TDA1175P

LOW-NOISE VERTICAL DEFLECTION SYSTEM

August 1995

RAMP GENERATOR

COMPENSATION

AMP. INPUT

GROUND

OSCILLATOR

SYNC. INPUT

HEIGHT ADJUSTMENT

RAMP OUTPUT

SUPPLY VOLTAGE

FLYBACK

GROUND

POWER AMPLIFIER OUTPUT

POWER AMPLIFIER

SUPPLY VOLTAGE

REGULATED VOLTAGE

1175P-01.EPS

PIN CONNECTIONS

POWERDIP16

(Plastic Package)

ORDER CODE : TDA1175P

COMPLETE VERTICAL DEFLECTION
SYSTEM

LOW NOISE

SUITABLE FOR HIGH DEFINITION
MONITORS

ESD PROTECTED

DESCRIPTION

The TDA1175P is a monolithic integrated circuit in
POWERDIP16 plastic package. It is intended for
use in black and white and colour TV receivers.
Low-noise makes this device particularly suitable
for use in monitors.
The functions incorporated are : synchronization
circuit, oscillator and ramp generator, high power
gain amplifier, flyback generator, voltage regulator.

1/8

OSCILLATOR

VOLTAGE

REGULATOR

BUFFER

STAGE

SYNC

CIRCUIT

RAMP

GENERATOR

FLYBACK

GENERATOR

SYNC

YOKE

LINEARITY

TABS

HEIGHT

FREQ

+ V

POWER

AMPLIFIER

PREAMPLIFIER

TDA1175P

1175P-02.EPS

BLOCK DIAGRAM

ABSOLUTE MAXIMUM RATINGS

Symbol

Parameter

Value

Unit

Supply Voltage at Pin 2

, V

Flyback Peak Voltage

Power Amplifier Input Voltage

+ 10

� 0.5

V
V

Output Peak Current (non repetitive) at t = 2ms

Output Peak Current at f = 50Hz, t

�

2.5

Output Peak Current at f = 50Hz, t > 10

�

1.5

Pin 3 DC Current at V

< V

100

Pin 3 Peak to Peak Flyback Current for f = 50Hz, t

fly

1.5ms

1.8

Pin 10 Current

�

to t

Power Dissipation : at T

ta b

= 90

�

at T

amb

= 70

�

C (free air) (1)

4.3

W
W

stg

, T

Storage and Junction Temperature

� 40, + 150

�

1175P-01.TBL

THERMAL DATA

Symbol

Parameter

Value

Unit

th (j-tab)

Thermal Resistance Junction-pin

Max.

�

C/W

th (j-amb)

Thermal Resistance Junction-ambient

Max.

�

C/W

(1)

1175P-02.TBL

(1) Obtained with tabs soldered to printed circuit with minimized copper area.

TDA1175P

2/8

ELECTRICAL CHARACTERISTICS (T

amb

= 25

�

C, unless otherwise specified)

Symbol

Parameter

Test Conditions

Min.

Typ.

Max.

Unit

Fig.

DC CHARACTERISTICS (Refer to the test circuits, V

= 35V)

Pin 2 Quiescent Current

= 0

Pin 7 Quiescent Current

= 0

� I

Oscillator Bias Current

= 1V

0.1

�

� I

Amplifier Input Bias Current

= 1V

�

� I

Ramp Generator Bias Current

= 0

0.02

0.3

�

� I

Ramp Generator Current

= 20

�

A, V

= 0

18.5

21.5

�

Ramp Generator Non-linearity

= 0 to 12V, I

= 20

�

0.2

Supply Voltage Range

Pin 1 Saturation Voltage to Ground

= 1mA

1.4

Pin 3 Saturation Voltage to Ground

= 10mA

1.5

2.5

Qiuescent output Voltage

= 10V, R1 = 1k

, R2 = 1k

= 35V, R1 = 3k

, R2 = 1k

4.1
8.2

4.4
8.8

4.7
9.4

V
V

1a
1a

Output Saturation Voltage to
Ground

� I

= 0.1A

� I

= 0.8A

0.9
1.8

1.2
2.2

1c
1c

Output Saturation Voltage to Supply I

= 0.1A

= 0.8A

1.4
2.8

2.1
3.1

V
V

1d
1d

Regulated Voltage at Pin 8

6.5

6.7

6.9

Regulated Voltage at Pin 9

= 20

�

6.6

6.8

Regulated Voltage Drift with Supply
Voltage

Vs = 10 to 35V

mV/V

Amplifier Input Reference Voltage

0.4V

2.20

2.27

2.35

AC CHARACTERISTICS (Refer to the AC test circuit, V

= 22V, f = 50Hz)

Supply Current

= 1A

140

Sync. Input Current (positive or
negative)

