1
CXP832P40A
E94X39A1Y-PS
CMOS 8-bit Single Chip Microcomputer
Description
The CXP832P40A is a CMOS 8-bit single chip
microcomputer integrating on a single chip an A/D
converter, serial interface, timer/counter, time base
timer, 32kHz timer/counter, capture timer counter,
LCD controller/driver, remote control reception circuit
and 14-bit PWM output besides the basic
configurations of 8-bit CPU, PROM, RAM, and I/O port.
Also the CXP832P40A provides sleep/stop function
which enables to lower power consumption.
The CXP832P40A is the PROM-incorporated
version of the CXP83240A with built-in mask ROM.
This provides the additional feature of being able to
write directry into the program. Thus, it is most
suitable for evaluation use during system
development and for small-quantity production.
Features
Wide-range instruction system (213 instructions) to cover various types of data.
-- 16-bit arithmetic/multiplication and division/boolean bit operation instructions
Minimum instruction cycle
400ns at 10MHz operation
8s at 500kHz operation
122s at 32kHz operation
Incorporated PROM capacity 40K bytes
Incorporated RAM capacity
1120 bytes (includes LCD display data area)
Peripheral functions
-- A/D converter
8-bit, 8-channel, successive approximation method
(Conversion time of 32s/10MHz)
-- Serial interface
8-bit, 8-stage FIFO incorporated
(Auto transfer for 1 to 8 bytes), 1 channel
8-bit clock synchronized type, 1 channel
-- Timer
8-bit timer, 8-bit timer/counter, 19-bit time base timer,
16-bit capture timer/counter, 32kHz timer/counter
-- LCD controller/driver
Maximum 160 segment display possible (during 1/4 duty)
4 common output, 40 segment output
Display method static, 1/2, 1/3, 1/4 duty
Bias method 1/2, 1/3 bias
-- Remote control reception circuit
8-bit pulse measurement counter with on-chip, 6-stage FIFO
-- PWM output circuit
14 bits, 1 channel
Interruption
15 factors, 15 vectors, multi-interruption possible
Standby mode
SLEEP/STOP
Package
100-pin plastic QFP/LQFP
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
Structure
Silicon gate CMOS IC
100 pin QFP (Plastic)
100 pin LQFP (Plastic)
2
CXP832P40A
RAM
1120 BYTES
CLOCK GEN/
SYSTEM CONTROL
SPC 700
CPU CORE
INTERRUPT CONTROLLER
A/D CONVERTER
SERIAL
INTERFACE
UNIT 0
SERIAL INTERFACE UNIT 1
8-BIT TIMER/COUNTER 0
8-BIT TIMER 1
14-BIT PWM GENERATOR
16-BIT CAPTURE
TIMER/COUNTER 2
V
SS
RST
XTAL1
EXTAL1
V
DD
NMI/INT3
INT1
INT0
INT2
AN0 to AN7
8
PA0 to PA7
FIFO
FIFO
REMOCON
LCD
CONTROLLER/
DRIVER
32kHz
TIMER/COUNTER
PRESCALER/
TIME BASE TIMER
PORT A
PORT B
PORT C
PORT D
PORT E
PORT F
PORT G
PORT H
8
8
5
2
8
8
8
8
PB0 to PB7
PC0 to PC7
PD0 to PD7
PE0 to PE4
PF0 to PF7
PG0 to PG7
PH0 to PH7
PE5 to PE6
TEX
EXTAL2
XTAL2
TX
AV
REF
AV
SS
SEG0 to SEG39
VL
COM0 to COM3
VLC1
VLC2
VLC3
PWM
RMC
CS0
SI0
SO0
SCK0
SI1
SO1
SCK1
EC0
TO
CINT
EC1
ADJ
2
2
2
2
40
4
PROM
40K BYTES
8
Block Diagram
3
CXP832P40A
Pin Assignment (Top View) (QFP package)
PE2/INT2
PE3/INT3/NMI
PE4/RMC
PE5/PWM
PE6/TO/ADJ
PB0/CINT
PB1/CS0
PB2/SCK0
PB3/SI0
PB4/SO0
PB5/SCK1
PB6/SI1
PB7/SO1
PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7
PH0
PH1
PH2
PH3
PH4
PH5
PH6
PH7
PA0/AN0
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
40
39
38
37
36
35
34
31 32 33
41 42 43 44 45 46 47 48 49 50
51
52
53
54
55
56
57
58
59
60
70
69
68
67
63
64
65
66
61
62
71
72
73
74
81
82
83
84
75
76
77
78
88 87 86 85
79
80
89
90
100 99 98 97 96 95 94
91
92
93
1
PA1/AN1
PA2/AN2
PA3/AN3
PA4/AN4
PA5/AN5
PA6/AN6
PA7/AN7
RST
EXTAL1
XTAL1
Vss
XTAL2
EXTAL2
AV
REF
AVss
V
L
V
LC3
V
LC2
V
LC1
COM0
SEG26/PF2
SEG25/PF1
SEG24/PF0
SEG23/PD7
SEG22/PD6
SEG21/PD5
SEG20/PD4
SEG19/PD3
SEG18/PD2
SEG17/PD1
SEG16/PD0
SEG15
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
SEG0
COM3
COM2
COM1
PE1/INT1/EC1
PE0/INT0/EC0
SEG39/PG7
SEG38/PG6
SEG37/PG5
SEG36/PG4
SEG35/PG3
TEX
TX
Vss
Vpp
V
DD
SEG34/PG2
SEG33/PG1
SEG32/PG0
SEG31/PF7
SEG30/PF6
SEG29/PF5
SEG28/PF4
SEG27/PF3
Note)
1. Vpp (Pin 90) is always connected to V
DD
.
