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Электронный компонент: SMM665BFR2

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SMM665B
Preliminary Information
1
(See Last Page)
SUMMIT Microelectronics, Inc.
2004 1717 Fox Drive San Jose CA 95131 Phone 408 436-9890 FAX 408 436-9897
The Summit Web Site can be accessed by "right" or "left" mouse clicking on the link:
http://www.summitmicro.com/
2089 1.1 10/20/04
1
Six-Channel Active DC Output Controller, Monitor, Marginer and Sequencer
FEATURES & APPLICATIONS
Extremely accurate (0.1%) Active
DC Output Control (ADOC
TM
)
Undervoltage Lockout function (UVLO)
ADOC
TM
Automatically adjusts supply output
voltage level under all DC load conditions
Monitors, controls, sequences and margins up
to six supplies from 0.3V to 5.5V with 1.25V Vref
Wide Margin/ADOC range from 0.3V to VDD
Programmable Power-on/-off sequencing
Monitors internal temperature sensor
Operates from any intermediate bus supply
from 8V to 15V and from 2.7V to 5.5V
Monitors 12V input and VDD
Monitors two general-purpose 10-bit ADC inputs
Programmable threshold limits (2 OV/2 UV) for
each monitored input
Programmable RESET, HEALTHY and FAULT
4k-bit general purpose nonvolatile memory
I
2
C 2-wire serial bus for programming
configuration and monitoring status, including
10-bit ADC conversion results
Applications
Monitor/Control Distributed and POL Supplies
Multi-voltage Processors, DSPs, ASICs used in
Telecom, CompactPCI or server systems
INTRODUCTION
The SMM665B is an Active DC Output power supply
Controller (ADOC
TM
) that monitors, margins and
cascade sequences. The ADOC feature is unique and
maintains extremely accurate settings of system
supply voltages to within 0.2% under full load. The
device actively controls up to six DC/DC converters
that use a Trim or Regulator VADJ/FB pin to adjust the
output voltage. For system test, the part also controls
margining of the supplies using I
2
C commands. It can
margin supplies with either positive or negative control
within a range of 0.3V to VDD depending on the
specified range of the converter. The SMM665B also
intelligently sequences or cascades the power
supplies on and off in any order using enable outputs
with programmable polarity. It can operate off any
intermediate bus supply ranging from 8V to 15V or
from 5.5V to as low as 2.7V. The part monitors six
power supply channels as well as VDD, 12V input, two
general-purpose analog inputs and an internal
temperature sensor using a 10-bit ADC. The 10-bit
ADC can measure the value on any one of the monitor
channels and output the data via the I
2
C bus. A host
system can communicate with the SMM665B status
register, optionally control Power-on/off, margining and
utilize 4K-bits of nonvolatile memory.
SIMPLIFIED APPLICATIONS DRAWING
TRIM
B
PUP
B
VM
B
TRIM_CAP
B
CAP
B
TRIM
A
PUP
A
VM
A
TRIM_CAP
A
CAP
A
SMM665B
P/
ASIC
VDD
RST
HEA
L
T
H
Y
MR
3.3VIN (+2.7V to +5.5V Range)
RESET
READY
HEALTHY
12
V
I
N
12VIN (+8V to +15V Range)
External
or
Internal
TEMP
SENSOR
AIN1
VREF_ADC
2.5VIN
1.2VIN
12V
SDA
SCL
I
2
C
BUS
3.3V
A2
VREF_CNTL
VIN
TRIM
Vout
DC/DC
Converter A
ON/OFF
VIN
TRIM
Vout
DC/DC
Converter B
ON/OFF
External or
Internal
REFERENCE
Environ
mental
SENSOR
AIN2
DC/DC
Converter C, E
DC/DC
Converter D, F
2 of 6 DC-DC
Converters shown
Figure 1 Applications Schematic using the SMM665B Controller to actively control the output levels of
up to six DC/DC Converters while also providing power on/off, cascade sequencing and output margining.
Note: This is an applications example only. Some pins, components and values are not shown.
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
2

