--1--

E92928D01

Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.

Absolute Maximum Ratings (Ta=25 °C)

· Supply voltage

, DV

· Input voltage (All pins)

+0.5 to V

0.5

· Output current (for each channel)

OUT

0 to 15

· Storage temperature

Tstg

55 to +150

°C

Recommended Operating Conditions

· Supply voltage

, AV

4.75 to 5.25

, DV

4.75 to 5.25

· Reference input voltage

REF

1.8 to 2.0

· Clock pulse width

PW1,

PW0

9 ns (min.) to 1.1 µs (max.)

· Operating temperature

Topr

20 to +85

°C

Description

The CXD2307R is a 10-bit high-speed D/A

converter for video band, featuring RGB 3-channel

I/O. This is ideal for use in high-definition TVs and

high-resolution displays.

Features

· Resolution 10-bit

· Maximum conversion speed 50MSPS

· RGB 3-channel I/O

· Differential linearity error ±0.5LSB

· Low power consumption; 300 mW (max.)

· Single +5 V power supply

· Low glitch

· Stand-by function

Structure

Silicon gate CMOS IC

10-bit 50MSPS RGB 3-channel D/A Converter

64 pin LQFP (Plastic)

CXD2307R

--2--

CXD2307R

Block Diagram

4LSB'S

CURRENT

CELLS

6MSB'S

CURRENT

CELLS

CLOCK

GENERATOR

CURRENT CELLS

(FOR FULL SCALE)

4LSB'S

CURRENT

CELLS

6MSB'S

CURRENT

CELLS

CLOCK

GENERATOR

CURRENT CELLS

(FOR FULL SCALE)

4LSB'S

CURRENT

CELLS

6MSB'S

CURRENT

CELLS

CLOCK

GENERATOR

CURRENT CELLS

(FOR FULL SCALE)

BIAS VOLTAGE

GENERATOR

DECODER

LATCHES

DECODER

LATCHES

DECODER

LATCHES

DECODER

(LSB) R0

(MSB) R9

(LSB) G0

(MSB) G9

(LSB) B0

(MSB) B9

BLK

VGR

RCK

ROR

VRR

IRR

VGG

GCK

ROG

VRG

IRG

VGB

BCK

ROB

VRB

IRB

--3--

CXD2307R

Pin Configuration

40 39 38 37 36 35 34 33

9 10 11 12 13 14 15 16

AVss

(LSB) R0

GCK

RCK

BLK

B0 (LSB)

I
R

(
L

)

G

Pin Description and Equivalent Circuit

63 to 8

9 to 18

19 to 28

R0 to R9

G0 to G9

B0 to B9

BLK

RCK

GCK

BCK

Pin No.

Symbol

I/O

Equivalent circuit

Description

Digital input.

R0 (LSB) to R9 (MSB)

G0 (LSB) to G9 (MSB)

B0 (LSB) to B9 (MSB)

Blanking input.

This is synchronized with the clock

input signal for each channel.

No signal for High (0 V output).

Output generated for Low.

Chip enable pin.

This is not synchronized with the clock

input signal.

No signal at for High (0 V output) to

minimize power consumption.

Clock input.

Digital ground.

--4--

CXD2307R

36, 49

ROR

ROG

ROB

VGR

VGG

VGB

IRR

IRG

IRB

VRR

VRG

VRB

Pin No.

Symbol

I/O

Equivalent circuit

Description

Connect to DV

with a capacitor of

approximately 0.1 µF.

Analog grounds.

Connect to VGR, VGG, and VGB

with the control method of output

amplitude. See Application Circuit.

Connect a capacitor of approximately

0.1 µF.

Connect to AV

with a resistance of

3.3 k

Set output full-scale value (2.0 V).

--5--

CXD2307R

52, 53, 56,

57, 60, 61

Pin No.

Symbol

I/O

Equivalent circuit

Description

Current output pins. Output can be

retrieved by connecting a resistance

of 200

to AV

Reverse current output pins.

