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Электронный компонент: SC00180710

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Skyworks Solutions, Inc. [978] 241-7000
Fax [978] 241-7906 Email sales@skyworksinc.com www.skyworksinc.com
1
Specifications subject to change without notice. 10/02A
MIS Chip Capacitors
SC Series
Description
Alpha's MIS Chip Capacitors are available in a wide range
of sizes and capacitance values. They are frequently used
in applications requiring DC blocking, and RF bypassing,
or as a fixed capacitance tuning element in filters,
oscillators, and matching networks. The devices have a
dielectric composed of thermally grown silicon dioxide over
which a layer of silicon nitride is deposited. This dielectric
possesses a low temperature coefficient of capacitance,
very high insulation resistance. The devices also exhibit
excellent long term stability making them suitable for high
reliability applications. The capacitors have a high
dielectric breakdown which permits the use of thin
dielectrics resulting in larger capacitance per unit area than
our previous catalog offerings. The temperature coefficient
is less that 50 ppm/C, and operation is suitable from
-65C to 200C. Compared to ceramic capacitors,
Skyworks' MIS chip capacitors offer higher Q, and a lower
insertion loss of 0.04 dB, in a 50
system. Insulation
resistance is greater than 10
5
M
.To accommodate high
volume automated assembly methods, wafers can be
supplied on expanded film frame. To reduce cost, chips
can be supplied with only sample testing packaged in vials.
Packaging in waffle packs with 100% electrical test and
visual inspection is always available if required.
Features
Readily Available From Stock
High Reliability Silicon OxideNitride
Dielectric
Low Loss -- Typically 0.04 dB in a 50
System
Operation through 26 GHz
Wide Temperature Operation
Characteristic
Value
Operating Temp Range (T
OP
)
-65 to +200C
Storage Temp Range (T
STG
)
-65 to +200C
Dielectric Withstanding Voltage
100 V
Absolute Maximum Ratings
Electrical Specifications
Capacitance Range
1:
0.8 to 1000 pF
Temperature Coefficient: 50 ppm/C Typical
Capacitance Tolerance
2:
20%
Operating Temperature: -65C to 200C
Dielectric Withstanding Voltage: 100 V
Insulation Resistance: 10
5
Megohms Typical
Leakage Current: Typ. < 1 nA
BIAS
BIAS
OUTPUT
INPUT 1
INPUT 2
C
1
D
1
D
2
C
2
C
4
C
3
Typical SPDT Switch
C
2
, C
3
-- Chip MIS Capacitor
C
1
, C
4
-- Chip or Beam -- Lead MIS Capacitor
D
1
, D
2
DSG6474 Beam -- Lead PIN Diode
MIS Chip Capacitors
SC Series
2
Skyworks Solutions, Inc. [978] 241-7000
Fax [978] 241-7906 Email sales@skyworksinc.com www.skyworksinc.com
Specifications subject to change without notice. 10/02A
ZZ
0.001
YY
0.001
0.005
0.001
CHIP THICKNESS
Insertion Loss (dB)
Frequency (GHz)
Figure 1. Typical Insertion
Loss vs. Frequency (50
System)
2
6
10
14
18
10.0
1.0
0.10
0.01
1 pF
8.2 pF
47 pF
100 pF
147 pF
100 pF
Electrical Specifications
Performance Data
Tests on typical MIS capacitors at L and S band show
insertion loss to be 1/2 to 1/3 that of equivalent ceramic
type capacitors, without any of the associated resonance
problems. Power tests indicate that the only limitation is
the actual breakdown voltage of the device (see data
section). A typical insertion loss versus frequency graph
is shown in Figure 1. This data is taken from an actual tests
circuit with series mounted beam-lead or chip capacitors
on a 50
microstrip transmission line. The apparent
higher loss at lower frequencies on the lower capacitance
units is strictly due to the capacitive reactance of the
capacitor.
Capacitance
Chip Dimensions
Part Number
(+ 20%)
(+ 1 mil)
SC00080710
0.8
7 mil Pad/10 mil Chip
SC00080912
0.8
9 mil Pad/12 mil Chip
SC00120710
1.2
7 mil Pad/10 mil Chip
SC00120912
1.2
9 mil Pad/12 mil Chip
SC00180710
1.8
7 mil Pad/10 mil Chip
SC00180912
1.8
9 mil Pad/12 mil Chip
SC00260710
2.6
7 mil Pad/10 mil Chip
SC00260912
2.6
9 mil Pad/12 mil Chip
SC00380710
3.8
7 mil Pad/10 mil Chip
SC00380912
3.8
9 mil Pad/12 mil Chip
SC00560710
5.6
7 mil Pad/10 mil Chip
SC00560912
5.6
9 mil Pad/12 mil Chip
SC00680710
6.8
7 mil Pad/10 mil Chip
SC00680912
6.8
9 mil Pad/12 mil Chip
SC00820710
8.2
7 mil Pad/10 mil Chip
SC00820912
8.2
9 mil Pad/12 mil Chip
SC00821518
8.2
15 mil Pad/18 mil Chip
SC01000710
10
7 mil Pad/10 mil Chip
SC01000912
10
9 mil Pad/12 mil Chip
SC01001518
10
15 mil Pad/18 mil Chip
SC01500710
15
7 mil Pad/10 mil Chip
SC01500912
15
9 mil Pad/12 mil Chip
SC01501518
15
15 mil Pad/18 mil Chip
SC02200912
22
9 mil Pad/12 mil Chip
SC02201518
22
15 mil Pad/18 mil Chip
SC03301518
33
15 mil Pad/18 mil Chip
SC04701518
47
15 mil Pad/18 mil Chip
SC06801518
68
15 mil Pad/18 mil Chip
SC10002430
100
24 mil Pad/30 mil Chip
SC10003440
100
34 mil Pad/40 mil Chip
SC22203440
222
34 mil Pad/40 mil Chip
SC33303440
333
34 mil Pad/40 mil Chip
SC50004450
500
44 mil Pad/50 mil Chip
SC99906068
1000
60 mil Pad/68 mil Chip
Example
Part Number Structure -- SCXXXXYYZZ
where:
SC = Silicon Capacitor
XXXX = Capacitance (pF)
YY = Square Contact Size (mils)
ZZ = Square Chip Size (mils)
Available through distribution.