www.statschippac.com
FEATURES
Body Sizes: 14 x 14mm to 32 x 32mm
Package Height: 2.0mm to 3.4mm (same as QFP)
Lead Counts: 64L to 240L
Lead Pitch: 0.80mm to 0.50mm
Moisture Sensitivity: JEDEC Level 3
Wide range of open tool leadframe and die pad sizes
available
JEDEC standard compliant
Lead-free and Green material sets available
APPLICATIONS
ASIC
DSP
FPGA
PLD
High speed logic, high power microprocessors /
controllers
3D graphics, telecom, wireless, audio, CPU / GUI
14 x 14mm to 32 x 32mm
64 to 240 lead count
Lead pitch range from 0.80mm
to 0.50mm
DESCRIPTION
STATS ChipPAC's Heat Spreader Metric Quad Flat Pack
(MQFP-d) is a thermally enhanced version of the QFP
package. Thermal enhancement is achieved by an embedded
anodized aluminum heat spreader which is dropped in
during the mold process. This process allows the use of
standard leadframe while offering an added margin of
thermal performance for high power applications. The
QFP-d package offers 30% improvement (typical) in thermal
performance over standard MQFP packages.
MQFP-d
Heat Spreader Metric Quad Flat Pack
The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks
of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information
will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document.
STATS ChipPAC reserves the right to change the information at any time and without notice.
Copyright 2005. STATS ChipPAC Ltd. All rights reserved.
January 2005
Corporate Office 10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823
Global Offices USA 510-979-8000 JAPAN 81-43-351-3320 CHINA 86-21-5976-5858 MALAYSIA 603-4257-6222
KOREA 82-31-639-8911 TAIWAN 886-3-593-6565 UK 44-1483-413-700 NETHERLANDS 31-38-333-2023
MQFP-d
Heat Spreader Metric Quad Flat Pack
SPECIFICATIONS
Die Thickness
380-560
m (15-22mils) range preferred
Gold Wire
25/30
m (1.0/1.2mils) diameter, 99.999% Au
Lead Finish
85/15 Sn/Pb or Matte Tin
Marking
Laser / ink
Packing Options
JEDEC tray / tape and reel
RELIABILITY
Moisture Sensitivity Level
JEDEC Level 3
Temperature Cycling
-65C/150C, 1000 cycles
High Temperature Storage
150C, 500 hrs
Pressure Cooker Test
121C 100% RH,
2 atm, 168 hrs
Liquid Thermal Shock (opt)
-55C/125C, 1000 cycles
CROSS-SECTION
ELECTRICAL PERFORMANCE
Package
Body Size (mm)
Pad Size (mm)
Frequency
Self Inductance (nH) Self Capacitance(pF)
100L
14 x 20 x 2.7
9.0 x 9.0
100MHz
6.3~8.7
0.56~1.11
208L
28 x 28 x 3.4
10.5 x 10.5
100MHz
11.6~14.7
1.43~1.56
Notes: *Results are simulated. Data is available through 2.5GHz.
THERMAL PERFORMANCE,
ja (C/W)
Package
Body Size (mm)
Pad Size (mm)
Die Size (mm) Thermal Performance,
ja (C/W)
100L
14 x 20 x 2.7
9.0 x 9.0
7.8 x 7.8
26.6
208L
28 x 28 x 3.4
14.0 x 14.0
10.2 x 10.2
18.4
Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-7) under natural convection as defined in JESD51-2.
PACKAGE CONFIGURATIONS
Package Size (mm)
Lead Count
14 x 14 x 2.0
64, 80
14 x 14 x 2.7
64, 80
14 x 20 x 2.7
80, 100, 128
28 x 28 x 3.4
120, 128, 144, 160, 208
32 x 32 x 3.4
240
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