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Электронный компонент: 1N5908

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1N5908
SM5908
TRANSIL
TM
UNIDIRECTIONAL TRANSIL DIODE
PEAK PULSE POWER : 1500 W (10/1000
s)
REVERSE STAND OFF VOLTAGE : 5 V
LOW CLAMPING FACTOR
FAST RESPONSE TIME
UL RECOGNIZED
FEATURES
CB429
SMC
Symbol
Parameter
Value
Unit
P
PP
Peak pulse power dissipation (see note1)
Tj initial = T
amb
1500
W
P
Power dissipation on infinite heatsink
T
amb
= 75
C
5
W
I
FSM
Non repetitive surge peak forward current
for unidirectional types
t
p
= 10ms
T
j
initial = T
amb
200
A
T
stg
Tj
Storage temperature range
Maximum junction temperature
- 65 to + 175
175
C
C
T
L
Maximum lead temperature for soldering
during 10s (at 5mm from case for CB429)
CB429
SMC
230
260
C
C
Note 1 : For a surge greater than the maximum values, the diode will fail in short-circuit.
ABSOLUTE MAXIMUM RATINGS (T
amb
= 25
C).
DESCRIPTION
The 1N5908 and SM5908 are dedicated to the 5 V
logic circuit protection(TTL and CMOS technologies).
Their low clamping voltage at high current level
guarantees excellent protection for sensitive
components.
August 1999 Ed : 2A
Symbol
Parameter
Value
Unit
R
th (j-l)
Junction to leads
20
C/W
R
th (j-a)
Junction to ambient
on printed circuit.
L lead = 10 mm
CB429
75
C/W
On recommended pad layout
SMC
75
C/W
THERMAL RESISTANCES
1/6
I
V
F
V
I
RM
I
PP
V
CL
V
BR
V
RM
I
F
Symbol
Parameter
V
RM
Stand-off voltage
V
BR
Breakdown voltage
V
CL
Clamping voltage
I
RM
Leakage current @ V
RM
I
PP
Peak pulse current
T
Voltage temperature coefficient
V
F
Forward voltage
ELECTRICAL CHARACTERISTICS(T
amb
= 25
C)
Types
I
RM
@ V
RM
V
BR
@ I
R
V
CL
@ I
PP
V
CL
@ I
PP
V
CL
@ I
PP
T
C
max
min
max
max
max
max
typ
note2
10/1000
s
10/1000
s
10/1000
s
note3
note4
A
V
V
mA
V
A
V
A
V
A
10
-4
/
C
pF
1N5908
SM5908
300
5
6
1
7.6
30
8
60
8.5
120
5.7
9500
Fig. 1: Peak pulse power dissipation versus
initial junction temperature (printed circuit board).
% I
PP
10 s
100
50
0
1000 s
t
Note 2 :
Pulse test : tp < 50ms
Note 3 :
V
BR
=
T*(T
amb
-25)* V
BR
(25
C).
Note 4 :
V
R
= 0V, F = 1 MHz
1N5908/SM5908
2/6
Fig. 2 : Peak pulse power versus exponential pulse duration.
Fig. 3 :
Clamping voltage versus peak pulse current.
Exponential waveform
t
p
= 10 ms...............
t
p
= 1 ms-------------
t
p
= 20
s________
Note : The curves of the figure 3 are specified for a junction temperature of 25
C before surge.
The given results may be extrapolated for other junction temperatures by using the following formula :
V
BR
=
T
*
(T
amb
- 25)
*
V
BR
(25
C).
1N5908/SM5908
3/6
Fig. 6b : SMC Package.
Mounting on FR4 PC Board with recommended
pad layout.
Fig. 5 : Peak forward voltage drop versus peak
forward current.
Fig. 6a : CB429 Package.
(For FR4 PC Board with L
lead
= 10 mm)
Fig. 4 : Capacitance versus reverse applied
voltage (typical values).
Fig. 6a/6b : Transient thermal impedance junction-ambient versus pulse duration.
Fig. 7 : Relative variation of leakage current
versus junction temperature.
1N5908/SM5908
4/6
Package
Type
Marking
SMC
SM5908
MDC
CB429
1N5908
1N5908
A white band indicates the cathode
MARKING : Logo, type code and cathode band
Packaging : Standardpackaging is in tape and reel.
PACKAGE MECHANICAL DATA
SMC
(Plastic)
REF.
DIMENSIONS
Millimeters
Inches
Min.
Max.
Min.
Max.
A1
1.90
2.45
0.075
0.096
A2
0.05
0.20
0.002
0.008
b
2.90
3.2
0.114
0.126
c
0.15
0.41
0.006
0.016
E
7.75
8.15
0.305
0.321
E1
6.60
7.15
0.260
0.281
E2
4.40
4.70
0.173
0.185
D
5.55
6.25
0.218
0.246
L
0.75
1.60
0.030
0.063
Weight = 0.25 g.
FOOT PRINT (in millimeters)
ORDER CODE
1N5908 RL
SM 5908
Packaging :
= Ammopack tape
RL = Tape and reel
Surface mount
2.0
4.2
2.0
3.3
E
C
L
E2
E1
D
A1
A2
b
Numerical code
Device code
1N5908/SM5908
5/6