Normally connected to AV

Analog V

Digital V

PW1

PW0

CLK

DATA

D/A OUT

1.5V

100%

50%

I/O Correspondence Table (output full-scale voltage: 2.00 V)

Input code

Output voltage

MSB

LSB

1 1 1 1 1 1 1 1 1 1

1 0 0 0 0 0 0 0 0 0

0 0 0 0 0 0 0 0 0 0

2.0 V

1.0 V

0 V

Timing Chart

--6--

CXD2307R

Electrical Characteristics

CLK

=50 MHz, AV

=DV

=5 V, R

OUT

=200

, V

REF

=2.0 V, Ta=25 °C)

Item

Resolution

Conversion speed

Integral non-linearity error

Differential non-linearity error

Precision guaranteed

output voltage range

Output full-scale voltage

Output full-scale ratio

Output full-scale current

Output offset voltage

Glitch energy

Crosstalk

Supply current

Analog input resistance

Input capacitance

Output capacitance

Digital input voltage

Digital input current

Setup time

Hold time

Propagation delay time

CE enable time

Symbol

CLK

STB

Measurement conditions

=DV

=4.75 to 5.25 V

Ta=20 to 85 °C

Endpoint

For the same gain

(See the Application Circuit)

When "0000000000" data input

When 1 kHz sine wave input

CE= "L"

CE= "H"

VGR, VGG, VGB,

VRR, VRG, VRB

RO,GO,BO

=DV

=4.75 to 5.25 V

Ta=20 to +75 °C

=DV

=4.75 to 5.25 V

Ta=20 to +75 °C

CE=H

CE=L

Min.

0.5

2.0

0.5

1.8

2.15

Typ.

1.9

1.5

9.5

100

Max.

2.0

0.5

2.0

3.0

0.85

Unit

bit

MSPS

LSB

pV·s

µA

Full-scale voltage for each channel

Full-scale output ratio =

Full-scale voltage average value for each channel

100 (%)

When the external capacitors for the VG pins are 0.1 µF.

Electrical Characteristics Measurement Circuit

Analog Input Resistance

Measurement Circuit

Digital Input Current

CXD2307R

+5.25V

, DV

}

--7--

CXD2307R

VGR to VGB
44, 46, 48

ROR to ROB
43, 45, 47

VRR to VRB
40 to 42
IRR to IRB
37 to 39

RCK

10 bit

COUNTER

WITH

LATCH

CLK
50MH

SQUARE
WAVE

GCK

BCK

0.1µ

DVss

200

AVss

200

AVss

200

AVss

3.3k

0.1µ

OSCILLO

SCOPE

BLK

R0 to R9
63 to 8
G0 to G9
9 to 18
B0 to B9
19 to 28

DELAY

CONTROLLER

DELAY

CONTROLLER

Maximum Conversion Speed Measurement Circuit

VGR to VGB
44, 46, 48

VRR to VRB
40 to 42
IRR to IRB
37 to 39

RCK

10 bit

COUNTER

WITH

LATCH

CLK
50MH

SQUARE
WAVE

GCK

BCK

0.1µ

DVss

200

AVss

200

AVss

200

AVss

3.3k

0.1µ

OSCILLO

SCOPE

BLK

R0 to R9
63 to 8
G0 to G9
9 to 18
B0 to B9
19 to 28

ROR to ROB
43, 45, 47

Setup Time

Hold Time

Measurement Circuit

Glitch Energy

}

Cross Talk Measurement Circuit

CLK
50MH

SQUARE
WAVE

DIGITAL

WAVEFORM

GENERATOR

ALL "1"

VGR to VGB
44, 46, 48
ROR to ROB
43, 45, 47
VRR to VRB
40 to 42
IRR to IRB
37 to 39

RCK

GCK

BCK

0.1µ

DVss

200

AVss

200

AVss

200

AVss

3.3k

0.1µ

BLK

R0 to R9
63 to 8
G0 to G9
9 to 18
B0 to B9
19 to 28

SPECTRUM

ANALYZER

--8--

CXD2307R

VGR to VGB
44, 46, 48

ROR to ROB
43, 45, 47

VRR to VRB
40 to 42
IRR to IRB
37 to 39

RCK

CLK
50MH

SQUARE
WAVE

GCK

BCK

0.1µ

DVss

200

AVss

200

AVss

200

AVss

3.3k

0.1µ

OSCILLO

SCOPE

BLK

R0 to R9
63 to 8
G0 to G9
9 to 18
B0 to B9
19 to 28

FREQUENCY

DEMULTIPLIER

DC Characteristics Measurement Circuit

VGR to VGB
44, 46, 48

VRR to VRB
40 to 42
IRR to IRB
37 to 39

RCK

CLK
50MH

SQUARE
WAVE

GCK

BCK

0.1µ

DVss

200

AVss

200

AVss

200

AVss

3.3k

0.1µ

BLK

R0 to R9
63 to 8
G0 to G9
9 to 18
B0 to B9
19 to 28

ROR to ROB
43, 45, 47

CONTROLLER

DVM

Propagation Delay Time Measurement Circuit

--9--

CXD2307R

Application Circuit

(Gain equal)

0.1µF

3.3k

0.1µF

200

ROUT

200

GOUT

200

BOUT

40 39 38 37 36 35 34 33

G channel input

R channel input

9 10 11 12 13 14 15 16

Clock input

B channel input

0.1µF

3.3k

0.1µF

200

ROUT

200

GOUT

200

BOUT

40 39 38 37 36 35 34 33

G channel input

R channel input

9 10 11 12 13 14 15 16

Clock input

B channel input

(Gain independently)

Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for
any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.

