BYT 13-600
1000
FAST RECOVERY RECTIFIER DIODES
SOFT RECOVERY
VERY HIGH VOLTAGE
SMALL RECOVERY CHARGE
APPLICATIONS
ANTISATURATION DIODES FOR TRANSIS-
TOR BASE DRIVE
SNUBBER DIODES
August 1998 Ed : 1B
DO-201AD
(Plastic)
Symbol
Parameter
Value
Unit
I
FRM
Repetive Peak Forward Current
t
p
20
s
50
A
I
F (AV)
Average Forward Current *
T
a =
55
C
= 0.5
3
A
I
FSM
Surge non Repetitive Forward Current
t
p
= 10ms
Sinusoidal
100
A
P
tot
Power Dissipation *
T
a =
55
C
3.75
W
T
stg
T
j
Storage and Junction Temperature Range
- 40 to + 150
- 40 to + 150
C
T
L
Maximum Lead Temperature for Soldering during 10s at 4mm
from Case
230
C
ABSOLUTE MAXIMUM RATINGS (limiting values)
Symbol
Parameter
Value
Unit
R
th (j - a)
Junction-ambient*
25
C/W
THERMAL RESISTANCE
Symbol
Parameter
BYT 13-
Unit
600
800
1000
V
RRM
Repetitive Peak Reverse Voltage
600
800
1000
V
* On infinite heatsink with 10mm lead length.
1/4
2/4
Synbol
Test Conditions
Min.
Typ.
Max.
Unit
I
R
T
j
= 25
C
V
R
= V
RRM
20
A
V
F
T
j
= 25
C
I
F
= 3A
1.3
V
STATIC CHARACTERISTICS
ELECTRICAL CHARACTERISTICS
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
t
rr
T
j
= 25
C I
F
= 0.5A I
R
= 1A I
rr
= 0.25A
150
ns
RECOVERY CHARACTERISTICS
To evaluate the conduction losses use the following equations:
V
F
= 0.95 + 0.050 I
F
P = 0.95 x I
F(AV)
+ 0.050 I
F
2
(RMS)
F i gu re 1. M ax i mum ave ra ge p ower
dissipation versus average forward current.
Figure 2. Average forward current versus
ambient temperature.
Figure 3. Thermal resistance versus lead
length.
Mounting n1
INFINITE HEATSINK
Mounting n2
PRINTED CIRCUIT
BYT13-600
1000
Figure 4. Transient thermal impedance
junction-ambient for mounting n2 versus
pulse duration (L = 10 mm).
Figure 5. Peak forward current
versus peak forward voltage drop
(maximum values).
Figure 6. Capacitance versus reverse applied
voltage
Figure 7. Non repetitive surge peak current
versus number of cycles
3/4
BYT 13-600
1000
4/4
DO-201AD (Plastic)
PACKAGE MECHANICAL DATA
B
A
E
E
D
D
C
B
note 2
note 1
note 1
REF.
DIMENSIONS
NOTES
Millimeters
Inches
Min.
Max.
Min.
Max.
A
9.50
0.374 1 - The lead diameter
D is not controlled over zone E
2 - The minimum axial lengh within which the device may be
placed with its leads bent at right angles is 0.59"(15 mm)
B
25.40
1.000
C
5.30
0.209
D
1.30
0.051
E
1.25
0.049
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of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to
change without notice. This publication supersedes and replaces all information previously supplied.
STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval
of STMicroelectronics.
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1998 STMicroelectronics - Printed in Italy - All rights reserved.
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Marking : type number, white band indicates cathode
Cooling method : by convection (method A)
Weight : 1.166g
BYT13-600
1000
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