GENERAL DESCRIPTION
The SMM665B is a highly integrated and accurate
power supply controller, monitor and sequencer. It
has the ability to automatically control, monitor and
cascade sequence up to six power supplies. Also, the
SMM665B can monitor the VDD input, the 12V input,
two general-purpose analog inputs and the internal
temperature sensor. The SMM665B has four
operating modes: Power-on sequencing mode,
monitor mode, supply margining mode using Active
DC Output Control (ADOC
TM
), and Power-off
sequencing mode.
Power-on sequencing can be initiated via the
PWR_ON/OFF pin or I
2
C control. In this mode, the
SMM665B will sequence the power supply channels
on in any order by activating the PUP outputs and
monitoring the respective converter voltages to ensure
cascading of the supplies. Cascade sequencing is the
ability to hold off the next sequenced supply until the
first supply reaches a programmed threshold. A
programmable sequence termination timer can be set
to disable all channels if the Power-on sequence
stalls. Once all supplies have sequenced on and the
voltages are above the UV settings, the Active DC
Control, if enabled, will bring the supply voltages to
their nominal settings. During this mode, the
HEALTHY output will remain inactive and the RST
output will remain active.
Once the Power-on sequencing mode is complete, the
SMM665B enters monitor mode. In the monitor mode,
the SMM665B starts the ADOC control of the supplies
and adjusts the output voltage to the programmed
setting under all load conditions, especially useful for
supplies without sense lines. Typical converters have
2% accuracy ratings for their output voltage, the
Active DC Output Control feature of the SMM665B
increases the accuracy to
0.2% (using a 0.1%
external voltage reference). The part also enables the
triggering of outputs by monitored fault conditions.
The 10-bit ADC cycles through all 11 channels every
2ms and checks the conversions against the
programmed threshold limits. The results can be used
to trigger RST, HEALTHY and FAULT outputs as well
as to trigger a Power-off or a Force Shutdown
operation.
While the SMM665B is in its monitoring mode, an I
2
C
command to margin the supply voltages can bring the
part into margining mode. In margining mode the
SMM665B can margin six supply voltages in any
combination of nominal, high and low voltage settings
using the ADOC feature, all to within 0.2% using a
0.1% external reference. The margin high and low
voltage settings can range from 0.3V to VDD around
the converters' nominal output voltage setting
depending on the specified margin range of the DC-
DC converter. During this mode the HEALTHY output
is always active and the RST output is always inactive
regardless of the voltage threshold limit settings and
triggers. Furthermore, the triggers for Power-off and
Force Shutdown are temporarily disabled.
The Power-off sequencing mode can only be entered
while the SMM665B is in the monitoring mode. It can
be initiated by either bringing the PWR_ON/OFF pin
inactive, through I
2
C control or triggered by a channel
exceeding its programmed thresholds. Once Power-
off is initiated, it will disable the Active DC Control and
sequence the PUP outputs off in either the same or
reverse order as Power-on sequencing and monitor
the supply voltages to ensure cascading of the
supplies as they turn off. The sequence termination
timer can be programmed to immediately disable all
channels if the Power-off sequencing stalls. The RST
output will remain active throughout this mode while
the HEALTHY output remains inactive.
Figure 2 Example Power Supply Sequencing and System Start-up Initialization using the SMM665B. Any
order of supply sequencing can be applied using the SMM665B. Power supply ordering, trimming and Active
DC control allows supply cascade sequencing, automatic level adjustment, margin testing and reset control.
2.5V
2.7V
1.8V
2.0V
1.5V
VDD (+2.7V to +5.5V)
or 12VIN ( +8V to +15V)
RST#
---
t1
---
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
3
AIN
2
10-Bit ADC
VREF_ADC
AIN
1
VM
A
Active DC
Control
(ADOC
TM
)
CAP
A
VM
F
CAP
F
TRIM
A
TRIM_CAP
A
TRIM
F
TRIM_CAP
F
VREF_CNTL
FILT_CAP
12VIN
VDD
PUP
A
Cascade
Sequence
Control
PUP
B
PUP
C
PUP
D
PUP
E
PUP
F
FS
PWR_ON/OFF
3.6V or
5.5V
Regulator
Power Supply
Arbitrator
Temperature
Sensor
VDD_CAP
Output
Control
MR
RST
HEALTHY
FAULT
Memory, Limit
and Status
Registers
I
2
C
Interface
SDA
SCL
A2
GND
UVLO
Control
Figure 3 SMM665B Internal Functional Block Diagram.
INTERNAL FUNCTIONAL BLOCK DIAGRAM
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
4
Pin
Number
Pin
Type
Pin Name
Pin Description
1
DATA SDA
I
2
C Bi-directional data line
2
CLK SCL
I
2
C Clock line
3
IN A2
The address pin is biased either to VDD_CAP or GND. When
communicating with the SMM665B over the 2-wire bus A2 provides a
mechanism for assigning a unique bus address.
4
IN MR
Programmable active high/low input. When asserted the RST output will be
go active. When de-asserted the RST output will go inactive immediately
after a reset timeout period (t
PRTO
) if there are no RST trigger sources active.
This timeout period makes it suitable to use a pushbutton for manual reset.
5
IN PWR_ON/OFF
Programmable active high/low input signals the start of the power
sequencing. When asserted the part will sequence the supplies on and
when de-asserted the part will sequence the supplies off.
Note: The SMM665B does not monitor for faults during sequencing. The
PWR_ON/OFF pin is overridden by the I
2
C power on/off command. To get
the pin to work again requires the part be given an I
2
C 'Clear' command (see
page 16, "RESTART OF POWER-ON CASCADE SEQUENCING").
6
IN FS
Programmable active high/low input. Force shutdown is used to immediately
turn off all converter enable signals (PUP outputs) when a fault is detected.
7
OUT FAULT
Programmable active high/low open drain Fault output. Active when a
programmed fault condition exists on AIN1, AIN2, or the internal temperature
sensor.
8
OUT HEALTHY
Programmable active high/low open drain Healthy output. Active when all
programmed power supply inputs and monitored inputs are within OV and
UV limits.
9
OUT RST
Programmable active high/low open drain Reset output. Active when a
programmed fault condition exists on any power supply inputs or monitored
inputs or when MR is active. RST has a programmable timeout period with
options for 0.64ms, 25ms, 100ms and 200ms.
10
IN AIN1
General purpose monitored analog input
11
IN AIN2
General purpose monitored analog input
12
GND GND
Ground
13
IN VREF_ADC
Voltage reference input used for A/D conversion where:
(4XVREF_ADC) = Full Scale (FS) for VM
A-F
and VDD
(12XVREF_ADC) = FS for 12VIN
(2XVREF_ADC) = FS for AIN1 and AIN2.
VREF_ADC can be connected to VREF_CNTL in most applications.
PIN DESCRIPTIONS
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
5
Pin
Number
Pin
Type
Pin Name
Pin Description
14
I/O VREF_CNTL
Voltage reference input used for DC output control and margining.
VREF_CNTL can be programmed to output the internal 1.25V reference.
15
CAP FILT_CAP External capacitor input used to filter VM
X
inputs
41,36,
31,26,
21,16
IN VM
X
Positive converter sense line, VM
A
through VM
F
42,37,
32,27,
22,17
CAP CAP
X
External capacitor input used to filter the VM
X
inputs to the 10-bit ADC, CAP
A
through CAP
F
. This provides an RC filter where R = 25k.
43,38,
33,28,
23,18
OUT PUP
X
Programmable active high/low open drain converter enable output, PUP
A
through PUP
F
44,39,
34,29,
24,19
OUT TRIM
X
Output voltage used to control the output of DC/DC converters, TRIM
A
through TRIM
F
45,40,
35,30,
25,20
CAP TRIM_CAP
X
External sample and hold capacitor input used to set the voltage on the
TRIM pins, TRIM_CAP
A
through TRIM_CAP
F
46
PWR VDD
Power supply of the part
47
PWR 12VIN
12V power supply input internally regulated to either 3.6V or 5.5V
48
CAP VDD_CAP External capacitor input used to filter the internal supply
PIN DESCRIPTIONS (Cont.)
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
6
PACKAGE AND PIN CONFIGURATION
48 LEAD TQFP
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
SDA
SCL
A2
MR
PW R_ON/OFF
FS
FAULT
HEALTHY
RST
AIN1
AIN2
GND
VR
EF
_
A
D
C
VREF_
C
NT
L
FI
L
T
_
C
A
P
VM
F
CA
P
F
PUPF
TR
I
M
F
TR
I
M
_C
A
P
F
VM
E
CA
P
E
PUPE
TR
I
M
E
VMB
TRIM_CAPC
TRIMC
PUPC
CAPC
VMC
TRIM_CAPD
TRIMD
PUPD
CAPD
VMD
TRIM_CAPE
VD
D
_
C
A
P
12
V
I
N
VD
D
TR
I
M
_C
A
P
A
TR
I
M
A
PU
PA
CA
P
A
VM
A
TR
I
M
_C
A
P
B
TR
I
M
B
PU
PB
CA
P
B
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
7
ABSOLUTE MAXIMUM RATINGS
Temperature Under Bias....................... -55
C to 125
C
Storage Temperature............................ -65
C to 150
C
Terminal Voltage with Respect to GND:
VDD Supply Voltage ......................... -0.3V to 6.0V
12VIN Supply Voltage ..................... -0.3V to 15.0V
PUP
A
, through PUP
F
....................... -0.3V to 15.0V
All Others ................................-0.3V to V
DD
+ 0.7V
Output Short Circuit Current ............................... 100mA
Lead Solder Temperature (10 secs) .................... 300
C
Junction Temperature........................................150C
ESD Rating per JEDEC.................................2000V
Latch-Up testing per JEDEC........................
100mA
Note - The device is not guaranteed to function outside its operating rating.
Stresses listed under Absolute Maximum Ratings may cause permanent
damage to the device. These are stress ratings only and functional operation
of the device at these or any other conditions outside those listed in the
operational sections of the specification is not implied. Exposure to any
absolute maximum rating for extended periods may affect device performance
and reliability. Devices are ESD sensitive. Handling precautions are
recommended.
RECOMMENDED OPERATING CONDITIONS
Temperature Range (Industrial)...........40
C to +85
C
(Commercial) ............5
C to +70
C
VDD Supply Voltage .................................. 2.7V to 5.5V
12VIN Supply Voltage (1) ........................8.0V to 14.0V
VIN ............................................................ GND to VDD
VOUT ...................................................... GND to 14.0V
Package Thermal Resistance (
JA
)
48 Lead TQFP........................................80
o
C/W

Moisture Classification Level 1 (MSL 1) per J-STD- 020

Note 1 Range depends on internal regulator set to 3.6V or 5.5V,
see 12VIN specification below.

