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Электронный компонент: DB-55008-500

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June 2006
Rev 1
1/18
18
DB-55008-500
RF POWER amplifier using 1 x PD55008
N-Channel enhancement-mode lateral MOSFETs
General feature
Excellent thermal stability
Frequency: 400 - 500MHz
Supply voltage: 12.5V
Output power: 8W
Efficiency: 48% - 54%
Load mismatch: 20:1
Beo free amplifier
Description
The DB-55008-500 is a common source N-
Channel Enhancement-Mode Lateral Field Effect
RF power amplifer designed as driver for UHF
Mobile radio applications
Order Code
DB-55008-500
Mechanical specification:
L = 70 mm, W = 30 mm
www.st.com
Contents
DB-55008-500
2/18
Contents
1
Electrical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3
Typical performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4
Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5
Circuit layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
6
Mounting indications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
7
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
8
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
DB-55008-500
Electrical data
3/18
1 Electrical
data
1.1 Maximum
ratings
Table 1.
Absolute maximum ratings
Symbol
Parameter
Value
Unit
V
DD
Supply voltage
16
V
I
D
Drain current
3
A
T
CASE
Operating case temperature
-20 to +85
C
T
A
Max. ambient temperature
+55
C
Electrical characteristics
DB-55008-500
4/18
2 Electrical
characteristics
T
A
= +25
o
C, V
DD
= 12.5V, I
DQ
= 100 mA
Table 2.
Electrical Specification
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Freq
Frequency range
400
500
MHz
P
OUT
8
10
W
Gain
@ P
OUT
= 8W
13.9
0.7dB
dB
ND
@ P
OUT
= 8W
48
54
%
H2
2
ND
Harmonic @ P
OUT
= 8W
-53
-50
dBc
H3
3
RD
Harmonic @ P
OUT
= 8W
-60
-55
dBc
VSWR
Load mismatch all phases @ P
OUT
= 8W
20:1
DB-55008-500
Typical performance
5/18
3 Typical
performance
Figure 1.
Output power vs input power Figure 2.
Gain vs output power
Figure 3.
Drain efficiency vs
ouptut power
Figure 4.
Gain vs frequency
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
0
0
0
0
0
1
1
1
1
1
1
1
Input Power (W)
Ou
t
p
u
t
P
o
we
r (
W
)
380
400
420
440
460
480
500
12.5
100
Vdd=
m A
V
Idq=
6
7
8
9
10
11
12
13
14
15
16
17
18
0
2
4
6
8
10
12
14
Pout (W)
G
a
in
(
d
B
)
380
400
420
440
460
480
500
12.5
100
Vdd=
m A
V
Idq=
10
15
20
25
30
35
40
45
50
55
60
65
70
0
2
4
6
8
10
12
14
Pout (W)
Ef
f
(
%
)
380
400
420
440
460
480
500
12.5
100
Vdd=
m A
V
Idq=
4
6
8
10
12
14
16
18
360
380
400
420
440
460
480
500
520
540
Freq (MHz)
G
a
in
(
d
B
)
Pout = 8W
Typical performance
DB-55008-500
6/18
Figure 5.
Efficiency vs frequency
Figure 6.
Input return loss vs
frequency
20
25
30
35
40
45
50
55
60
65
70
75
80
360 380 400 420 440 460 480 500 520 540
Freq (MHz)
E
ff.
(%
)
-18
-16
-14
-12
-10
-8
-6
-4
-2
0
360 380 400 420 440 460 480 500 520 540 560 580
Freq (MHz)
RT
L
(d
B
)
DB-55008-500
Typical performance
7/18
Figure 7.
Harmonics vs frequency
Figure 8.
Output power vs drain supply voltage
-75
-70
-65
-60
-55
-50
-45
-40
360
380
400
420
440
460
480
500
520
540
Freq (MHz)
H
a
r
m
oni
c
s
(
d
B
c
)
H2
H3
0
4
8
12
16
20
24
4
6
8
10
12
14
16
18
20
Vdd (V)
P
out
(
W
)
380
400
420
440
460
480
500
520
Pin= 30dBm
Test circuit
DB-55008-500
8/18
4 Test
circuit
Figure 9.
Test circuit schematic
DB-55008-500
Circuit layout
9/18
5 Circuit
layout
Figure 10.
Circuit layout
PD55008
Circuit layout
DB-55008-500
10/18
Table 3.