2. V
SS
(Pin 41 and 91) are both connected to GND.
4
CXP832P40A
Pin Assignment (Top View) (LQFP package)
PE4/RMC
PE5/PWM
PE6/TO/ADJ
PB0/CINT
PB1/CSO
PB2/SCK0
PB3/SI0
PB4/SO0
PB5/SCK1
PB6/SI1
PB7/SO1
PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7
PH0
PH1
PH2
PH3
PH4
PH5
PH6
PH7
PA0/AN0
PA1/AN1
PA2/AN2
PA3/AN3
PA4/AN4
PA5/AN5
PA6/AN6
PA7/AN7
RST
EXTAL1
XTAL1
Vss
XTAL2
EXTAL2
AV
REF
AVss
V
L
V
LC3
V
LC2
V
LC1
COM0
COM1
COM2
PE3/INT3/NMI
PE2/INT2
PE1/INT1/EC1
PE0/INT0/EC0
SEG39/PG7
SEG38/PG6
SEG37/PG5
SEG36/PG4
SEG35/PG3
TEX
TX
Vss
Vpp
V
DD
SEG34/PG2
SEG33/PG1
SEG32/PG0
SEG31/PF7
SEG30/PF6
SEG29/PF5
SEG28/PF4
SEG27/PF3
SEG26/PF2
SEG25/PF1
SEG24/PF0
SEG23/PD7
SEG22/PD6
SEG21/PD5
SEG20/PD4
SEG19/PD3
SEG18/PD2
SEG17/PD1
SEG16/PD0
SEG15
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
SEG0
COM3
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
1
81
82
83
84
76
77
78
88 87 86 85
79
80
89
90
100 99 98 97 96 95 94
91
92
93
51
52
53
54
55
56
57
58
59
60
70
69
68
67
63
64
65
66
61
62
71
72
73
74
75
26 27 28 29 30
40
39
38
37
36
35
34
31 32 33
41 42 43 44 45 46 47 48 49 50
Note)
1. Vpp (Pin 88) is always connected to V
DD
.
2. V
SS
(Pin 39 and 89) are both connected to GND.
5
CXP832P40A
Pin Description
Symbol
I/O
Functions
I/O/Analog input
PA0/AN0
to
PA7/AN7
(Port A)
8-bit I/O port. I/O can
be set in a single bit
unit.
Incorporation of pull-up
resistor can be set
through the software in
a unit of 4 bits. (8 pins)
Analog inputs to A/D converter.
(8 pins)
I/O
PC0 to PC7
PE0/INT0/
EC0
PE1/INT1/
EC1
PE2/INT2
PE3/INT3/
NMI
PE4/RMC
PE5/PWM
PE6/TO/
ADJ
PH0 to PH7
Input/Input/Input
Input/Input/Input
Input/Input
Input/Input/Input
Input/Input
Output/Output
Output/Output/
Output
I/O
(Port C)
8-bit I/O port. I/O can be set in a single bit unit. Capable of driving 12mA
sync current. Incorporation of pull-up resistor can be set through the
software in a unit of 4 bits.
(8 pins)
(Port E)
7-bit port. lower 5 bits
are for inputs; upper 2
bits are for outputs.
(7 pins)
(Port H)
8-bit I/O port. I/O can be set in a single bit unit. Incorporation of pull-up
resistor can be set through the software in a unit of 4 bits.
(8 pins)
External event inputs for
timer/counter.
(2 pins)
External interruption request inputs.
(4 pins)
Non-maskable interruption request
input.
Remote control reception circuit input.
14-bit PWM output.
Rectangular wave output
for 16-bit timer/counter
(duty output 50%).
Output for 32kHz
oscillation
frequency division.
I/O/Input
I/O/Input
I/O/I/O
I/O/Input
I/O/Output
I/O/I/O
I/O/input
I/O/Output
PB0/CINT
PB1/CS0
PB2/SCK0
PB3/SI0
PB4/SO0
PB5/SCK1
PB6/SI1
PB7/SO1
(Port B)
8-bit I/O port. I/O can
be set in a single bit
unit.
Incorporation of pull-up
resistor can be set
through the software in
a unit of 4 bits.
