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Publication Number S25FL004A Revision A Amendment 1 Issue Date March 28, 2005
S25FL Family
(Serial Peripheral Interface)
S25FL004A
4-Megabit CMOS 3.0 Volt Flash Memory
with 50 Mhz SPI Bus Interface
ADVANCE
INFORMATION
Notice to Readers: The Advance Information status indicates that this
document contains information on one or more products under development
at Spansion LLC. The information is intended to help you evaluate this product.
Do not design in this product without contacting the factory. Spansion LLC
reserves the right to change or discontinue work on this proposed product
without notice.
Notice On Data Sheet Designations
Spansion LLC issues data sheets with Advance Information or Preliminary designations to advise readers of product information
or intended specifications throughout the product life cycle, including development, qualification, initial production, and full pro-
duction. In all cases, however, readers are encouraged to verify that they have the latest information before finalizing their de-
sign. The following descriptions of Spansion data sheet designations are presented here to highlight their presence and
definitions.
Advance Information
The Advance Information designation indicates that Spansion LLC is developing one or more specific products, but has not
committed any design to production. Information presented in a document with this designation is likely to change, and in some
cases, development on the product may discontinue. Spansion LLC therefore places the following conditions upon Advance In-
formation content:
"This document contains information on one or more products under development at Spansion LLC. The
information is intended to help you evaluate this product. Do not design in this product without con-
tacting the factory. Spansion LLC reserves the right to change or discontinue work on this proposed
product without notice."
Preliminary
The Preliminary designation indicates that the product development has progressed such that a commitment to production has
taken place. This designation covers several aspects of the product life cycle, including product qualification, initial production,
and the subsequent phases in the manufacturing process that occur before full production is achieved. Changes to the technical
specifications presented in a Preliminary document should be expected while keeping these aspects of production under con-
sideration. Spansion places the following conditions upon Preliminary content:
"This document states the current technical specifications regarding the Spansion product(s) described
herein. The Preliminary status of this document indicates that product qualification has been completed,
and that initial production has begun. Due to the phases of the manufacturing process that require
maintaining efficiency and quality, this document may be revised by subsequent versions or modifica-
tions due to changes in technical specifications."
Combination
Some data sheets will contain a combination of products with different designations (Advance Information, Preliminary, or Full
Production). This type of document will distinguish these products and their designations wherever necessary, typically on the
first page, the ordering information page, and pages with DC Characteristics table and AC Erase and Program table (in the table
notes). The disclaimer on the first page refers the reader to the notice on this page.
Full Production (No Designation on Document)
When a product has been in production for a period of time such that no changes or only nominal changes are expected, the
Preliminary designation is removed from the data sheet. Nominal changes may include those affecting the number of ordering
part numbers available, such as the addition or deletion of a speed option, temperature range, package type, or V
IO
range.
Changes may also include those needed to clarify a description or to correct a typographical error or incorrect specification.
Spansion LLC applies the following conditions to documents in this category:
"This document states the current technical specifications regarding the Spansion product(s) described
herein. Spansion LLC deems the products to have been in sufficient production volume such that sub-
sequent versions of this document are not expected to change. However, typographical or specification
corrections, or modifications to the valid combinations offered may occur."
Questions regarding these document designations may be directed to your local AMD or Fujitsu sales office.
Publication Number S25FL004A_00 Revision A Amendment 1 Issue Date March 28, 2005
ADVANCE
INFORMATION
S25FL Family (Serial Peripheral Interface)
S25FL004A
4-Megabit CMOS 3.0 Volt Flash Memory
with 50 Mhz SPI Bus Interface
Data Sheet
Distinctive Characteristics
Architectural Advantages
Single power supply operation
-- Full voltage range: 2.7 to 3.6 V read and program
operations
Memory Architecture
-- Eight sectors with 512 Kb each
Program
-- Page Program (up to 256 bytes) in 1.5 ms (typical)
-- Program cycles are on a page by page basis
Erase
-- 1.5 s typical sector erase time
-- 12 s typical bulk erase time
Cycling Endurance
-- 100,000 cycles per sector typical
Data Retention
-- 20 years typical
Device ID
-- JEDEC standard two-byte electronic signature
-- RES instruction one-byte electronic signature for
backward compatibility
Process Technology
-- Manufactured on 0.20 m MirrorBit
TM
process
technology
Package Option
-- Industry Standard Pinouts
-- 8-pin SO package (208 mils)
-- 8-Contact USON Package (5 x 6 mm), Pb-Free
Performance Characteristics
Speed
-- 50 MHz clock rate (maximum)
Power Saving Standby Mode
-- Standby Mode 50 A (max)
-- Deep Power Down Mode 1 A (typical)
Memory Protection Features
Memory Protection
-- W# pin works in conjunction with Status Register Bits
to protect specified memory areas
-- Status Register Block Protection bits (BP2, BP1, BP0)
in status register configure parts of memory as read-
only
Software Features
SPI Bus Compatible Serial Interface
2
S25FL Family (Serial Peripheral Interface) S25FL004A
S25FL004A_00_A1 March 28, 2005
A d v a n c e I n f o r m a t i o n
General Description
The S25FL004A device is a 3.0 Volt (2.7 V to 3.6 V) single power supply Flash
memory device. S25FL004A consists of eight sectors, each with 512 Kb memory.
