ST
Sitronix
ST7541
4 Gray Scale
Dot Matrix LCD Controller/Driver
Ver 1.1
1/82 2003/12/17
INTRODUCTION
The ST7541 is a driver & controller LSI for 4-level gray scale graphic dot-matrix liquid crystal display systems. This chip is
connected directly to a microprocessor, accepts Serial Peripheral Interface (SPI),IIC or 8-bit parallel display data and
stores in an on-chip display data RAM of 128 x 129 x 2 bits. It performs display data RAM read/write operation with no
external operating clock to minimize power consumption. In addition, because it contains power supply circuits necessary
to drive liquid crystal, it is possible to make a display system with the fewest components.
FEATURES
4-level (White, Light Gray, Dark Gray, Dark) Gray Scale Display with PWM and FRC Methods
DDRAM data [ 2n : 2n+1 ]
2n
2n + 1
Gray Scale
0 0
White
0 1
Light
gray
1 0
Dark
gray
1 1
Dark
(Accessible column address, n = 0, 1, 2, ......, 125, 126, 127)
Driver Output Circuits
128 segment outputs / 128+1 common outputs
Applicable Duty Ratios
- Various partial display
- Partial window moving & data scrolling
On-chip Display Data RAM
- Capacity: 128 129 2= 33,024
bits
Microprocessor Interface
- 8-bit parallel bi-directional interface with 6800-series or
8080-series
- 4-line serial interface (4-line-SIF)
- 3-line serial interface (3-line-SIF)
- IIC serial interface
On-chip Low Power Analog Circuit
- On-chip oscillator circuit
- Voltage converter (x3, x4, x5 or x6)
- Voltage regulator (temperature coefficient: -0.125%/C,
or external input)
- On-chip electronic contrast control function
(64 steps X 8)
- Voltage follower (LCD bias : 1/5 to 1/12)
Operating Voltage Range
- Supply voltage (VDD): 1.8 to 3.3V
- LCD driving voltage (VLCD = V0 - VSS): 4.0 to 15.0 V
Package Type
- Application for COG
ST7541
6800 , 8080 ,
4-Line , 3-Line interface
(without IIC interface)
ST7541i IIC
interface
ST7541
Ver 1.1
2/82 2003/12/17
ST7541 Pad Arrangement (COG)
Chip Size: 12,575 um 1,220 um
Bump Pitch:
PAD NO 1 ~ 229, 353 ~ 385: 55 um (COM/SEG), PAD NO 230 ~ 352: 75 um (I/O) [ PAD 338 339 : 81um]
PAD NO 229 ~ 230: 84 um, PAD NO 352 ~ 353: 913 um
Bump Size:
PAD NO 1 ~ 196, 218 ~ 229, 353 ~ 364 : 35(x) um 96(y) um PAD NO 197 ~ 217, 365 ~ 385 : 96(x) um 35(y) um
PAD NO 230 ~ 352 : 55(x)um 60(y) um
Bump Height: 18 um (Typ)
Chip Thickness: 635 um
Y
X
(0,0)
1
(5968,-291) unit:um
196
197
217
218
364
365
385
353
352
229 230
30
60
30
45
30
15
75
15
Metal area
Bump area
30
45
75
15
60
30
30
15
30
45
75
15
60
30
30
15
(5968,247) unit:um
unit: um
(-5764.8,595)
unit:um
(-4767,-372)
75
60
30
15
15
30
(4415,260) unit:um
60
70
30
15
15
30
20
6
108
6
6
6
47
35
96
PAD NO 1~196
PAD NO 218~229
PAD NO 353~364
PAD NO 230~352
PAD NO 197~217
PAD NO 365~385
6
47
6
6
6
108
96
35
6
72
6
6
6
67
55
60
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