(8 pins)
External capture input to 16-bit timer/counter.
Chip select input for serial interface (CH0).
Serial clock I/O (CH0).
Serial data input (CH0).
Serial data output (CH0).
Serial clock I/O (CH1).
Serial data input (CH1).
Serial data output (CH1).
6
CXP832P40A
Symbol
I/O
Functions
Output/Output
PF0/SEG24
to
PF7/SEG31
(Port F)
8-bit output port.
(8 pins)
Output/Output
PG0/SEG32
to
PG7/SEG39
(port G)
8-bit output port.
(8 pins)
Output/Output
PD0/SEG16
to
PD7/SEG23
(Port D)
8-bit output port.
(8 pins)
Output
SEG0 to SEG15
LCD segment signal output.
Input
Crystal connectors for system clock oscillation. When the clock is
supplied externally, input to EXTAL1; opposite phase clock should be
input to XTAL1. System clock oscillation of EXTAL1 and XTAL1 is used
for normal operation mode (Max. 10MHz).
EXTAL1
Output
COM0 to COM3
LCD common signal output.
V
LC1
to V
LC3
LCD bias power supply.
Output
V
L
Control pin to cut off the current flowing to external LCD bias resistor
during standby.
XTAL1
Input
Crystal connectors for system clock oscillation. When the clock is
supplied externally, input to EXTAL2; opposite phase clock should be
input to XTAL2. System clock oscillation of EXTAL2 and XTAL2 is used
for sub clock mode (Typ. 500kHz).
EXTAL2
XTAL2
Input
Crystal connectors for 32kHz timer/counter clock generation circuit.
Connect a 32.768kHz crystal oscillator between TEX and TX. For usage
as event input, connect clock oscillation source to TEX, and leave TX
open.
TEX
Output
TX
Input
Input
Low-level active system reset.
Positive power supply for built-in PROM writing.
Under normal operating conditions, connect to V
DD
.
Reference voltage input for A/D converter.
A/D converter GND.
Positive power supply.
GND. Two V
SS
are connected to GND.
RST
Vpp
AV
REF
AV
SS
V
DD
V
SS
LCD segment signal output.
7
CXP832P40A
IP
Pull-up resistor
Port B data
Port B direction
"0" when reset
RD (Port B)
Data bus
Pull-up transistors
approx. 100k
"0" when reset
Schmitt input
CINT
CS0
SI0
SI1
Pull-up transistors
approx. 100k
Pull-up resistor
Port B data
Port B direction
"0" when reset
RD (Port B)
Data
bus
IP
"0" when reset
Schmitt input
SCK in
Output enable
"0" when reset
SCK OUT
Port B output selection
Port B
8 pins
Hi-Z
Hi-Z
When reset
PA0/AN0
to
PA7/AN7
PB0/CINT
PB1/CS0
PB3/SI0
PB6/SI1
Port B
4 pins
2 pins
Hi-Z
PB2/SCK0
PB5/SCK1
IP
Pull-up resistor
Port A data
Port A direction
"0" when reset
Port A input selection
"0" when reset
RD (Port A)
Data bus
A/D converter
Pull-up transistors
approx. 100k
Input multiplexer
"0" when reset
Input protection
circuit
I/O Circuit Format for Pins
Port A
Pin
Circuit format
8
CXP832P40A
2 pins
Hi-Z
Hi-Z
Pin
When reset
Circuit format
PB4/SO0
PB7/SO1
PC0 to PC7
8 pins
5 pins
Hi-Z
PE0/INT0/EC0
PE1/INT1/EC1
PE2/INT2
PE3/INT3/NMI
PE4/RMC
IP
Schmitt input
INT0/EC0
INT1/EC1
INT2
INT3/NMI
RMC
Data bus
RD (Port E)
IP
Pull-up resistor
Port C data
Port C direction
"0" when reset
RD (Port C)
Data bus
1 Large current drive
of 12mA possible
2 Pull-up transistors
approx. 100k
2
"0" when reset
1
Pull-up transistors
approx. 100k
Pull-up resistor
Port B data
Port B direction
"0" when reset
RD (Port B)
Data
bus
IP
"0" when reset
Output enable
Port B output selection
"0" when reset
SO
Port E
Port C
Port B
9
CXP832P40A
1 pin
P in
When reset
Circuit format
PE5/PWM
Port E output selection
RD (Port E)
Data bus
"0" when reset
Reset E data
"1" when reset
PWM
Port E
1 pin
High level
PE6/TO/ADJ
1
2
Port E data
"1" when reset
Port E output selection
MPX
Port E output selection
ADJ2K
ADJ16K
TO
Internal reset signal
1
Pull-up transistors approx. 150k
.
ADJ signals are frequency divider outputs
for 32kHz oscillation frequency adjustment.
ADJ2K provides usage as buzzer output.