RELIABILITY CHARACTERISTICS
Data Retention.....................................100 Years
Endurance...................................100,000 Cycles
DC OPERATING CHARACTERISTICS
(Over recommended operating conditions, unless otherwise noted. All voltages are relative to GND.)
Symbol
Parameter
Notes
Min
Typ Max
Unit
VDD
Supply Voltage
2.7
5.5
V
Internally regulated to 5.5V
10
14
V
12VIN Supply
Voltage
Internally regulated to 3.6V
6
14
V
I
DD
Power Supply Current from VDD
All TRIM pins floating,
12VIN floating
3
5
mA
I
12VIN
Power Supply Current from 12VIN
All TRIM pins floating,
VDD floating
3
5
mA
TRIM characteristics
TRIM Sourcing Maximum
Current
1.5
mA
I
TRIM
TRIM output current through 100
to
1.0V
TRIM Sinking Maximum
Current
1.5
mA
V
TRIM
Margin Control and ADOC Range
Depends on Trim range of
DC-DC Converter
VREF_CNTL/4
VDD V
All other input and output characteristics
VDD = 2.7V
0.9xVDD
VDD
V
V
IH
Input High Voltage (FS,
PWR_ON/OFF, MR#, SDA, SCL)
VDD = 5.0V
0.7xVDD
VDD
V
VDD = 2.7V
-0.1
0.1xVDD
V
V
IL
Input Low Voltage (FS,
PWR_ON/OFF, MR#, SDA, SCL)
VDD = 5.0V
-0.1
0.3xVDD
V
Internally regulated to 3.6V
0.9xVDD VDD V
V
IH
Input High Voltage (FS,
PWR_ON/OFF, MR#, SDA, SCL)
Internally regulated to 5.5V
0.7xVDD VDD V
Internally regulated to 3.6V
-0.1
0.1xVDD
V
V
IL
Input Low Voltage (FS,
PWR_ON/OFF, MR#, SDA, SCL)
Internally regulated to 5.5V
-0.1
0.3xVDD
V
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
8
DC OPERATING CHARACTERISTICS (CONTINUED)
(Over recommended operating conditions, unless otherwise noted. All voltages are relative to GND.)
Symbol Parameter
Notes Min
Typ
Max
Unit
V
OL
Programmable Open Drain
Outputs (RST, HEALTHY,
FAULT, PUPx)
I
SINK
= 1mA
0
0.4
V
I
OL
Output Low Current
Note Total I
SINK
from all PUPx pins
should not exceed 6mA or ADOC
ACC
specification will be affected
0
1.0
mA
V
SENSE
Positive Sense Voltage
VM pin
+0.3
VDD_CAP
V
V
Monitor
Monitor Threshold Step Size
VM, AIN1/AIN2 pins
5
mV
Commercial Temp Range
-3 +3
o
C
T
SA
Internal Temperature Sensor
Accuracy
Industrial Temp Range
-5 +5
o
C
T
Monitor
Temperature Threshold Step Size Internal Temp Sensor
0.25
o
C
V
REF
Internal 1.25V
REF
Output Voltage
1.24
1.25
1.26
V
40
C to +85
C
-0.25 +0.25
%
V
REF
TC
Internal V
REF
Temperature
Coefficient
5
C to +70
C
-0.15 +0.15
%
V
REF
ACC Internal V
REF
Accuracy
-0.4
+0.4
%
Ext V
REF
External
V
REF
Voltage Range
0.5
VDD_CAP
V
External V
REF
=1.25V, 0.1%,
Total PUPx I
SINK
= 6ma,
V
SENSE
3.5V
-0.2
0.1
+0.2 %
External V
REF
=1.25V, 0.1%,
Total PUPx I
SINK
= 6ma,
V
SENSE
3.5V
-0.5
0.3
+0.5 %
ADOC
ACC
ADOC/Margin
Accuracy
Internal V
REF
=1.25V, Total
PUPx I
SINK
= 6ma
-0.5
0.3
+0.5 %
V
OUT_VALID
Minimum Output Valid Voltage
VDD_CAP voltage at which
the PUP, RST, HEALTHY
and FAULT outputs are valid
1 V
VDD_CAP Rising
2.6
V
UVLO
Under Voltage Lockout
Threshold
1
VDD_CAP Falling
2.5
V
I
VDD_CAP
VDD_CAP Maximum Output
Current
VDD = 2.7V to 5.5V, Internal
regulator = 3.6V or 5.5V
5
mA

Note 1 - (100mV typ Hysteresis)
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
9
DC OPERATING CHARACTERISTICS (CONTINUED)
(Over recommended operating conditions, unless otherwise noted. All voltages are relative to GND.)
AIN1/AIN2 ADC characteristics
Symbol Parameter
Notes
Min Typ Max Unit
N Resolution
10
Bits
MC Missing
Codes
Minimum resolution for which no
missing codes are guaranteed
10 Bits
S/N
Signal-to-Noise Ratio
Conversion rate = 500Hz
72
db
DNL Differential
Non-Linearity
-1/2
+1/2
LSB
INL
Integral Non-Linearity
Note 1
-1
+1
LSB
GAIN
Positive full scale gain error
Note 1
-0.5
+0.5
%
Offset
Offset Error
Note 1
-1
+1
LSB
ADC_TC
Full Scale Temperature
Coefficient
15
PPM/
o
C
IM
ADC
Analog ADC Input Impedance
10
M
II
VREF_ADC
V
REF_ADC
Input Current
250
nA
IC
VREF_ADC
V
REF_ADC
Input Capacitance
200
pF
IR
VREF_ADC
V
REF_ADC
Input Impedance
1
k

