www.statschippac.com
FEATURES
TSSOP
Body Size: 3.0 x 4.4mm to 14.0 x 6.1mm
Lead Count: 8L to 56L
Lead Pitch: 0.50mm & 0.65mm
Package Height: 1.20mm max.
JEDEC standard compliant (MO-153)
Lead-free (Pb-free) and Green
Thermal Enhancements: ep (exposed pad)
MSOP
Body Size: 3 x 3mm
Lead Count: 8L & 10L
Lead Pitch: 0.65mm (8L) and 0.50mm (10L)
JEDEC standard compliant
Lead-free (Pb-free) and Green
Thermal enhancements: ep (exposed pad)
APPLICATIONS
Analog and Operation Amplifiers
Controllers and Drivers
Logic, Memory, and RF/Wireless
Disk drives, video/audio and consumer electronics/
appliances
Wide range of body sizes
8 to 56 lead counts
Thermally enhanced versions
available (TSSOP-ep and
MSOP-ep)
DESCRIPTION
STATS ChipPAC offers a complete line of Small Outline
Package (SOP) families including TSSOP, TSSOP-ep, and MSOP.
STATS ChipPAC's TSSOP (Thin Shrink Small Outline Package) is
suitable for applications requiring a thin profile. TSSOP is a
leadframe based, plastic encapsulated package with gull wing
shaped leads on two sides with lead count ranging from 8 to
56 leads. The ultra thin TSSOP is made possible by optimal wire
looping control during the wire bonding process as well as
optimal package warpage control during the molding process.
TSSOP is designed to fill the niche of low pin count devices
where low profile and small footprint are key design consider-
ations. The TSSOP features 0.5 and 0.65mm lead pitch, and is
ideal for low pin count analog and mixed signal devices in
handheld applications such as PDAs and mobile / cellular
phones.
Taking the reliability of Small Outline Packages (SOP) one
step further, STATS ChipPAC offers a Micro Small Outline
Package (MSOP) for applications requiring thin, small, and
high reliability. This smaller package offers a smaller footprint,
shorter wires for improved electrical connections, and better
moisture reliability (MRT/MSL).
In addition to standard TSSOP and MSOP, STATS ChipPAC
offers thermally enhanced "ep" versions featuring an exposed
die paddle for efficient heat dissipation. The exposed die
attach pad design of the TSSOP package can provide excellent
thermal dissipation by soldering the copper die attach pad
directly onto the PCB, and is ideal for low pin count analog and
mixed signal devices.
STATS ChipPAC uses the latest leadframe technology and
state of the art design and simulation tools to achieve
optimum electrical and thermal performance. STATS ChipPAC's
state of the art assembly facility and proven materials assure
high yield manufacturing and long term reliability.
TSSOP
and
MSOP
Small Outline Packages
The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks
of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information
will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document.
STATS ChipPAC reserves the right to change the information at any time and without notice.
Copyright 2005. STATS ChipPAC Ltd. All rights reserved.
January 2005
Corporate Office 10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823
Global Offices USA 510-979-8000 JAPAN 81-43-351-3320 CHINA 86-21-5976-5858 MALAYSIA 603-4257-6222
KOREA 82-31-639-8911 TAIWAN 886-3-593-6565 UK 44-1483-413-700 NETHERLANDS 31-38-333-2023
TSSOP
and
MSOP
Small Outline Packages
RELIABILITY (all)
Temperature Cycling
Condition C, -65C/150C, 1000 cycles
Temp/Humidity Test
85C/85% RH, 1000 hrs
Pressure Cooker Test
121C, 100% RH, 2 atm, 250 hrs
SPECIFICATIONS (TSSOP)
Die Thickness
9-11mil range preferred (TSSOP)
6-16mil range preferred (TSSOP-ep)
Gold Wire
20
m (0.8mils) diameter, 99.99% Au
Lead Finish
Sn/Pb (85/15%) or Matte Tin
Marking
Laser
Packing Options
Tube
SPECIFICATIONS (MSOP)
Die Thickness
6-9mil range preferred
Gold Wire
20
m (0.8mils) diameter, 99.99% Au
Lead Finish
Sn/Pb (85/15%) or Matte Tin
Marking
Laser
Packing Options
Tube
CROSS-SECTION
TSSOP
TSSOP-ep
MSOP
PACKAGE CONFIGURATIONS
Package Body Size (mm)
Lead Count
TSSOP
3.0 x 4.4
8
5.0 x 4.4
14, 16
6.5 x 4.4
2 0
7.8 x 4.4
2 4
9.7 x 4.4
3 8
7.8 x 4.4
3 0
12.5 x 6.1
4 8
14.0 x 6.1
5 6
MSOP
3.0 x 3.0
8, 10
THERMAL PERFORMANCE,
ja (C/W)
Package
Body Size (mm) Pad Size Die Size PCB Vias Thermal Performance
ja (C/W)
30L TSSOP
4.4 x 7.8 x 0.9 3.0 x 3.0 2.54 x 2.54 0 74.0
30L TSSOP-ep 4.4 x 7.8 x 0.9 3.0 x 3.0 2.54 x 2.54 9 49.5
Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-5) under natural convection as defined in JESD51.2.
ELECTRICAL PERFORMANCE:
4.4 x 9.7 x 0.9 (38L)
Conductor
Pad Size
Lead/Wire
Resistance
Inductance
Capacitance
Component
(mm)
(mm)
(mOhm)
Self (nH)
Mutual (nH)
Self (pF)
Mutual (pF)
Lead
185 x 113
0.6-3.09
5-25
0.30-1.70
0.14-0.77
0.09-0.46
0.04-0.21
Wire
1.65
99
1.36
0.37-0.65
0.08
0.01-0.02
TOTALS
104-124 1.66-3.06
0.51-1.42
0.17-0.54
0.05-0.23
Note: Results are simulated values at 100MHz.
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