2
TO Output enable
"00" when reset
Port E
8 pins
Hi-Z
PH0 to PH7
IP
Pull-up resistor
Port H data
Port H direction
"0" when reset
RD (Port H)
Data bus
Pull-up transistors approx. 100k
"0" when reset
Port H
High level
(High level
with 150k
resistor
when reset)
10
CXP832P40A
24 pins
Segment
output
(V
DD
level)
Pin
When reset
Circuit format
PD0 to PD7
PF0 to PF7
PG0 to PG7
Segment data
Segment
driver
Port/segment output
selection
"0" when reset
Port data
PD7 to PD4
PD3 to PD0
PF7 to PF0
PG7 to PG0
by a single bit unit
by 4-bit unit
by 8-bit unit
16 pins
SEG0 to
SEG15
V
CH
V
CL
4 pins
V
DD
level
COM0 to
COM3
V
LC1
V
LC2
V
LC3
V
DD
1 pin
Hi-Z
V
L
LCD control
(DSP bit)
"0" when reset
V
DD
level
Port D
Port F
Port G
Segment
Common
11
CXP832P40A
2 pins
Oscillation
Pin
When reset
Circuit format
EXTAL1
XTAL1
2 pins
EXTAL2
Hi-Z
XTAL2
High level
EXTAL2
XTAL2
2 pins
Oscillation
TEX
TX
1 pin
Low level
RST
EXTAL1
XTAL1
IP
IP
EXTAL2
XTAL2
IP
IP
TEX
TX
IP
IP
IP
OP
Schmitt input
Mask option
Pull-up resistor
Diagram shows circuit
composition during
oscillation.
Feedback resistor is
removed during stop.
XTAL1 becomes "High"
level.
Diagram shows circuit
composition during
oscillation.
Feedback resistor is
removed during stop.
XTAL2 becomes "High"
level.
Diagram shows circuit
composition during
oscillation.
When the operation of the oscillation
circuit is stopped by the software, the
feedback resistor is removed and TEX
and TX become "Low" level and "High"
level respectively.
12
CXP832P40A
1) V
IN
and V
OUT
must not exceed V
DD
+ 0.3V.
2) The large current drive transistor is the N-ch transistor of Port C (PC)
Note) Usage exceeding absolute maximum ratings may permanently impair the LSI. Normal operation should
be conducted under the recommended operating conditions. Exceeding these conditions may
adversely affect the reliability of the LSI.
Supply voltage
LCD bias voltage
Input voltage
Output voltage
High level output current
High level total output current
Low level total output current
Operating temperature
Storage temperature
Allowable power dissipation
V
DD
Vpp
AV
SS
V
LC1
, V
LC2
, V
LC3
V
IN
V
OUT
I
OH
I
OH
I
OL
I
OLC
I
OL
Topr
Tstg
P
D
Low level output current
0.3 to +7.0
0.3 to +13.0
0.3 to +0.3
0.3 to +7.0
1
0.3 to +7.0
1
0.3 to +7.0
1
5
50
15
20
100
10 to +75
55 to +150
600
380
V
V
V
V
V
V
mA
mA
mA
mA
mA
C
C
mW
Incorporated PROM
Output per pin
Total for all output pins
Value per pin, excluding large current outputs
Value per pin
2
for large current outputs
Total for all output pins
QFP package
LQFP package
Iem
Symbol
Rating
Unit
Remarks
Absolute Maximum Ratings
(Vss = 0V)
13
CXP832P40A
LCD bias voltage
High level
input voltage
Low level
input voltage
Operating temperature
Supply voltage
5.5
5.5
5.5
5.5
5.5
V
DD
V
DD
V
DD
V
DD
+ 0.3
0.3V
DD
0.2V
DD
0.4
+75
V
V
V
V
V
V
V
V
C
V
Item
Symbol
Min.
Max.
Unit
Remarks
4.5
3.5
3.0
2.7
2.5
Vss
0.7V
DD
0.8V
DD
V
DD
0.4
0
0
0.3
10
V
LC1
V
LC2
V
LC3
V
IH
V
IHS
V
IHEX
V
IL
V
ILS
V
ILEX
Topr
High-speed mode guaranteed operation range
1
Low-speed mode guaranteed operation range
1
Guaranteed operation range during
EXTAL2 clock (sub clock mode)
Guaranteed operation range with TEX clock
Guaranteed data hold range during STOP
6
LCD power supply range
5
2
Hysteresis input
3
EXTAL
4
2
Hysteresis input
3
EXTAL
4
V
DD
1) During EXTAL1 clock (main clock mode), high-speed mode is 1/2 frequency division clock selection; low-
speed mode is 1/16 frequency division clock selection.
2) Value for each pin of normal input ports (PA, PB4, PB7, PC and PH).
3) Value of the following pins; RST, CINT CS0, SI0, SI1, SCK0, SCK1, EC0/INT0, EC1/INT1, INT2,
NMI/INT3, and RMC.
4) Specifies only during external clock input.
5) Optimal values are determined by LCD used.
6) Vpp and V
DD
should be set to same voltage.