Note 1 - The formula for the total ADC inaccuracy is: [((ADC read voltage) +/- INL)*(range of gain error)]+range of offset error
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
10
AC OPERATING CHARACTERISTICS
Over recommended operating conditions, unless otherwise noted. All voltages are relative to GND. See
Figure 5 and 6 Timing diagrams.
Symbol Description
Conditions
Min
Typ
Max
Unit
t
DPON
= 0.64ms
t
DPON
= 12.5ms
t
DPON
= 25ms
t
DPON
Programmable Power-on delay from
VM
X
out-of-fault to PUP
Y
active
t
DPON
= 50ms
-15 t
DPON
+15 %
t
DPOFF
= 0.64ms
t
DPOFF
= 12.5ms
t
DPOFF
= 25ms
t
DPOFF
Programmable Power-off delay from
VM
X
off to PUP
Y
inactive
t
DPOFF
= 50ms
-15 t
DPOFF
+15 %
t
PRTO
= 0.64ms
t
PRTO
= 25ms
t
PRTO
= 100ms
t
PRTO
Programmable Reset Time-Out
Period
t
PRTO
= 200ms
-15 t
PRTO
+15 %
t
STT
= OFF
t
STT
= 100ms
t
STT
= 200ms
t
STT
Programmable Sequence
Termination Timer
t
STT
= 400ms
-15 t
STT
+15 %
t
ADC
10-bit ADC sampling period
Time for ADC conversion
of all 11 channels
2
ms
t
DC_CONTROL
Active DC Control sampling period
Update period for Active
DC Control of channels
A F
1.7
ms
Slow Margin, + 10%
change in voltage with
0.1% ripple
TRIM_CAP=1
F
850
ms
T
MARGIN
Margin Time from Nominal
Fast Margin, + 10%
change in voltage with
0.1% ripple
TRIM_CAP=1
F
85
ms
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
11
I
2
C 2-WIRE SERIAL INTERFACE AC OPERATING
CHARACTERISTICS 100/400kHz
Over recommended operating conditions, unless otherwise noted. All voltages are relative to GND.
See Figure 4 Timing Diagram.
100kHz 400kHz
Symbol Description
Conditions
Min Typ Max Min Typ Max Units
f
SCL
SCL Clock Frequency
0 100
0 400
KHz
t
LOW
Clock Low Period
4.7 1.3 s
t
HIGH
Clock
High
Period
4.0 0.6 s
t
BUF
Bus Free Time
Before New Transmission
-
Note 1/
4.7 1.3 s
t
SU:STA
Start Condition Setup
Time
4.7 0.6 s
t
HD:STA
Start Condition Hold Time
4.0
0.6
s
t
SU:STO
Stop Condition Setup Time
4.7
0.6
s
t
AA
Clock Edge to Data Valid
SCL low to valid
SDA (cycle n)
0.2 3.5 0.2 0.9 s
t
DH
Data Output Hold Time
SCL low (cycle n+1)
to SDA change
0.2 0.2 s
t
R
SCL and SDA Rise Time
Note 1/
1000
1000
ns
t
F
SCL and SDA Fall Time
Note 1/
300 300 ns
t
SU:DAT
Data In Setup Time
250
150
ns
t
HD:DAT
Data In Hold Time
0
0
ns
TI
Noise Filter SCL and SDA
Noise suppression
100
100
ns
t
WR_CONFIG
Write Cycle Time Config
Configuration
Registers
10 10
ms
t
WR_EE
Write Cycle Time EE
Memory Array
5 5 ms
Note: 1/ - Guaranteed by Design.
t
R
t
F
t
HIGH
t
LOW
t
SU:SDA
t
HD:SDA
t
SU:DAT
t
HD:DAT
t
SU:STO
t
BUF
t
DH
t
AA
SCL
SDA
(IN)
SDA
(OUT)
t
W R (For W rite Operation Only)
Figure 4 - Basic I
2
C Serial Interface Timing
TIMING DIAGRAMS
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
12
























Figure 5 - The SMM665B cascade sequencing the supplies on and then monitoring for fault conditions.
























Figure 6 - The SMM665B cascade sequencing the supplies off.
t
DPONA
t
DPONB
t
DPONC
t
DPOND
0
1
2
VM
A
PUP
A
PUP
B
PUP
C
PUP
D
VM
B
VM
C
VM
D
TIMING DIAGRAMS (CONTINUED)
t
DPOFFA
t
DPOFFB
t
DPOFFC
t
DPOFFD
2
1
0
VM
A
PUP
A
PUP
B
PUP
C
PUP
D
VM
B
VM
C
VM
D
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
13
APPLICATIONS INFORMATION
DEVICE OPERATION
POWER SUPPLY
The SMM665B can be powered by either a 12V input
through the 12VIN pin or by a 3.3V or 5.0V input
through the VDD pin. The 12VIN pin feeds an internal
programmable regulator that internally generates
either 5.5V or 3.6V. A voltage arbitration circuit allows
the device to be powered by the highest voltage from
either the regulator output or the VDD input. This
voltage arbitration circuit continuously checks for these
voltages to determine which will power the SMM665B.
The resultant internal power supply rail is connected to
the VDD_CAP pin that allows both filtering and hold-
up of the internal power supply. To ensure that the
input voltage is high enough for reliable operation, an
under voltage lockout circuit holds the controlled
supplies off until the UVLO thresholds are met.
MODES OF OPERATION
The SMM665B has four basic modes of operation
(shown in Figures 5 through 8): Power-on cascade
sequencing mode, ongoing operations-monitoring
mode, supply margining mode and Power-off cascade
sequencing mode. In addition, there are two features:
ADOC and forced shutdown which can be used during
monitoring and margining mode. A detailed description
of each mode and feature follows.
ACTIVE DC OUTPUT CONTROL (ADOC
TM
)
The SMM665B can actively control the DC output
voltage of bricks or DC/DC converters that have a trim
pin during monitoring and margining mode. The
converter may be an off-the shelf compact device, or
may be a "roll your own" circuit on the application
board. In either case, the SMM665B dramatically
improves voltage accuracy (down to 0.2%) by
implementing closed-loop ADOC active control. This
utilizes the DC-DC's "trim" pin as shown in Figure 12,
or an equivalent output voltage feedback adjustment
"VADJ" or "FB" node in a user's custom circuit, Figure
13. Each of the TRIM
X
pins on the SMM665B is
connected to the trim input pins on the power supply
converters. A sense line from the channel's point-of-
load connects to the corresponding VM input. The
ADOC function cycles through all six channels (A-F)
every 1.7ms making slight adjustments to the voltage
on the associated TRIM
X
output pins based on the
voltage inputs on the VM
X
pins. These voltage
adjustments allow the SMM665B to control the output
voltage of power supply converters to within 0.2%
when using a 0.1% external voltage reference.
Figure 7 - Waveform shows four SMM665B channels
exhibiting Sequence-on to Nominal voltage, Margin
High or Low, Nominal voltage and then sequence-off