0.5

Flyback Voltage

= 1A

fly

Flyback Time

= 1A

0.7

Peak to Peak Output Noise

Pin 11 Connected to GND

mVpp

Free Running Frequency

(P1 + R1) = 300k

C9 = 0.1

�

43.5

OPER

Operating Frequency Range

120

Synchronization Range

= 0.5mA, C9 = 0.1

�

(P1+R1) = 300k

Frequency Drift with Supply Voltage V

= 10 to 35V

0.005

Hz/V

Frequency Drift with tab
Temperature

tab

= 40 to 120

�

0.01

Hz/

�

1175P-03.TBL

TDA1175P

3/8

Figure 1 : DC Test Circuits

TABS

- I

TDA1175P

1175P-03.EPS

Figure 1a

TABS

- I

TDA1175P

- I

100k

1175P-04.EPS

Figure 1b

TABS

TDA1175P

1175P-05.EPS

Figure 1c

TABS

TDA1175P

1175P-06.EPS

Figure 1d

TDA1175P

4/8

22k

470pF

220k

910k

0.1

�

100k

47k

0.1

�

3.3

100pF

0.1

�

5.6k

�

5.6k

100k

120k

1.8k

100k

220k

C9
0.1

�

Yoke
Ry = 10

Ly = 20mH

560

1000

�

SYNC.

INPUT

TABS

1N4001

470

�

100

�

0.1

�

= 22V

* on application only

TDA1175P

1175P-07.EPS

Figure 2 : AC Test and Application Circuit for Large Screen B/W TV Set 10

/20mH/1A

C6
0.1

�

C7
0.1

�

82k

100k

0.15

�

C3
100

�

35V

3.3k

D1
1N4007

C2
1000

�

35V

0.1

�

(26V)

R12

220k

C10 560pF

3.3nF

TDA1175P

R13
3. 3

C11
0. 1

�

50k

V.LIN

56k

47k

R10

0.82

R9
5.1k

R11

2.7k

27k

�

35V

R3
240k

1.8nF

V. SIZE

220k

200k

V. FREQ

Y1
YOKE

R14

220

1/2W

C12

470

�

50V

1175P-08.EPS

Figure 3 : Typical Application Circuit for VGA Monitor (R

= 10

, L

= 20mH, I

= 0.8A

)

TDA1175P

5/8

GN D

R11

R18

R12

C18

C12

V-FREQ

V-SIZE

V S

V.LIN

R14

R10

C11

IC1

1175P-09.EPS

Figure 4 : P.C. Board and Components Layout of the Circuit of Figure 3 (1:1 scale)

Item

Qty

Reference

Part

C1, C6, C7, C11

0.1

�

1000

�

F 35V

100

�

F 35V

0.15

�

1.8nF

�

F 35V

3.3nF

C10

560pF

C12

470

�

F 50V

1N4007

IC1

TDA1175P

100k

POT

220k

POT

50k

POT

3.3k

Item

Qty

Reference

Part

82k

240k

200k

56k

27k

47k

5.1k

R10

0.82

R11

2.7k

R12

220k

R13

3.3

R14

220

1/2W

YOKE

1175P-04.TBL

BILL OF MATERIAL

TDA1175P

6/8

1175P-12.EPS

Figure 7 : Maximum Power Dissipation and

Junction-ambient Thermal
Resistance versus "I"

1175P-13.EPS

Figure 8 : Maximum Allowable Power Dissipation

versus Ambient Temperature

The R

th (j-a)

can be reduced by soldering the GND

pins to a suitable copper area of the printed circuit
board (Figure 5) or to an external heatsink (Fig-
ure 6).

The diagram of Figure 7 shows the maximum
dissipable power P

tot

and the R

th (j-a)

as a function

of the side "I" of two equal square copper areas

having a thicknessof 35

�

(1.4 mils).

During soldering the pins temperature must not
exceed 260

�

C and the soldering time must not be

longer than 12 seconds.

The external heatsink or printed circuit copper area
must be connected to electrical ground.

MOUNTING INSTRUCTION

1175P-10.EPS

Figure 5 : Example of P.C. Board Copper Area

1175P-11.EPS

Figure 6 : External Heatsink Mounting Example

TDA1175P

7/8

PMDIP16W.EPS

PACKAGE MECHANICAL DATA
16 PINS - PLASTIC POWERDIP

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility
for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result
from its use. No licence is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life
support devices or systems without express written approval of SGS-THOMSON Microelectronics.

�

Purchase of I

C Components of SGS-THOMSON Microelectronics, conveys a license under the Philips

C Patent. Rights to use these components in a I

C system, is granted provided that the system conforms to

the I

C Standard Specifications as defined by Philips.

SGS-THOMSON Microelectronics GROUP OF COMPANIES

Australia - Brazil - China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco

The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.

Dimensions

Millimeters

Inches

Min.

Typ.

Max.

Min.

Typ.

Max.

0.51

0.020

0.85

1.4

0.033

0.055

0.5

0.020

0.38

0.5

0.015

0.020

0.787

8.8

0.346

2.54

0.100

17.78

0.700

7.1

0.280

5.1

0.201

3.3

0.130

1.27

0.050

DIP16PW.TBL

TDA1175P

8/8

Электронный компонент: TDA1175P