Recommended Operating Conditions
(Vss = 0V)
Vpp = V
DD
Vpp
14
CXP832P40A
V
DD
= 4.5V, I
OH
= 0.5mA
V
DD
= 4.5V, I
OH
= 1.2mA
V
DD
= 4.5V, I
OL
= 1.8mA
V
DD
= 4.5V, I
OL
= 3.6mA
V
DD
= 4.5V, I
OL
= 12.0mA
V
DD
= 5.5V, V
IH
= 5.5V
V
DD
= 5.5V, V
IL
= 0.4V
V
DD
= 5.5V, V
IH
= 5.5V
V
DD
= 5.5V, V
IL
= 0.4V
V
DD
= 5.5V, V
IH
= 5.5V
V
DD
= 5.5V, V
IL
= 0.4V
V
DD
= 5.5V, V
IL
= 0.4V
V
DD
= 4.5V, V
IH
= 4.0V
V
DD
= 5.5V, V
IL
= 0.4V
V
DD
= 5.5V,
V
I
= 0, 5.5V
V
DD
= 5V,
V
LC1
= 3.75V
V
LC2
= 2.5V
V
LC3
= 1.25V
High level
output voltage
I/O leakage
current
Supply
current
4
4.0
3.5
0.5
0.5
0.3
0.3
0.1
0.1
1.5
3.33
V
V
V
V
V
A
A
A
A
A
A
A
A
A
A
k
k
PC
PA, PB, PC,
PD
1
, PE5,
PE6
PF to PG
1
V
L
(V
OL
only)
EXTAL1
EXTAL2
TEX
RST
2
Item
Symbol
Pins
Conditions
Min.
PA to PC
3
,
PH
3
PE0 to PE4,
RST
2
V
DD
I
IZ
Common
output
impedance
R
COM
Segment
output
impedance
R
SEG
COM0 to
COM3
SEG0 to
SEG15
SEG16 to
SEG39
1
I
DD1
High-speed mode operation
(1/2 frequency division clock)
I
DD3
I
DDS1
I
DDS3
I
DDSS
V
OH
V
OL
I
IHE1
I
ILE1
I
IHE2
I
ILE2
I
IHT
I
ILT
I
ILR
I
IH
I
IL
Low level
output voltage
Input current
3
5
Typ.
0.4
0.6
1.5
40
40
30
30
10
10
400
50
10
5
15
Max.
Unit
I
DD2
DC Characteristics
Electrical Characteristics
(Ta = 10 to +75C, Vss = 0V)
V
DD
= 5.5V, 10MHz crystal oscillation
(C
1
= C
2
= 15pF)
V
DD
= 3.5V, 500kHz crystal oscillation
(C
1
= C
2
= 22pF)
V
DD
= 3V, 32kHz crystal oscillation
(C
1
= C
2
= 47pF)
SLEEP mode
STOP mode
V
DD
= 5.5V, 10MHz, 500kHz crystal
oscillation and termination of 32kHz
oscillation
V
DD
= 5.5V, 10MHz crystal oscillation
(C
1
= C
2
= 15pF)
V
DD
= 3V, 32kHz crystal oscillation
(C
1
= C
2
= 47pF)
20
45
mA
0.6
1.3
mA
2.0
3.8
mA
1.5
8
mA
9
30
A
I
DDS2
V
DD
= 3.5V, 500kHz crystal oscillation
(C
1
= C
2
= 22pF)
0.5
1.0
mA
30
A
15
CXP832P40A
1) Common pins of PD0/SEG16 to PD7/SEG23, PF0/SEG24 to PF7/SEG31, PG0/SEG32 to PG7/SEG39,
PD, PF and PG are the case when the common pin is selected as port; SEG16 to SEG39 are when the
common pin is selected as segment output.
2) RST specifies the input current when pull-up resitor has been selected; leakage current when no resistor
has been selected.
3) PA to PC, and PH specify the input current when a pull-up resistor has been selected; leakage current
when no resistor has been selected. (PE0 to PE4 specify the leakage current.)
4) When all output pins are left open.
Clock 1MHz
0V for all pins excluding
measured pins
Input capacity
10
20
pF
Pins other than
PB7, PE5, PE6
V
LC1
to V
LC3
COM0 to COM3
SEG0 to SEG15
PD0/SEG16 to
PD7/SEG23
PF0/SEG24 to
PF7/SEG31
PG0/SEG32 to
PG7/SEG39
AV
REF
, AV
SS
,
V
DD
, V
SS
Item
Symbol
Pins
Conditions
Min.
C
IN
Typ.
Max.
Unit
16
CXP832P40A
t
sys indicates the three values below according to the upper two bits (CPU clock selection) of the clock
control register (address: 00FE
H
).
t
sys [ns] = 2000/fc (upper two bits = "00"), 4000/fc (upper two bits = "01"), 16000/fc (upper two bits = "11").