Ch 1 = 2.5V DC-DC converter output (Yellow trace)
Ch 2 = 1.8V DC-DC converter output (Blue trace)
Ch 3 = 1.5V DC-DC converter output (Purple trace)
Ch 4 = 1.2V DC-DC converter output (Green trace
Figure 8 - Waveform shows two SMM665B channels
Sequencing-on to Nominal voltage, Margin High and
Low, and then sequence-off. Channel 3 and 4 shows
the RST and HEALTHY signals.
Ch 1 = 2.5V DC-DC converter output (Yellow trace)
Ch 2 = 1.5V DC-DC converter output (Blue trace)
Ch 3 = RST signal output (Purple trace)
Ch 4 = HEALTHY signal output (Green trace
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
14
A pulse of current, either sourced or sunk for 5s
every 1.7ms, to the capacitors connected to the
TRIM_CAP
X
pins adjusts the voltage output on the
TRIM
X
pins. The voltages on the TRIM_CAP
X
pins are
buffered and applied to the TRIM
X
pins. The voltage
adjustments on the TRIM
X
pins cause a slight ripple of
less than 1mV on the power supply voltages. The
amplitude of this ripple is a function of the TRIM_CAP
capacitor and the trim gain of the converter.
Application Note 37 details the calculation of the
TRIM_CAP capacitor to achieve a desired minimum
ripple.
Each channel can be programmed to either enable or
disable the Active DC Control function. When
disabled or not active, the TRIM
X
pins on the
SMM665B are high impedance inputs. If disabled and
not used, they can be connected to ground. The
voltages on the TRIM
X
pins are buffered and applied
to the TRIM_CAP
X
pins charging the capacitors. This
allows a smooth transition from the converter powering
up to its nominal voltage; to the SMM665B controlling
that voltage, and to the Active DC Control nominal
setting.
The pulse of current can be increased to a 10X pulse
of current until the power supply voltages are at their
nominal settings by selecting the programmable
Speed-Up Convergence option. As the name implies,
this option decreases the time required to bring a
supply voltage from the converter's nominal output
voltage to the Active DC Control nominal voltage
setting.
POWER-ON CASCADE SEQUENCING
The SMM665B can be programmed to sequence up to
six power supplies in any order. Each of these six
channels (A-F) has an associated open drain PUP
output that, when connected to a converter's enable
pin, controls the turn-on of the converter. The
channels are assigned sequence positions to
determine the order of the sequence. Any channel
can also be programmed to not take part in the
sequencing in applications with fewer than six
supplies. The polarity of each of the PUP
X
outputs is
programmable for use with various types of
converters.
Power-on sequencing can be initiated by the
PWR_ON/OFF pin or via I
2
C control. The polarity of
the PWR_ON/OFF pin is programmable. If hard wired
in its active state the SMM665B will automatically
initiate the Power-on sequence. Otherwise, toggling
the PWR_ON/OFF pin to its active state will initiate the
Power-on sequence. To enable software control of
the sequencing feature, the SMM665B offers an I
2
C
command to initiate Power-on sequencing while the
PWR_ON/OFF pin is in its inactive state.
The SMM665B can be programmed to wait until either
or both VDD and 12VIN inputs are within their
respective voltage threshold limits before Power-on
sequencing is allowed to begin. This ensures that the
converters have their full supply voltage before they
are enabled.
Once Power-on sequencing begins, the SMM665B will
wait a Power-on delay time (t
DPON
) for any channel in
the first sequence position (0) and then activate the
PUP
X
outputs for those channels. The Power-on
delay times are individually programmable for each
channel. The SMM665B will then wait until all VM
X
inputs of the channels assigned to the first sequence
position (0) are above their programmed UV1
thresholds which is called cascade sequencing. At
this point, the SMM665B will enter the second
sequence position (1) and begin to timeout the Power-
on delay times for the associated channels. This
process continues until all of channels in the sequence
have turned on and are above their UV1 threshold.
The status registers indicates that all sequenced
power supply channels have turned on. Once these
channels are above their UV1 thresholds, the
SMM665B will begin the Active DC Control of the
enabled channels. The Power-on sequencing mode
ends when the Active DC Controlled channels are at
their nominal voltage setting. The "Ready" bit in the
status registers signifies that the voltages are at their
set points.
The programmable sequence termination timer can be
used to protect against a stalled Power-on sequence.
This timer resets itself at the beginning of each
sequence position. All channels in the sequence
position must go above their UV1 threshold before the
sequence termination timer times out (t
STT
) or the
sequence will terminate and all PUP
X
outputs will be
switched to their inactive state. The status registers
contain bits that indicate the sequence has been
terminated and in which sequence position the timer
timed out. This timer has four settings of OFF, 100ms,
200ms and 400ms.
APPLICATIONS INFORMATION (CONTINUED)
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
15
While the SMM665B is in the Power-on sequencing
mode the RST output is held active and the HEALTHY
output is held inactive regardless of trigger sources
(Figure 8). The Power-off and Force Shutdown trigger
options are also disabled while in this mode.
Furthermore, the SMM665B will not respond to activity
on the PWR_ON/OFF pin or to a Power-off I
2
C
command during Power-on sequencing mode.
ONGOING OPERATIONS-MONITORING MODE
During ongoing operations mode, the part can (1)
monitor (2) actively control via ADOC, and (3) use
force shutdown if necessary.
Once the Power-on sequence is complete and before
a Power-off sequence has been initiated, the
SMM665B continues to monitor all VM
X
inputs, the
VDD and 12VIN inputs, and two temperature sensor
inputs with a 10-bit ADC. Each of these inputs is
sampled and converted by the ADC every 2ms. The
ADC input has a range of 0V to four times the voltage
on VREF_ADC for inputs VM
A-F
and the VDD input.
The range is extended to 12 times VREF_ADC for the
12VIN input and is reduced to two times VREF_ADC
for the AIN1 and AIN2 inputs.
The SMM665B monitors internal temperature using
the 10-bit ADC and the automonitor function. Two
under temperature and two over temperature
thresholds can be set, each with its own
programmable trigger options and consecutive
conversion before trigger counter. Resolution is 0.25 C
per bit scaled over the range of -128 C to 127.75 C.
The temperature value can be acquired over the I
2
C
bus as a 10-bit signed two's complement value.
The SMM665B compares each resulting ADC
conversion with two programmable 10-bit under-
voltage limits (UV1, UV2) and two programmable 10-
bit over-voltage limits (OV1, OV2) for the
corresponding input. A consecutive conversion
counter is used to provide filtering of the ADC inputs.
Each limit can be programmed to require 1, 2, 4 or 6
consecutive out-of-limit conversions before it is said to
be in fault. One in-limit conversion will remove the
fault from the threshold limit. This provides digital
filtering of the monitored inputs. The ADC inputs VM
A-
F
can use additional filtering by connecting a capacitor
from the corresponding CAP
X
pins to ground to form
an analog RC filter (R=25k
). The input is considered
to be in a fault condition if any of its limit thresholds
are in fault. Setting an OV threshold limit to full-scale
(3FF
HEX
), or setting an UV threshold limit to 000
HEX
ensures that the limit can never be in fault.
The status registers provide the real-time status of all
monitored inputs.
The voltage threshold limits for inputs VM
A-F
, VDD and
12VIN can be programmed to trigger the RST and
HEALTHY outputs as well as a Force Shutdown and
Power-off operation when exceeded. The threshold
limits for the internal temperature sensor and the AIN1
and AIN2 inputs can be programmed to trigger the
RST, HEALTHY, and FAULT outputs.
The HEALTHY and FAULT outputs of the SMM665B
are active as long as the triggering limit remains in a
fault condition. The RST output also remains active as
long as the triggering limit remains in a fault condition;
however, once the trigger source goes away the RST
will remain active for a reset timeout period (t
PRTO
).
TEMPERATURE SENSOR ACCURACY
The internal temperature sensor accuracy is 5
o
C from
-40 to +90
o
C. The sensor measures the temperature
of the SMM665B die and the ambient temperature. If
VDD is at 5V, the die temperature is +2
o
C and at 12V,
it is +4
o
C. In order to calculate this difference in
specific applications measure the Vdd or 12VIN supply
current and calculate the power dissipated and
multiply by 80
o
C/W. For instance, 5V and 5mA is
25mW, which creates a 2
o
C offset.
MARGINING
The SMM665B has two additional Active DC Output
Control voltage settings for channels A-F; margin high
and margin low. The margin high and margin low
voltage settings can range from 0.3V to VDD of the
converters' nominal output voltage depending on the
specified margin range of the DC-DC converter.
These settings are stored in the configuration registers
and are loaded into the Active DC Control voltage
setting by margin commands issued via the I
2
C bus.
The channel must be enabled for Active DC Control in
order to enable margining. The margin command
registers contain two bits for each channel that decode
the commands to margin high, margin low, or control
to the nominal setting. Therefore, any combination of
margin high, margin low, and nominal control is
allowed in the margining mode.
Once the SMM665B receives the command to margin
the supply voltages, it begins adjusting the supply
voltages to move toward the desired setting. When all
channels are at their voltage setting, a bit is set in the
margin status registers.
APPLICATIONS INFORMATION (CONTINUED)
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
16
Note: Configuration writes or reads of registers 00
HEX
to 0F
HEX
should not be performed while the SMM665B
is margining.
POWER-OFF CASCADE SEQUENCING
The SMM665B can be programmed to perform Power-
off sequencing in either the same order or reverse
order of Power-on cascade sequencing.
Power-off cascade sequencing can be initiated by the
PWR_ON/OFF pin, via I
2
C control or triggered by a
fault condition on any of the monitored inputs.
Toggling the PWR_ON/OFF pin to its inactive state will
initiate the Power-off sequence.
To enable software control of the Power-off
sequencing feature, the SMM665B offers an I
2
C
command to initiate Power-off sequencing regardless
of the state of the PWR_ON/OFF pin. Furthermore,
Power-off sequencing can be initiated by a fault
condition on a monitored input.
Once Power-off sequencing begins, the SMM665B will
wait a Power-off delay time (t
DPOFF
) for any channel in
the last sequence position (reverse order) and then
deactivate the PUP outputs for those channels. The
Power-off delay times are individually programmable
for each channel. The SMM665B will then wait until all
VM
X
inputs of the channels assigned to that sequence
position are below the programmed OFF thresholds.
At this point, the SMM665B will decrement to the next
sequence position and begin to timeout the Power-off
delay times for the associated channels. This process
continues until all of channels in the sequence have
turned off and are below their OFF thresholds. The
status register reveals that all sequenced channels
have turned off. The Power-off sequencing mode
ends when all sequenced supplies are below their
OFF thresholds.
The programmable sequence termination timer can be
used to protect against a stalled Power-off sequence.
This timer resets itself at the beginning of each
sequence position. All channels in the sequence
position must go below their OFF threshold before the
sequence termination timer times out (t
STT
) or the
sequence will terminate and all PUP outputs will be
switched to their inactive state. This timer has four
settings of OFF, 100ms, 200ms and 400ms. The
sequence termination timer can be disabled separately
for Power-off sequencing.
While the SMM665B is in the Power-off sequencing
mode the RST output is held active and the HEALTHY
output is held inactive regardless of trigger sources
(Figure 8). The Force Shutdown trigger option is also
disabled while in this mode. Furthermore, the
SMM665B will not respond to activity on the
PWR_ON/OFF pin or to a Power-on I
2
C command
during Power-off sequencing mode.
FORCE SHUTDOWN
The Force Shutdown operation brings all PUP
X
outputs to their inactive state. This operation is used
for an emergency shutdown when there is not enough
time to sequence the supplies off. The Force
Shutdown operation shuts off all sequenced channels
and waits for the supply voltages to drop below their
respective OFF thresholds.
A Force Shutdown operation can be initiated by any
one of four events. The first two methods for initiating
a Force Shutdown are always enabled. Simply taking
the FS pin to its active state will initiate a Force
Shutdown operation and maintain it until the pin is
brought to its inactive state. An I
2
C Force Shutdown
command allows the Force Shutdown operation to be
initiated via software control. This I
2
C Force Shutdown
command sets a volatile register bit that triggers a
Force Shutdown. This bit is cleared after all
sequenced channels have dropped below their OFF
voltage threshold. During Power-on and Power-off
sequencing, the sequence termination timer can
initiate a Force Shutdown operation.
As described in the previous sections, the sequence
termination timer triggers a Force Shutdown operation
if it times out before the power supply voltages
surpass their voltage thresholds. This Force
Shutdown will remain active until all sequenced power
supply channels have dropped below their OFF
voltage threshold. While the SMM665B is in ongoing
operations-monitor mode, a programmed fault
condition on any power supply channel or on the
12VIN or VDD inputs can trigger a Force Shutdown. A
Force Shutdown resulting from this will remain active
until all sequenced power supply channels have
dropped below their OFF voltage threshold.
APPLICATIONS INFORMATION (CONTINUED)
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
17
SMM665 Brownout Recovery/Handling
During a power `brown-out' (Figure 9) the SMM665B
can default to a power-off state, thus requiring toggling
of the PWR_ON/OFF pin to enable the device to
perform a power-on sequence. For applications using
I
2
C control of the power-on/power-off function, the
same result may be effected by, upon recovery of
power, issuing a software (I
2
C) `Power-Off' command
followed by a `Power-On' command and ending with


