www.statschippac.com
FEATURES
Body Sizes: 7 x 7mm to 14 x 14mm
Package Height: 1.0mm
Lead Counts: 32L to 128L
Lead pitch: 0.80mm to 0.40mm
Wide range of open tool leadframe and die pad
sizes available
JEDEC standard compliant
Lead-free and Green material sets available
APPLICATIONS
ASIC
DSP
Gate Array
Logic/Microprocessors/Controllers
Multimedia, PC Chipsets
7 x 7mm to 14 x 14mm
32 to 128 lead count
Lead pitch range from 0.80mm
to 0.40mm
DESCRIPTION
The Thin Profile Quad Flat Pack (TQFP) belongs to STATS
ChipPAC's QFP family. At 1.0mm body thickness, the TQFP
is the thinnest package in the QFP family. This thin package
is made possible by a well controlled low loop wire bonding
process and package warpage control during the molding
process. TQFP is suitable for mainstream cost sensitive
applications where thickness and weight are premium.
TQFP
Thin Profile Quad Flat Pack
The STATS ChipPAC logo is a registered trademark of STATS ChipPAC Ltd. All other product names and other company names herein are for identification purposes only and may be the trademarks or registered trademarks
of their respective owners. STATS ChipPAC disclaims any and all rights in those marks. STATS ChipPAC makes no guarantee or warranty of its accuracy in the information given, or that the use of such information
will not infringe on intellectual rights of third parties. Under no circumstances shall STATS ChipPAC be liable for any damages whatsoever arising out of the use of, or inability to use the materials in this document.
STATS ChipPAC reserves the right to change the information at any time and without notice.
Copyright 2005. STATS ChipPAC Ltd. All rights reserved.
January 2005
Corporate Office 10 Ang Mo Kio St. 65, #05-17/20 Techpoint, Singapore 569059 Tel: 65-6824-7777 Fax: 65-6720-7823
Global Offices USA 510-979-8000 JAPAN 81-43-351-3320 CHINA 86-21-5976-5858 MALAYSIA 603-4257-6222
KOREA 82-31-639-8911 TAIWAN 886-3-593-6565 UK 44-1483-413-700 NETHERLANDS 31-38-333-2023
TQFP
Thin Profile Quad Flat Pack
PACKAGE CONFIGURATIONS
Package Size (mm)
Lead Count
7 x 7
32, 48
10 x 10
44, 52, 64
12 x 12
80, 100
14 x 14
100, 128
SPECIFICATIONS
Die Thickness
230-280
m (9-11mils) range preferred
Gold Wire
25/30
m (1.0/1.2mils) diameter, 99.999%Au
Lead Finish
85/15 Sn/Pb or Matte Tin
Marking
Laser/ink
Packing Options
JEDEC tray/tape and reel
RELIABILITY
Moisture Sensitivity Level
JEDEC Level 3
Temperature Cycling
-65C/150C, 1000 cycles
High Temperature Storage
150C, 500 hrs
Pressure Cooker Test
121C 100% RH,
2 atm, 168 hrs
Liquid Thermal Shock (opt)
-55C/125C, 1000 cycles
THERMAL PERFORMANCE,
ja (C/W)
Package
Body Size (mm)
Pad Size (mm)
Die Size (mm) Thermal Performance,
ja (C/W)
48L
7 x 7 x 1.0
5.3 x 5.3
3.8 x 3.8
53.4
100L
14 x 14 x 1.0
9.0 x 9.0
7.8 x 7.8
38.6
Note: Simulation data for package mounted on 4 layer PCB (per JEDEC JESD51-7) under natural convection as defined in JESD51-2.
CROSS-SECTION
ELECTRICAL PERFORMANCE
Electrical parasitic data is highly dependent on the package layout. 3D electrical simulation can be used on the specific package design
to provide the best prediction of electrical behavior. Data below is for a frequency of 100MHz and assumes 1.0 mil gold bonding wire.
Conductor
Length
Resistance
Inductance
Inductance
Capacitance
Capacitance
Component
(mm)
(mOhms)
(nH)
Mutual (nH)
(pF)
Mutual (pF)
Wire
2
120
1.65
0.45 - 0.85
0.10
0.01 - 0.02
Lead (7 x 7mm, 32L)
1.4 - 2.2
11.0 - 18.0
0.64 - 0.99
0.31 - 0.49
0.21 - 0.33
0.07 - 0.12
Total (7 x 7mm, 32L)
131 - 138
2.29 - 2.64
0.76 - 1.34
0.31 - 0.43
0.08 - 0.14
Wire
2
120
1.65
0.45 - 0.85
0.10
0.01 - 0.02
Lead (14 x 14mm, 128L)
3.0 - 4.5
24.0 - 36.0
1.96 - 2.92
1.08 - 1.61
0.45 - 0.67
0.20 - 0.30
Total (14 x 14mm, 128L)
144.0 - 156.0
3.61 - 4.57
1.53 - 2.46
0.55 - 0.77
0.21 - 0.32
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