EXTAL1
EXTAL2
t
XH
t
XL
t
CF
t
CR
0.4V
V
DD
0.4V
1/fc
Crystal oscillation
Ceramic oscillation
EXTAL
XTAL
External clock
EXTAL
XTAL
74HC04
C
1
C
2
32kHz clock applied condition
Crystal oscillation
TEX
TX
C
1
C
2
AC Characteristics
(1) Clock timing
System clock frequency
System clock input
pulse width
System clock input rise and
fall time
System clock frequency
System clock input pulse width
System clock input rise and
fall time
Event count input clock pulse
width
Event count input clock rise
and fall time
System clock frequency
Event count input clock input
pulse width
Event count input clock rise
and fall time
f
C
t
XL
,
t
XH
t
CR
,
t
CF
f
C
t
XL
,
t
XH
t
CR
,
t
CF
t
EH
,
t
EL
t
ER
,
t
EF
f
C
t
TL
,
t
TH
t
TR
,
t
TF
XTAL1
EXTAL1
EXTAL1
EXTAL1
XTAL2
EXTAL2
EXTAL2
EXTAL2
EC0
EC1
EC0
EC1
TEX
TX
TEX
TEX
MHz
ns
ns
MHz
ns
ns
ns
ms
kHz
s
ms
Item
Symbol
Pin
Conditions
Min.
Unit
Fig. 1, Fig. 2
Fig. 1, Fig. 2
external clock drive
Fig. 1, Fig. 2
external clock drive
V
DD
= 3.0 to 5.5V
Fig. 1, Fig. 2
V
DD
= 3.0 to 5.5V
Fig. 1, Fig. 2
external clock drive
V
DD
= 3.0 to 5.5V
Fig. 1, Fig. 2
external clock drive
Fig. 3
Fig. 3
V
DD
= 2.7 to 5.5V
Fig. 2 (32kHz clock
applied condition)
Fig. 3
Fig. 3
1
37.5
0.3
450
t
sys + 50
10
Typ.
0.5
32.768
Max.
10
200
0.7
200
20
20
(Ta = 10 to +75C, V
DD
= 4.5 to 5.5V, Vss = 0V)
Fig. 2. Clock applied conditions
Fig. 1. Clock timing
17
CXP832P40A
Chip select transfer mode
(SCK0 = output mode)
Chip select transfer mode
(SCK0 = output mode)
Chip select transfer mode
Chip select transfer mode
Chip select transfer mode
Note 1)
t
sys indicates the three values below according to the upper two bits (CPU clock selection) of the
clock control register (address: 00FE
H
).
t
sys [ns] = 2000/fc (upper two bits = "00"), 4000/fc (upper two bits = "01"), 16000/fc (upper two bits = "11")
Note 2) The load condition for the SCK0 output mode, SO0 output delay time is 50pF + 1TTL.
(2) Serial transfer (CH0)
(Ta = 10 to +75C, V
DD
= 4.5 to 5.5V, Vss = 0V)
Item
CS0
SCK0
delay time
CS0
SCK0
float delay time
CS0
SO0
delay time
CS0
SO0
float delay time
CS0 high level width
SCK0 cycle time
SCK0 high and low level
widths
SI0 input setup time
(for SCK0
)
SI0 input hold time
(for SCK0
)
SCK0
SO0
delay time
t
DCSK
t
DCSKF
t
DCSO
t
DCSOF
t
WHCS
t
KCY
t
KH
t
KL
t
SIK
t
KSI
t
KSO
SCK0
SCK0
SO0
SO0
CS0
SCK0
SCK0
SI0
SI0
SO0
Input mode
Output mode
Input mode
Output mode
SCK0 input mode
SCK0 output mode
SCK0 input mode
SCK0 output mode
SCK0 input mode
SCK0 output mode
ns
ns
ns
ns
ns
Symbol
Pin
Min.
t
sys + 200
t
sys + 200
t
sys + 200
t
sys + 200
t
sys + 200
2
t
sys + 200
16000/fc
t
sys + 100
8000/fc 50
100
200
t
sys + 200
100
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
t
sys + 200
100
Max.
Unit
Conditions
TEX
EC0
EC1
t
EH
t
EL
t
EF
t
ER
0.2V
DD
0.8V
DD
t
TH
t
TL
t
TF
t
TR
Fig. 3. Event count clock timing
18
CXP832P40A
Fig. 4. Serial transfer CH0 timing
CS0
SCK0
0.2V
DD
0.8V
DD
t
WHCS
t
DCSK
t
DCSKF
0.8V
DD
0.2V
DD
0.8V
DD
t
KCY
t
KL
t
KH
0.8V
DD
0.2V
DD
SI0
t
SIK
t
KSI
Input data
t
DCSO
t
KSO
t
DCSOF
Output data
0.8V
DD
0.2V
DD
SO0
19
CXP832P40A
Serial Transfer (CH1)
(Ta = 10 to +75C, V
DD
= 4.5 to 5.5V, Vss = 0V)
Item
SCK1 cycle time
t
KCY
SCK1
Input mode
Output mode
input mode
Output mode
SCK1 input mode
SCK1 output mode
SCK1 input mode
SCK1 output mode
SCK1 input mode
SCK1 output mode
1000
16000/fc
400
8000/fc 50
100
200
200
100
200
100
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
SCK1
SI1
SI1
SO1
t
KH
t
KL
t
SIK
t
KSI
t
KSO
SCK1 high and low level
widths
SI1 input setup time
(for SCK1
)
SI1 input hold time
(for SCK1
)
SCK1
SO1 delay time
Symbol
Pin
Conditions
Min.