a `Clear' command. If the PWR_ON/OFF pin is in the
asserted state, the SMM665B will initiate a power-on
sequence once all input conditions are met. Otherwise
the PWR_ON/OFF pin may require toggling if, upon
recovery from the `brownout', it is in the de-asserted
state.

-48V Supply
0V
-48V
SMM665 Supplies
Power Brown-Out
VDD_CAP
+12VIN
SMM665 Hold-Up Time
Figure 9 - Power Brown-Out with Resulting Loss of SMM665B Supply Voltages
APPLICATIONS INFORMATION (CONTINUED)
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
18
RESTART OF POWER-ON CASCADE
SEQUENCING
Once a Force Shutdown or Power-off operation has
completed, the SMM665B can restart the Power-on
cascade sequencing. The device can be programmed
to automatically restart after a Force Shutdown
provided the PWR_ON/OFF pin remains in the active
state or the I
2
C Power-on command remains in the
command register. If this option is not selected, the
SMM665B requires toggling of the PWR_ON/OFF pin
or toggling of the I
2
C commands by issuing a Power-
off command and then reissuing the Power-on
command in order to restart Power-on sequencing.
In either case, assertion of the FS pin will prevent the
SMM665B from restarting Power-on sequencing. In
addition, the device can be programmed to check that
VDD and the 12VIN are within their programmed
voltage thresholds before restarting Power-on
sequencing.
In cases where brownout conditions (Figure 10) or
loss of power are used to cause a sequence off of the
supplies or a Force Shutdown, it is best to toggle the
PWR_ON/OFF pin or use the I
2
C Power commands

after the brownout condition is over or if the supplies
do not fully discharge before initiating a Power-on
sequence.
Recommended Use of the PWR_ON/OFF pin:
The PWR_ON/OFF pin is edge-triggered to lock out
false or nuisance signals during both the power-on
and power-off sequences. If during a system power-
down, whether deliberate or due to a failed power
system, the VDD_CAP voltage falls below 2.5V, the
SMM665B internal UVLO (UnderVoltage LockOut)
circuit resets all internal logic. Once power has
recovered above 2.6V the SMM665B will restart
assuming the PWR_ON/OFF pin is in the asserted
state or an I
2
C power command is issued. The
SMM665B can be used with the PWR_ON/OFF pin
either toggled by a logic level, controlled by a software
command or tied either high or low as described in the
data sheet.


