL
IH
V
RAH
ASR
t
t
RAS
t
Row
Z
Hi
t
RC
t
RPC
ASR
t
CRP
t
RP
t
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
20
1998-10-01
CAS-before-RAS Refresh Cycle
SPT03033
"H" or "L"
V
IL
IH
IH
IL
OL
OH
IL
(Outputs)
I/O
V
V
(Inputs)
OE
I/O
V
V
V
V
t
OFF
OEZ
t
t
CDD
ODD
t
IH
IL
IH
IH
IL
WE
CAS
V
V
V
RAS
V
V
WRP
CSR
t
t
CP
t
RPC
t
RP
t
t
WRH
t
CHR
Hi Z
RAS
t
RC
t
t
RPC
t
RP
t
CRP
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
21
1998-10-01
Hidden Refresh Cycle (Read) Cycle
V
CLZ
I/O
(Outputs)
OL
V
"H" or "L"
OH
V
I/O
(Inputs)
IL
V
IH
V
t
RAC
t
DZO
t
OE
V
IL
IH
V
WE
IL
IH
V
DZC
t
Valid Data OUT
SPT03034
t
CAC
OEA
AA
t
t
OFF
OEZ
t
t
Hi
t
ODD
Z
CDD
t
Column
RAS
ASR
V
Address
IL
IH
V
t
RCS
t
Row
RAH
ASC
t
t
CAS
IL
V
IH
V
RAS
IL
V
IH
V
t
RCD
RAD
t
t
WRP
t
RRH
CAH
t
t
WRH
t
t
RSH
t
CHR
RAS
t
ASR
t
Row
CRP
t
RC
t
t
RP
RC
t
RP
t
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
22
1998-10-01
Hidden Refresh Early Write Cycle
SPT03035
"H" or "L"
WRP
Column
Row
Address
(Output)
(Input)
I/O
I/O
OL
V
OH
V
IN
V
V
IL
WE
IL
V
IH
V
V
IL
Valid Data
t
DS
t
WCS
t
DH
WP
t
WCH
t
t
ASR
V
CAS
IH
V
t
IL
IH
V
RAS
V
IL
IH
V
RAS
ASC
RAH
t
t
t
RAD
RCD
t
t
CAH
t
RSH
t
RC
t
RP
t
Row
Hi Z
t
WRH
RC
t
RAS
CHR
t
t
ASR
t
CRP
t
RP
t
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
23
1998-10-01
CAS-before-RAS Refresh Counter Test Cycle
SPT03036
"H" or "L"
t
WCH
t
t
DZC
t
(Inputs)
I/O
(Outputs)
I/O
OH
OL
V
IL
V
V
IH
V
OE
WE
Write Cycle
IL
IL
V
IH
V
V
IH
V
I/O
(Inputs)
I/O
(Outputs)
OL
V
OH
V
IL
V
IH
V
t
DS
Z
Hi
Data IN
t
WRP
WRH
t
DH
t
t
DZO
WCS
t
t
t
CLZ
OE
WE
IL
V
IH
V
IL
V
IH
V
Address
CAS
IH
IL
V
V
V
IL
IH
V
Read Cycle
RAS
V
IH
IL
V
WRP
t
WRH
t
t
RCS
AA
t
CAC
t
ASC
t
t
CAH
Column
CSR
t
CHR
t
CP
t
RAS
t
RWL
CWL
t
Data OUT
t
OEZ
t
OFF
t
ODD
OEA
t
RRH
RAL
CAS
t
CDD
t
RCH
t
t
ASR
Row
RSH
t
t
RP
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
24
1998-10-01
Test Mode Entry
SPT03042
"H" or "L"
OL
OH
I/O
(Inputs)
(Outputs)
I/O
V
V
V
IL
OE
WE
V
IH
V
IH
V
IL
V
IL
V
IH
OFF
t
OEZ
t
CDD
t
Hi Z
ODD
t
CAS
Address
IH
V
V
IL
V
IL
RAS
V
IH
V
IH
V
IL
RPC
t
t
CP
t
RP
RAH
WTS
t
Row
ASR
t
t
t
WTH
CSR
t
t
CHR
Hi Z
t
RC
RAS
t
t
RPC
CRP
t
t
RP
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
25
1998-10-01
Package Outlines
0.8 min
-0.25
8.63
0.2
6.8
-0.5
3.75
0.1
2.64
1.27
0.85 max
-0.1
0.51
Index Marking
-0.25
17.27
26
1
1)
0.1
0.5
30
7.75
-0.25
0.2
+0.1
21
6
19
8
14
13
0.18
24x
15.24
A
0.25
B
0.18
B
0.25
B
A
1) Does not include plastic or metal protrusions of 0.15 max per side
M
1)
M
Plastic Package P-SOJ-26/24-1 (SMD) (300mil)
(Plastic small outline J-leaded)
GPJ05628
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book "Package Information".
Dimensions in mm
SMD = Surface Mounted Device
HYB 5116(7)400BJ-50/-60
HYB 3116(7)400BJ/BT-50/-60
4M
4 DRAM
Semiconductor Group
26
1998-10-01
GPX05857
17.14
0.13
1)
26
Index Marking
1.27
0.4
+0.12
-0.1
0.2
M
24x
0.1
1.2 max
0.1
7.62
0.13
0.2
9.22
-0.2
0.6
0.15
+0.06 -0.03
5 max
2119
14
1
6 8
13
0.05
1
0.05
Does not include plastic or metal protrusion of 0.15 max per side
1)
Plastic Package P-TSOPII-26/24-1 (400 mil) (SMD)
(Plastic Thin Small Outline Package (Type II))
Sorts of Packing
Package outlines for tubes, trays etc. are contained in our
Data Book "Package Information".
Dimensions in mm
SMD = Surface Mounted Device
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ZIP