Max.
Unit
Note) The load condition for the SCK1 output mode and SO1 output delay time is 50pF + 1TTL.
Fig. 5. Serial transfer CH1 timing
0.2V
DD
0.8V
DD
t
KL
t
KH
SO1
t
KCY
t
SIK
t
KSI
0.2V
DD
0.8V
DD
t
KSO
0.2V
DD
0.8V
DD
Output data
Input data
SI1
SCK1
20
CXP832P40A
Conversion time
Sampling time
Reference input voltage
Analog input voltage
t
CONV
t
SAMP
V
REF
V
IAN
V
ZT
1
V
FT
2
I
REF
AV
REF
AN0 to AN7
Ta = 25C
V
DD
= AV
REF
= 5.0V
V
SS
= AV
SS
= 0V
Operation mode
SLEEP mode
STOP mode
32kHz operation mode
Linearity error
Zero transition
voltage
Full-scale transition
voltage
Resolution
AV
REF
current
AV
REF
I
REFS
s
s
V
V
V
DD
AV
REF
1.0
mA
10
A
0.6
160/f
ADC
3
12/f
ADC
3
V
DD
0.5
0
Item
Symbol
Pin
Conditions
Min.
Typ.
Max.
Unit
Bits
(3) A/D converter characteristics
(Ta = 10 to +75C, V
DD
= 4.5 to 5.5V, Vss = AV
SS
= 0V)
8
3
LSB
70
mV
5030
10
4970
10
4910
mV
Fig. 6. Definition of A/D converter terms
Analog input
Linearity error
V
FT
V
ZT
00
H
01
H
FE
H
FF
H
Digital conversion value
1) V
ZT
: Value at which the digital conversion value changes
from 00
H
to 01
H
and vice versa.
2) V
FT
: Value at which the digital conversion value changes
from FE
H
to FF
H
and vice versa.
3) f
ADC
indicates the below values due to the Bit 6 (CKS) of
A/D control register (address: 00F9
H
) and the Bit 7 (PCK1)
and Bit 6 (PCK0) of clock control register (address: 00FF
H
).
00 (
= f
EX
/2)
01 (
= f
EX
/4)
11 (
= f
EX
/16)
f
ADC
= f
C
/2
f
ADC
= f
C
/4
f
ADC
= f
C
/16
0 (
/2 selection)
CKS
PCK1, PCK0
f
ADC
= f
C
f
ADC
= f
C
/2
f
ADC
= f
C
/8
1 (
selection)
21
CXP832P40A
External interruption
high and low level widths
Reset input low level width
INT0
INT1
INT2
NMI/INT3
RST
1
32/fc
s
s
Item
Syymbol
Pin
Conditions
Min.
Max.
Unit
t
IH
t
IL
t
RSL
(4) Interruption, reset input
(Ta = 10 to +75C, V
DD
= 4.5 to 5.5V, Vss = 0V)
0.2V
DD
0.8V
DD
t
IH
t
IL
INT0
INT1
INT2
NMI/INT3
(NMI specifies only
for the falling edge)
t
IL
t
IH
Fig. 7. Interruption input timing
t
RSL
0.2V
DD
RST
Fig. 8. RST input timing
22
CXP832P40A
Appendix
Fig. 9. SPC700 series recommended oscillation circuit
C
1
EXTAL
XTAL
C
2
Rd
EXTAL
XTAL
Rd
(i) Main clock
500kHz sub clock
EXTAL
XTAL
C
1
C
2
Rd
XTAL
(ii) Main clock
500kHz sub clock
EXTAL
XTAL
C
1
C
2
Rd
TEX
TX
(iii) 32kHz sub clock
Manufacturer
MURATA MFG
CO., LTD.
RIVER
ELETEC
CO., LTD.
KINSEKI LTD.
Model
CSA4.19MG
CSA8.00MG
CST4.19MGW
CST8.00MTW
HC-49/U03
HC-49/U (-S)
fc (MHz)
4.19
8.00
10.00
4.19
8.00
10.00
4.19
8.00
10.00
4.19
8.00
10.00
18
18
30
15
22
30
15
22
560
470
0
2.2k
0
C
1
(pF)
C
2
(pF)
Rd (
)
Circuit
example
(i)
CSA10.0MT
(ii)
CST10.00MTW
(i)
Those marked with an asterisk (
) signify types with built-in ground capacitance (C
1
, C
2
).