VDD_CAP
2.5V
3.6V, 5.5V
UVLO
(Internal)
2.6V
Figure 10 - Timing Sequence recovering from a VDD_CAP Power `Brown-Out'
APPLICATIONS INFORMATION (CONTINUED)
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
19
Figure 11 SMM665B Distributed power applications schematic. The accuracy of the external reference
(U10) sets the accuracy of the ADOC function. Total accuracy with a 0.1% external reference is 0.2%.
APPLICATIONS INFORMATION (CONTINUED)
SMM665B
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
20
TRIM
A
VM
A
+
TRIM
B
VM
B
+
SMM665B
IR
iP1202
VSW1
SDA
SCL
I2C BUS
VR
EG_
I
N
12V
12V
CS
VI
N
FB1
VOUT1
1.5V
FB1S
Rtrim
1.6K
VSW2
FB2
VOUT2
2.5V
FB2S
Rtrim
3.3K
Not all components Shown
For interface purposes only
Part designators are from
the International Rectifier
iP1202 Demo board .
SS2
PUP
A
SS1
PUP
B
R9
R7
C8
C7
R10
R8
Figure 12 The SMM665B can be used to sequence and control discrete DC switching regulators. The ADOC
function sets the output voltage of the IR iP1202 Regulator through the FBX feedback pins. Accuracy is
improved even under full load, essentially acting as a "SENSE" pin. The sequence function is applied
through the iP1202 SSX soft start pins.
Figure 13 Ch1 is set to 2.5V and Ch2 is set to
1.5V on the ip1202 board. Ch1 is set to sequence
on first followed by Ch2 after 50ms. Then Ch1 is
margined high while Ch2 is margined low. Ch2 is
then sequenced off followed by Ch1 after 50ms.
Figure 14 This is the same sequencing-on
function but with a shorter delay between
channels, the HEALTHY and RESET flags are also
shown.
APPLICATIONS INFORMATION (CONTINUED)
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
21

The end user can obtain the Summit SMX3200
programming system for device prototype
development. The SMX3200 system consists of a
programming Dongle, cable and Windows
TM
GUI
software. It can be ordered on the website or from a
local representative.
The SMX3200 programming Dongle/cable interfaces
directly between a PC's parallel port and the target
application. The device is then configured on-screen
via an intuitive graphical user interface employing
drop-down menus.

The Windows GUI software will generate the data and
send it in I
2
C serial bus format so that it can be directly
downloaded to the SMM665B via the programming
Dongle and cable. An example of the connection
interface is shown in Figure 15.
When design prototyping is complete, the software
can generate a HEX data file that should be
transmitted to Summit for approval. Summit will then
assign a unique customer ID to the HEX code and
program production devices before the final electrical
test operations. This will ensure proper device
operation in the end application.
The latest revisions of all software and an application brief describing the SMX3200 is available from the website at:
http://www.summitmicro.com/tech_support/program_kit/SMX3200.htm
Pin 9, 5V
Pin 7, 10V
Pin 5, Reserved
Pin 3, GND
Pin 1, GND
Pin 6, MR#
Pin 4, SDA
Pin 2, SCL
Pin 8, Reserved
Pin 10, Reserved
Top view of straight 0.1" x 0.1 closed-side
connector. SMX3200 interface cable connector.
9
7
5
3
1
10
8
6
4
2
SMM665B
SDA
SCL
VDD_CAP
GND
0.1
F
MR
D1
1N4148