--10--

CXD2307R

Notes on Operation

· How to select the output resistance

The CXD2307R is a D/A converter of the current output type. To obtain the output voltage connect the

resistance to the current output pins RO, GO and BO. For specifications we have:

Output full scale voltage

=1.8 to 2.0 [V]

Output full scale current

=less than 15 [mA]

Calculate the output resistance value from the relation of V

OUT

. Also, 16 times resistance of the

output resistance is connected to reference current pin IRR, IRG and IRB. In some cases, however, this

turns out to be a value that does not actually exist. In such a case a value close to it can be used as a

substitute.

Here please note that V

becomes V

REF

16R

OUT

. V

REF

is the voltage set at V

and the VRB

pin, and R

OUT

is the resistance connected to the current output pins RO, GO and BO while R

is connected

to IRR, IRG and IRB. Increasing the resistance value can curb power consumption. On the other hand glitch

energy and data settling time will inversely increase. Set the most suitable value according to the desired

application.

· Phase relation between data and clock

To obtain the expected performance as a D/A converter, it is necessary to set properly the phase relation

between data and clock applied from the exterior. Be sure to satisfy the provisions of the setup time (t

) and

hold time (t

) as stipulated in the Electrical Characteristics.

· Power supply and ground

To reduce noise effects separate analog and digital systems in the device periphery. For power supply pins,

both digital and analog, bypass respective grounds by using a ceramic capacitor of about 0.1 µF, as close as

possible to the pin.

· Latch up

Analog power supply and digital power supply have to be common at the PCB power supply source. This is

to prevent latch up due to voltage difference between AV

and DV

pins when power supply is turned ON.

· RO, GO and BO pins

The RO, GO and BO pins are the inverted current output pins described in the Pin Description. The sums

shown below become the constant value for any input data.

a) The sum of the currents output from RO and RO

b) The sum of the currents output from GO and GO

c) The sum of the currents output from BO and BO

However, the performances such as the linearity error of the inverted current output pin output current is not

guaranteed.

· Output full-scale voltage

For the applications using the RGB signal, the color balance may be broken up when the no-adjusted output

full-scale voltage is used.

--11--

CXD2307R

DIGITAL IC

+5V

Latch Up Prevention

The CXD2307R is a CMOS IC which requires latch up precautions. Latch up is mainly generated by the lag in

the voltage rising time of AV

and DV

, when power supply is ON.

1. Correct usage

a. When analog and digital supplies are from different sources

b. When analog and digital supplies are from a common source

(i)

(ii)

+5V

CXD2307R

DIGITAL IC

+5V

CXD2307R

DIGITAL IC

+5V

--13--

CXD2307R

Example of Representative Characteristics

Output frequency vs. Crosstalk

Output frequency F

]

100k

10M

r
o

t
a

l
k

[
d

]

=DV

=5V

CLK

=50MSPS

OUT

=200

=3.3k

Ta=25°C

Ambient temperature vs. Current consumption

Ambient temperature Ta [°C]

r
r
e

t

c

t
i
o

[
m

]

Ambient temperature vs. Full-scale voltage

l
l
-
s

l
e

l
t
a

[
V

]

1.9

1.8

Ambient temperature Ta [°C]

=DV

=5V

CLK

=50MSPS

REF

=2.0V

OUT

=200

=3.3k

=DV

=5V

CLK

=50MSPS

REF

=2.0V

OUT

=200

=3.3k

SONY CODE

EIAJ CODE

JEDEC CODE

PACKAGE MATERIAL

LEAD TREATMENT

LEAD MATERIAL

PACKAGE MASS

EPOXY RESIN

PLATING

42/COPPER ALLOY

PACKAGE STRUCTURE

12.0 ± 0.2

10.0 ± 0.1

(0.22)

0.18 0.03

+ 0.08

0.1 ± 0.1

.
5

.
2

0° to 10°

64PIN LQFP (PLASTIC)

LQFP-64P-L01

LQFP064-P-1010

0.3g

DETAIL A

.
5

.
2

(
1

.
0

)

0.127 0.02

+ 0.05

1.5 0.1

+ 0.2

0.1

SOLDER/PALLADIUM

NOTE: Dimension "

" does not include mold protrusion.

0.13 M

0.5

Package Outline Unit : mm

CXD2307R

--14--

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ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: CXD2307