Option item
Product name
Package
ROM capacitance
Reset pin
pull-up resistor
Selection Guide
CXP83120A CXP83124A CXP83232A CXP83240A
CXP832P40AQ-
1-
CXP832P40AR-
1-
Mask product
Incorporated PROM product
100-pin plastic QFP/LQFP
100-pin plastic QFP 100-pin plastic LQFP
20K bytes 24K bytes 32K bytes 40K bytes
PROM 40K bytes
Existent/Non-existent
Existent
Existent
23
CXP832P40A
0
15
10
5
5
10
15
20
(100A)
3
4
5
6
0.1
5.0
1.0
7
2
0.05
(50A)
0.01
(10A)
0.5
10.0
20.0
V
DD
Supply voltage [V]
I
DD
vs. V
DD
(Ta = 25C, typical)
fc System clock [MHz]
I
DD
Supply current [mA]
I
DD
vs. fc
(V
DD
= 5V, Ta = 25C, typical)
Main clock
1/2 frequency
dividing mode
Main clock
SLEEP mode
I
DD
Supply current [mA]
fc = 500kHz sub clock
1/2 frequency dividing mode
32kHz
SLEEP mode
fc = 10MHz
main clock
1/2 frequency dividing mode
fc = 10MHz main clock
SLEEP mode
fc = 500kHz sub clock
SLEEP mode
32kHz mode (Instruction)
Characteristics Curves
24
CXP832P40A
Package Outline Unit : mm
SONY CODE
EIAJ CODE
JEDEC CODE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
42/COPPER ALLOY
PACKAGE STRUCTURE
23.9
0.4
QFP-100P-L01
100PIN QFP (PLASTIC)
20.0 0.1
+ 0.4
0.15 0.05
+ 0.1
15.8
0.4
17.9
0.4
14.0
0.1
+ 0.4
2.75 0.15
+ 0.35
A
0.65
M
0.13
QFP100-P-1420
1.7g
1
100
81
80
51
50
31
30
0.3 0.1
+ 0.15
DETAIL A
0 to 10
0.8
0.2
(16.3)
0.15
0.1 0.05
+ 0.2
SONY CODE
EIAJ CODE
JEDEC CODE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
42/COPPER ALLOY
PACKAGE STRUCTURE
23.9
0.4
QFP-100P-L01
100PIN QFP (PLASTIC)
20.0 0.1
+ 0.4
0.15 0.05
+ 0.1
15.8
0.4
17.9
0.4
14.0
0.1
+ 0.4
2.75 0.15
+ 0.35
A
0.65
M
0.13
QFP100-P-1420
1.7g
1
100
81
80
51
50
31
30
0.3 0.1
+ 0.15
DETAIL A
0 to 10
0.8
0.2
(16.3)
0.15
0.1 0.05
+ 0.2
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIAL
42 ALLOY
SOLDER COMPOSITION
Sn-Bi Bi:1-4wt%
PLATING THICKNESS
5-18
m
SPEC.
25
CXP832P40A
Package Outline Unit : mm
100PIN LQFP (PLASTIC)
25
26
51
50
75
76
1
100
SONY CODE
EIAJ CODE
JEDEC CODE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
42 / COPPER ALLOY
PACKAGE STRUCTURE
DETAIL A
LQFP-100P-L01
P-LQFP100-14x14-0.5
16.0
0.2
14.0
0.1
0.5
b
(0.22)
A
1.5 0.1
+ 0.2
0.5
0.2
(15.0)
0 to 10
0.1
0.1
0.5
0.2
0.1
NOTE: Dimension "
" does not include mold protrusion.
0.7g
0.13 M
b = 0.18 0.03
( 0.18 )
(0.127)
+ 0.08
0.127 0.02
+ 0.05
DETAIL B
B
100PIN LQFP (PLASTIC)
25
26
51
50
75
76
1
100
SONY CODE
EIAJ CODE
JEDEC CODE
PACKAGE MATERIAL
LEAD TREATMENT
LEAD MATERIAL
PACKAGE MASS
EPOXY RESIN
SOLDER PLATING
42 / COPPER ALLOY
PACKAGE STRUCTURE
DETAIL A
LQFP-100P-L01
P-LQFP100-14x14-0.5
16.0
0.2
14.0
0.1
0.5
b
(0.22)
A
1.5 0.1
+ 0.2
0.5
0.2
(15.0)
0 to 10
0.1
0.1
0.5
0.2
0.1
NOTE: Dimension "
" does not include mold protrusion.
0.7g
0.13 M
b = 0.18 0.03
( 0.18 )
(0.127)
+ 0.08
0.127
0.02
+ 0.05
DETAIL B
B
LEAD PLATING SPECIFICATIONS
ITEM
LEAD MATERIAL
42 ALLOY
SOLDER COMPOSITION
Sn-Bi Bi:1-4wt%
PLATING THICKNESS
5-18
m
SPEC.
Sony Corporation
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