TDA1904
4W AUDIO AMPLIFIER
HIGH OUTPUT CURRENT CAPABILITY
PROTECTION AGAINST CHIP OVERTEM-
PERATURE
LOW NOISE
HIGH SUPPLY VOLTAGE REJECTION
SUPPLY VOLTAGE RANGE: 4V TO 20V
DESCRIPTION
The TDA 1904 is a monolithic integrated circuit in
POWERDIP package intended for use as low-fre-
quency power amplifier in wide range of applica-
tions in portable radio and TV sets.
March 1993
Symbol
Parameter
Value
Unit
V
S
Supply voltage
20
V
I
O
Peak output current (non repetitive)
2.5
A
I
O
Peak output current (repetitive)
2
A
P
tot
Total power dissipation at T
amb
= 80
C
1
W
at T
pins
= 60
C
6
W
T
stg
, T
j
Storage and junction temperature
-40 to 150
C
ABSOLUTE MAXIMUM RATINGS
TEST AND APPLICATION CIRCUIT
Powerdip
(8 + 8)
ORDERING NUMBER : TDA 1904
(*) R4 is necessary only for V
s
< 6V.
1/10
Symbol
Parameter
Value
Unit
R
th-j-case
Thermal resistance junction-pins
max
15
C/W
R
th-j-amb
Thermal resistance junction-ambient
max
70
C/W
THERMAL DATA
2/10
PIN CONNECTION (top view)
SCHEMATIC DIAGRAM
TDA1904
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
V
s
Supply voltage
4
20
V
V
o
Quiescent output voltage
V
s
= 4V
V
s
= 14V
2.1
7.2
V
I
d
Quiescent drain current
V
s
= 9V
V
s
= 14V
8
10
15
18
mA
P
o
Output power
d = 10%
V
s
= 9V
V
s
= 14V
V
s
= 12V
V
s
= 6V
f = 1 KHz
R
L
= 4
1.8
4
3.1
0.7
2
4.5
W
d
Harmonic distortion
f = 1 KHz
V
s
= 9V
R
L
= 4
P
o
= 50 mW to 1.2W
0.1
0.3
%
V
i
Input saturation voltage
(rms)
V
s
= 9V
V
s
= 14V
0.8
1.3
V
R
i
Input resistance (pin 8)
f = 1 KHz
55
150
K
Efficiency
f = 1 KHz
V
s
= 9V
R
L
= 4
P
o
= 2W
V
s
= 14V
R
L
= 4
P
o
= 4.5W
70
65
%
BW
Small signal bandwidth (-3 dB)
V
s
= 14V
R
L
= 4
40 to 40,000
Hz
G
v
Voltage gain (open loop)
V
s
= 14V
f = 1 KHz
75
dB
G
v
Voltage gain (closed loop)
V
s
= 14V
f = 1 KHz
R
L
= 4
P
o
= 1W
39.5
40
40.5
dB
e
N
Total input noise
R
g
= 50
R
g
= 10 K
(
)
1.2
2
4
V
R
g
= 50
R
g
= 10 K
(
)
2
3
V
SVR
Supply voltage rejection
V
s
= 12V
f
ripple
= 100 Hz
V
ripple
= 0.5 Vrms
R
g
= 10 K
40
50
dB
T
sd
Thermal shut-down case
temperature
P
to t
= 2W
120
C
ELECTRICAL CHARACTERISTICS (Refer to the test circuit, T
amb
= 25
C, R
th
(heatsink) =
20
C/W, unless otherwisw specified)
Note: (
) Weighting filter = curve A.
(
) Filter with noise bendwidth: 22Hz to 22 KHz.
3/10
TDA1904
4/10
Figure 1. Test and application circuit
Figure 2. P.C. board and components layout of fig. 1 (1 : 1 scale)
(*) R4 is necessary only for V
S
< 6V
TDA1904
APPLICATION SUGGESTION
The recommended values of the external compo-
nents are those shown on the application circuit of
fig. 1.