Components part list for DB-55008-500
Part Type
Component ID
Description
Value
Case
size
Manufacturer
Part Code
CAP
C1
Capacitor
120 pF
1206
Murata
GRM42-6C0G121J50
CAP
C2
Capacitor
120 pF
1206
Murata
GRM42-6C0G121J50
CAP
C3
Capacitor
1 nF
1206
Murata
GRM42-6C0G102J50
CAP
C4
Capacitor
10 nF
1206
Murata
GRM42-6X7R104K50
Electrolytic
CAP
C5
Capacitor
10 uF
SMT
Panasonic
EEVHB1V100P
CAP
C6
Capacitor
330 pF
100B
ATC
331
CAP
C7
Capacitor
330pF
100B
ATC
331
CAP
C8
Capacitor
12 pF
100B
ATC
120
CAP
C9
Capacitor
39 pF
100B
ATC
390
CAP
C10
Capacitor
43 pF
100B
ATC
430
CAP
C11
Capacitor
12 pF
100B
ATC
120
TL
TL1, TL7
Transmission
Line
W = 2.87 mm L = 7 mm
TL
TL2
Transmission
Line
W = 4.9 mm L = 5 mm
TL
TL3, TL4
Transmission
Line
W = 6 mm L = 3 mm
TL
TL5
Transmission
Line
W = 4.9 mm L = 2.5 mm
TL
TL6
Transmission
Line
W = 4.9 mm L = 2.5 mm
Ferrite Bead
B1
Ferrite Bead
PANASONIC
EXCELDRC35C
Ferrite Bead
B2
Ferrite Bead
PANASONIC
EXCELDRC35C
INDUCTOR
L1
Inductor
35.5nH
Coilcraft Mini
Spring
B09TJ
INDUCTOR
L2
Inductor
3.85 nH
Coilcraft Micro
Spring
0906-4J
INDUCTOR
L3
Inductor
8 nH
Coilcraft Mini
Spring
A03TJ
TRANSISTOR
PD55008
LDMOS
STMicroelectronics
PD55008
Resistor
R1
Resistor
15 ohms
1206
TYCO
ELECTRONICS
01623440-1
POT
R2
Potentiometer
10 K
BOURNS
ELECTRONICS
3214W-1-103E
Resistor
R3
Resistor
1K
1206
TYCO
ELECTRONICS
01623440-1
SMA-CONN
RF in
SMA-CONN
Johnson
142-0701-801
SMA-CONN
RF out
SMA-CONN
Johnson
142-0701-801
ZENER
D1
Zener Diode
5.1 V
SOD110
PHILIPS
BZX284C5V1
BOARD
FR-4 THk=0.060" 2OZ Cu Both Sides
DB-55008-500
Mounting indications
11/18
6 Mounting
indications
Figure 11. Standard SMD mounting
Mounting indications
DB-55008-500
12/18
Figure 12
shows the recommeded solder for devices that have Pb-free terminal plating and
where a Pb-free solder is used.
Figure 12.
Recommended solder profile
Figure 13
shows the recommeded solder for devices with Pb-free terminal plating used with
leaded solder, or for devices with leaded terminal plating used with a leaded solder.
Figure 13.
Recommended solder profile for leaded devices
DB-55008-500
Package mechanical data
13/18
7
Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at:
www.st.com
Package mechanical data
DB-55008-500
14/18
Note:
Resin protrusions not included (max value: 0.15 mm per side)
Table 4.
PowerSO-10RF Formed lead (Gull Wing) Mechanical data
Dim.
mm.
Inch
Min.
Typ.
Max.
Min.
Typ.
Max.
A1
0
0.05
0.1
0.
0.0019
0.0038
A2
3.4
3.5
3.6
0.134
0.137
0.142
A3
1.2
1.3
1.4
0.046
0.05
0.054
A4
0.15
0.2
0.25
0.005
0.007
0.009
a
0.2
0.007
b
5.4
5.53
5.65
0.212
0.217
0.221
c
0.23
0.27
0.32
0.008
0.01
0.012
D
9.4
9.5
9.6
0.370
0.374
0.377
D1
7.4
7.5
7.6
0.290
0.295
0.298
E
13.85
14.1
14.35
0.544
0.555
0.565
E1
9.3
9.4
9.5
0.365
0.37
0.375
E2
7.3
7.4
7.5
0.286
0.292
0.294
E3
5.9
6.1
6.3
0.231
0.24
0.247
F
0.5
0.019
G
1.2
0.047
L
0.8
1
1.1
0.030
0.039
0.042
R1
0.25
0.01
R2
0.8
0.031
T
2 deg
5 deg
8 deg
2 deg
5 deg
8 deg
T1
6 deg
6 deg
T2
10 deg
10 deg
DB-55008-500
Package mechanical data
15/18
Figure 14.
Package dimensions
Figure 15. PowerSO-10RF Tape & reel
Critical dimensions:
- Stand-off (A1)
- Overall width (L)
Package mechanical data
DB-55008-500
16/18
Figure 16.
Tube information
DB-55008-500
Revision history
17/18
8 Revision
history
Table 5.
Revision history
Date
Revision
Changes
13-Jun-2006
1
Initial release.
DB-55008-500
18/18
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