Data appears on SI input pin when inputting data into the memory and on the SO
output pin when outputting data from the memory. The devices are designed to
be programmed in-system with the standard system 3.0 Volt V
CC
supply.
The memory can be programmed 1 to 256 bytes at a time, using the Page Pro-
gram instruction.
The memory supports Sector Erase and Bulk Erase instructions.
Each device requires only a 3.0 Volt power supply (2.7 V to 3.6 V) for both read
and write functions. Internally generated and regulated voltages are provided for
the program operations. This device does not require V
PP
supply.
3
S25FL Family (Serial Peripheral Interface) S25FL004A
S25FL004A_00_A1 March 28, 2005
A d v a n c e I n f o r m a t i o n
Table of Contents
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . .5
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . .7
Table 1. S25FL Valid Combinations Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Signal Description .....................................................................................8
SPI Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 1. Bus Master and Memory Devices on the SPI Bus........................................... 9
Figure 2. SPI Modes Supported............................................................................................. 9
Operating Features . . . . . . . . . . . . . . . . . . . . . . . . 10
Page Programming..................................................................................10
Sector Erase, or Bulk Erase .................................................................10
Polling During a Write, Program, or Erase Cycle ........................10
Status Register .........................................................................................10
Protection Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 2. Protected Area Sizes (S25FL004A). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Hold Condition Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 3. Hold Condition Activation................................................................................... 12
Memory Organization . . . . . . . . . . . . . . . . . . . . . . 13
Table 3. Sector Address Table S25FL004A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 4. Instruction Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Write Enable (WREN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Figure 4. Write Enable (WREN) Instruction Sequence................................................ 15
Write Disable (WRDI)...........................................................................16
Figure 5. Write Disable (WRDI) Instruction Sequence................................................ 16
Read Status Register (RDSR) . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Figure 6. Read Status Register (RDSR) Instruction Sequence.................................... 17
Figure 7. Status Register Format.......................................................................................... 17
Write Status Register (WRSR) . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 8. Write Status Register (WRSR) Instruction Sequence ................................ 18
Read Data Bytes (READ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Figure 9. Read Data Bytes (READ) Instruction Sequence.......................................... 20
Read Data Bytes at Higher Speed (FAST_READ) . . . . . . . . . . 20
Figure 10. Read Data Bytes at Higher Speed (FAST_READ) Instruction Sequence 21
Read Identification (RDID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
Figure 11. Read Identification (RDID) Instruction Sequence and Data-Out Sequence
21
Table 6. Read Identification (RDID) Data-Out Sequence . . . . . . . . . . . . . . . . . . .22
Page Program (PP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Figure 12. Page Program (PP) Instruction Sequence ..................................................... 23
Sector Erase (SE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Figure 13. Sector Erase (SE) Instruction Sequence ........................................................ 24
Bulk Erase (BE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24
Figure 14. Bulk Erase (BE) Instruction Sequence............................................................ 25
Deep Power Down (DP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
Figure 15. Deep Power Down (DP) Instruction Sequence ......................................... 26
Release from Deep Power Down (RES) . . . . . . . . . . . . . . . . . .26
Figure 16. Release from Deep Power Down Instruction Sequence......................... 27
Release from Deep Power Down and Read Electronic Signature
(RES) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Figure 17. Release from Deep Power Down and Read Electronic Signature (RES) In-
struction Sequence.................................................................................................................. 28
Power-up and Power-down . . . . . . . . . . . . . . . . . . 28
Figure 18. Power-Up Timing................................................................................................. 29
Table 7. Power-Up Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29
Initial Delivery State . . . . . . . . . . . . . . . . . . . . . . . 29
Maximum Rating . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . 29
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . 29
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 30
Table 8. DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
Figure 19. AC Measurements I/O Waveform .................................................................. 31
Table 9. Test Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 32
Table 10. AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Figure 20. SPI Mode 0 (0,0) Input Timing......................................................................... 33
Figure 21. SPI Mode 0 (0,0) Output Timing...................................................................... 33
Figure 22. HOLD# Timing.................................................................................................... 34
Figure 23. Write Protect Setup and Hold Timing during WRSR when SRWD=1 34
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . 35
S08 wide--8-pin Plastic Small Outline 208 mils Body Width Pack-
age . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
USON 8L (5x6mm) No-Lead Package . . . . . . . . . . . . . . . . . . .36
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . . 37