When the supply voltage V
S
is less than 6V, a 68
resistor must be connected between pin 2 and pin
Components
Recomm.
value
Purpose
Larger than
recommended value
Smaller than
recommended value
Allowed range
Min.
Max.
R1
10 K
Feedback resistors
Increase of gain.
Decrease of gain.
Increase quiescent
current.
9R3
R2
100
Decrease of gain.
Increase of gain.
1 K
R3
4.7
Frequency stability
Danger of oscillation at
high frequencies with
inductive loads.
R4
68
Increase of the
output swing with
low supply voltage.
39
220
C1
2.2
F
Input DC
decoupling.
Higher cost lower
noise.
Higher low
frequency cutoff.
Higher noise.
C2
0.1
F
Supply voltage
bypass.
Danger of
oscillations.
C3
22
F
Ripple rejection
Increase of SVR
increase of the
switch-on time.
Degradation of SVR.
2.2
F
100
F
C4
2.2
F
Inverting input DC
decoupling.
Increase of the
switch-on noise
Higher low
frequency cutoff.
0.1
F
C5
47
F
Bootstrap.
Increase of the
distortion at low
frequency.
10
F
100
F
C6
0.22
F
Frequency stability.
Danger of oscillation.
C7
1000
F
Output DC
decoupling
Higher low
frequency cutoff.
3 in order to obtain the maximum output power.
Different values can be used. The following table
can help the designer.
5/10
TDA1904
Figure 3. Quiescent output
voltage vs. supply voltage
Figure 4. Quiescent drain
current vs. supply voltage
Figure 5. Output power vs.
supply voltage
F igu r e 6. Di sto rt ion v s.
output power
Fi gur e 7. D ist ort ion vs.
output power
F ig u re 8 . Di sto rtion vs .
output power
F igu r e 9. Di sto rt ion v s.
output power
Figure 10. Distortion vs.
output power
Figure 11 . Distortion vs.
output power
6/10
TDA1904
Figure 12. Distortion vs.
frequency
Figure 13. Distortion vs.
frequency
Figure 14. Distortion vs.
frequency
Figure 15. Distortion vs.
frequency
Figure 16. Supply voltage
rejection vs. frequency
F i gu r e 1 7 . To t al po wer
dissipation and efficiency
vs. output power
F i gu re 1 8. To t al po w er
dissipation and efficiency
vs. output power
F i gu r e 1 9. Tota l p o we r
dissipation and efficiency
vs. output power
F i gu r e 2 0 . To t al po wer
dissipation and efficiency
vs. output power
7/10
TDA1904
THERMAL SHUT-DOWN
The presence of a thermal limiting circuit offers the
following advantages:
1) An overload on the output (even if it is perma-
nent), or an above limit ambient temperature
can be easily tolerated since the T
j
cannot be
higher than 150
C.
2) The heatsink can have a smaller factor of safety
compared with that of a conventional circuit.
There is no possibility of device damage due to
high junction temperature.
If for any reason, the junction temperature in-
crease up to 150
C, the thermal shut-down
simply reduces the power dissipation and the
current consumption.
Figure 21. Example of heatsink using PC board
copper (l = 65 mm)
MOUNTING INSTRUCTION
The TDA 1904 is assembled in the Powerdip, in
which 8 pins (from 9 to 16)are attachedto the frame
and remove the heat produced by the chip.
Figure 21 shows a PC board copper area used as
a heatsink (I = 65 mm).
The thermal resistance junction-ambient is 35
C.
8/10
TDA1904
DIM.
mm
inch
MIN.
TYP.
MAX.
MIN.
TYP.
MAX.
a1
0.51
0.020
B
0.85
1.40
0.033
0.055
b
0.50
0.020
b1
0.38
0.50
0.015
0.020
D
20.0
0.787
E
8.80
0.346
e
2.54
0.100
e3
17.78
0.700
F
7.10
0.280
I
5.10
0.201
L
3.30
0.130
Z
1.27
0.050
POWERDIP PACKAGE MECHANICAL DATA
9/10
TDA1904
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectronics.
1994 SGS-THOMSON Microelectronics - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
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10/10
TDA1904
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