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EMIF04-VID01F2
4 LINES LOW CAPACITANCE EMI FILTER
AND ESD PROTECTION
REV. 1
February 2005
IPADTM
Flip-Chip
(10 Bumps)
Figure 1: Pin Configuration (ball side)
I2
O2
I4
Gnd
Gnd
O4
I1
O1
I3
O3
6
5
4
3
2
1
A
B
C
TM: IPAD is a trademark of STMicroelectronics.
Table 1: Order Code
Part Number
Marking
EMIF04-VID01F2
GU
MAIN APPLICATION
Where EMI filtering in ESD sensitive equipment is
required:
LCD and camera for mobile phones
Computers and printers
Communication systems
MCU board
DESCRIPTION
The EMIF04-VID01F2 is a 4 lines highly integrated
array designed to suppress EMI / RFI noise in all
systems subjected to electromagnetic interferenc-
es.
The EMIF04-VID01F2 Flip-Chip packaging means
the package size is equal to the die size.
Additionally, this filter includes an ESD protection
circuitry which prevents the protected device from
destruction when subjected to ESD surges up to
15 kV.
BENEFITS
High efficiency EMI filtering (-40db @ 900MHz)
Low line capacitance suitable for high speed
data bus
Low serial resistance for camera impedance
adaptation
Lead free package
Optimized PCB space consuming:
1.92mm x 1.29mm
Very thin package: 0.65 mm
High efficiency in ESD suppression on inputs
pins (IEC61000-4-2 level 4)
High reliability offered by monolithic integration
High reducing of parasitic elements through
integration & wafer level packaging
Reduce compnents counts and BOM
COMPLIES WITH THE FOLLOWING STANDARDS:
IEC61000-4-2
Level 4 on input pins
15kV (air discharge)
8kV (contact discharge)
MIL STD 883E - Method 3015-6 Class 3
Figure 2: Configuration
R = 100
C
= 16pF typ. @ 3V
LINE
Input
R
Output
EMIF04-VID01F2
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Table 2: Absolute Ratings (limiting values)
Table 3: Electrical Characteristics (T
amb
= 25C)
Symbol
Parameter and test conditions
Value
Unit
T
j
Maximum junction temperature
125
C
T
op
Operating temperature range
- 40 to + 85
C
T
stg
Storage temperature range
- 55 to + 150
C
Symbol
Parameter
V
BR
Breakdown voltage
I
RM
Leakage current @ V
RM
V
RM
Stand-off voltage
R
Series resistance between Input &
Output
C
line
Input capacitance per line
Symbol
Test conditions
Min.
Typ.
Max.
Unit
V
BR
I
R
= 1mA
6
8
10
V
I
RM
V
RM
= 3V per line
500
nA
R
I = 10mA
80
100
120
C
line
V
R
= 3V DC 1MHz V
OSC
= 30mV
16
19
pF
I
V
V
BR
V
RM
I
RM
I
R
I
RM
I
R
V
RM
V
BR
EMIF04-VID01F2
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Figure 3: S21 (dB) attenuation measurement
Figure 4: Analog crosstalk measurement
Figure 5: ESD response to IEC61000-4-2
(+15kV air discharge) on one input V(in) and on
one output (Vout)
Figure 6: ESD response to IEC61000-4-2 (-15kV
air discharge) on one input V(in) and on one
output (Vout)
Figure 7: Junction capacitance versus reverse
voltage applied (typical values)
100k
1M
10M
100M
1G
-60
-50
-40
-30
-20
-10
0
dB
f/Hz
100k
1M
10M
100M
1G
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
dB
f/Hz
Input
10V/d
Output
10V/d
200ns/d
Input
10V/d
Output
10V/d
200ns/d
V
(V)
LINE
C
(pF)
LINE
10
12
14
16
18
20
22
24
26
28
0.0
0.5
1.0
1.5
2.0
2.5
3.0
10
12
14
16
18
20
22
24
26
28
0.0
0.5
1.0
1.5
2.0
2.5
3.0
EMIF04-VID01F2
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Figure 8: Ordering Information Scheme
Figure 9: FLIP-CHIP Package Mechanical Data
Figure 10: Foot Print Recommendations
Figure 11: Marking
EMIF yy - xxx zz Fx
EMI Filter
Number of lines
Information
Package
x = resistance value (Ohms)
z = capacitance value / 10(pF)
or
3 letters = application
2 digits = version
F2 = Leadfree Flip-Chip
x
= 1: 500m, Bump = 315m
= 2: Leadfree Pitch = 500m, Bump = 315m
1.92mm 50m
1.29mm 50m
435m 50
315m 50
501m
50
500m 50
250m 50
650m 65
Copper pad Diameter :
250m recommended , 300m max
Solder stencil opening : 330m
Solder mask opening recommendation :
340m min for 300m copper pad diameter
Dot, ST logo
xx = marking
yww = date code
(y = year
ww = week)
z = packaging location
365
365
240
40
220
x
y
z
w
x
w
All dimensions in m
E
EMIF04-VID01F2
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Figure 12: FLIP-CHIP Tape and Reel Specification
Dot identifying Pin A1 location
User direction of unreeling
All dimensions in mm
4 +/- 0.1
8 +/- 0.3
4 +/- 0.1
1.75 +/- 0.1
3.5 +/- 0.1
1.5 +/- 0.1
0.73 +/- 0.05
xxx
yww
ST
E
xxx
yww
ST
E
xxx
yww
ST
E
Table 4: Ordering Information
Note: More packing informations are available in the application note
AN1235: "Flip-Chip: Package description and recommendations for use"
AN1751: "EMI Filters: Recommendations and measurements"
Ordering code
Marking
Package
Weight
Base qty
Delivery mode
EMIF04-VID01F2
GU
Flip-Chip
3.6 mg
5000
Tape & reel 7"
Table 5: Revision History
Date
Revision
Description of Changes
15-Feb-2005
1
First issue.
EMIF04-VID01F2
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Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a registered trademark of STMicroelectronics.
All other names are the property of their respective owners
2005 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
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