Figure 15 SMX3200 Programmer I
2
C serial bus connections to program the SMM665B. Note that the MR
pin does not need to be connected to pin 6 for programming purposes.
DEVELOPMENT HARDWARE & SOFTWARE
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
22
SERIAL INTERFACE
Access to the configuration registers, general-purpose
memory and command and status registers is carried
out over an industry standard 2-wire serial interface
(I
2
C). SDA is a bi-directional data line and SCL is a
clock input. Data is clocked in on the rising edge of
SCL and clocked out on the falling edge of SCL. All
data transfers begin with the MSB. During data
transfers SDA must remain stable while SCL is high.
Data is transferred in 8-bit packets with an intervening
clock period in which an Acknowledge is provided by
the device receiving data. The SCL high period (t
HIGH
)
is used for generating Start and Stop conditions that
precede and end most transactions on the serial bus.
A high-to-low transition of SDA while SCL is high is
considered a Start condition while a low-to-high
transition of SDA while SCL is high is considered a
Stop condition.
The interface protocol allows operation of multiple
devices and types of devices on a single bus through
unique device addressing. The address byte is
comprised of a 4-bit device type identifier (slave
address) and a 3-bit bus address. The remaining bit
indicates either a read or a write operation. Refer to
Table 1 for a description of the address bytes used by
the SMM665B.
The device type identifier for the memory array is
generally set to 1010
BIN
following the industry standard
for a typical nonvolatile memory. There is an option to
change the identifier to 1011
BIN
allowing it to be used
on a bus that may be occupied by other memory
devices. The configuration registers are grouped with
the memory array and thus use 1010
BIN
or 1011
BIN
as
the device type identifier. The command and status
registers as well as the 10-bit ADC are accessible with
the separate device type identifier of 1001
BIN
.
The bus address bits A[1:0] are programmed into the
configuration registers. Bus address bit A[2] can be
programmed as either 0 or biased by the A2 pin. The
bus address accessed in the address byte of the serial
data stream must match the setting in the SMM665B
and on the A2 pin.
Any access to the SMM665B on the I
2
C bus will
temporarily halt the monitoring function. This does not
affect the ADOC function, which will continue
functioning and control the DC outputs. This is true
not only during the monitor mode, but also during
Power-on and Power-off sequencing when the device
is monitoring the channels to determine if they have
turned on or turned off.
The SMM665B halts the monitor function from when it
acknowledges the address byte until a valid stop is
received.
WRITE
Writing to the memory or a configuration register is
illustrated in Figures 16, 17, 19, 21 and 22. A Start
condition followed by the address byte is provided by
the host; the SMM665B responds with an
Acknowledge; the host then responds by sending the
memory address pointer or configuration register
address pointer; the SMM665B responds with an
acknowledge; the host then clocks in on byte of data.
For memory and configuration register writes, up to 15
additional bytes of data can be clocked in by the host
to write to consecutive addresses within the same
page. After the last byte is clocked in and the host
receives an Acknowledge, a Stop condition must be
issued to initiate the nonvolatile write operation.
READ
The address pointer for the configuration registers,
memory, command and status registers and ADC
registers must be set before data can be read from the
SMM665B. This is accomplished by a issuing a
dummy write command, which is simply a write
command that is not followed by a Stop condition.
The dummy write command sets the address from
which data is read. After the dummy write command
is issued, a Start command followed by the address
byte is sent from the host. The host then waits for an
Acknowledge and then begins clocking data out of the
slave device. The first byte read is data from the
address pointer set during the dummy write command.
Additional bytes can be clocked out of consecutive
addresses with the host providing an Acknowledge
after each byte. After the data is read from the desired
registers, the read operation is terminated by the host
holding SDA high during the Acknowledge clock cycle
and then issuing a Stop condition. Refer to Figures
18, 20 and 23 for an illustration of the read sequence.
I
2
C PROGRAMMING INFORMATION
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
23
WRITE PROTECTION
The SMM665B powers up into a write protected mode.
Writing a code to the volatile write protection register
can disable the write protection. The write protection
register is located at address 87
HEX
of slave address
1001
BIN
.
Writing 0101
BIN
to bits [7:4] of the write protection
register allow writes to the general-purpose memory
while writing 0101
BIN
to bits [3:0] allow writes to the
configuration registers. The write protection can re-
enable by writing other codes (not 0101
BIN
) to the write
protection register. Writing to the write protection
register is shown in Figure 16.
CONFIGURATION REGISTERS
The majority of the configuration registers are grouped
with the general-purpose memory located at either
slave address 1010
BIN
or 1011
BIN
. The bus address
bits, A[1:0], used to differentiate the general-purpose
memory from the configuration registers are set to
11
BIN
. Bus address bit A[2] can be programmed as
either 0 or biased by the A2 pin.
Two additional configuration registers are located at
addresses 83
HEX
and 84
HEX
of slave address 1001
BIN
.
Writing and reading the configuration registers is
shown in Figures 17, 18, 19, 20 and 21
Note: Configuration writes or reads of registers 00
HEX
to 0F
HEX
should not be performed while the SMM665B
is margining.
GENERAL-PURPOSE MEMORY
The 4k-bit general-purpose memory is located at
either slave address 1010
BIN
or 1011
BIN
. The bus
address bits, A[1:0], used to differentiate the general-
purpose memory from the configuration registers are
set to 00
BIN
for the first 2k-bits and 01
BIN
for the second
2k-bits. Bus address bit A[2] can be programmed as
either 0 or biased by the A2 pin. The word address
must be set each time the memory is accessed.
Memory writes and reads are shown in Figures 22, 23
and 24.
COMMAND AND STATUS REGISTERS
The command and status registers are located at
slave address 1001
BIN
. Writes and reads of the
command and status registers are shown in Figures
25 and 26.
ADC CONVERSIONS
An ADC conversion on any monitored channel can be
performed and read over the I
2
C bus using the ADC
read command. The ADC read command, shown in
Figure 27, starts with a dummy write to the 1001
BIN
slave address. Bits [6:3] of the word address byte are
used to address the desired monitored input. Once
the device acknowledges the channel address, it
begins the ADC conversion of the addressed input.
This conversion requires 70
s to complete. During
this conversion time, acknowledge polling can be
used. The SMM665B will not acknowledge the
address bytes until the conversion is complete. When
the conversion has completed, the SMM665B will
acknowledge the address byte and return the 10-bit
conversion along with a 4-bit channel address echo.
GRAPHICAL USER INTERFACE (GUI)
Device configuration utilizing the Windows based
SMM665B graphical user interface (GUI) is highly
recommended. The software is available from the
Summit website at:
(
http://www.summitmicro.com/tech_support/tech.htm#
GUI
.
Using the GUI in conjunction with this datasheet and
Application Note 33, simplifies the process of device
prototyping and the interaction of the various
functional blocks. A programming Dongle (SMX3200)
is available from Summit to communicate with the
SMM665B. The Dongle connects directly to the
parallel port of a PC and programs the device through
a cable using the I
2
C bus protocol.
Slave Address Bus Address Register Type
1001
BIN
A2 A1 A0
Write Protection Register,
Command and Status Registers,
Two Configuration Registers,
ADC Conversion Readout
A2 0 0
1
st
2-k Bits of General-Purpose Memory
A2 0 1
2
nd
2-k Bits of General-Purpose Memory
1010
BIN
or
1011
BIN
A2 1 1
Configuration Registers
Table 1 - Address bytes used by the SMM665B.
I
2
C PROGRAMMING INFORMATION (CONTINUED)
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
24

S
T
A
R
T
W
A
C
K
M aster
Slave
A
C
K
Configuration
Register Address = 87
HEX
1
0
0
0
0
1
1
1
0
1
0
1
0
1
0
1
S
T
O
P
Data = 55
HEX
A
C
K
1
0
0
1
A
2
Bus Address
A
1
A
0
5
HEX
Unlocks
General Purpose
EE
5
HEX
Unlocks
Configuration
Registers
W rite Protection
Register Address
8
HEX
7
HEX
Figure 16 Write Protection Register Write
S
T
A
R
T
1
A
2
Bus Address
W
A
C
K
Master
Slave
A
C
K
1
1
0
1
S
A
0
Configuration
Register Address
C
7
C
6
C
5
C
4
C
3
C
2
C
1
C
0
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
S
T
O
P
Data
A
C
K
Figure17 Configuration Register Byte Write
S
T
A
R
T
1
A
2
Bus Address
W
A
C
K
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
S
T
O
P
Master
Master
Slave
Slave
A
C
K
Data (16)
1
1
0
1
S
A
0
Configuration
Register Address
C
7
C
6
C
5
C
4
C
3
C
2
C
1
C
0
A
C
K
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
Data (1)
A
C
K
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
Data (2)
A
C
K
D
7
D
6
D
5
D
2
D
1
D
0
A
C
K
Figure 18 Configuration Register Page Write
I
2
C PROGRAMMING INFORMATION (CONTINUED)
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
25
S
T
A
R
T
1
A
2
Bus Address
W
A
C
K
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
S
T
O
P
N
A
C
K
Master
Master
Slave
Slave
A
C
K
Data (n)
1
1
0
1
S
A
0
Configuration
Register Address
C
7
C
6
C
5
C
4
C
3
C
2
C
1
C
0
S
T
A
R
T
1
R
A
C
K
A
2
Bus Address
1
1
S
A
0
0
1
A
C
K
D
7
D
6
D
5
D
2
D
1
D
0
A
C
K
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
Data (1)
Figure 19 - Configuration Register Read
S
T
A
R
T
W
A
C
K
Master
Slave
A
C
K
Configuration
Register Address
C
7
C
6
C
5
C
4
C
3
C
2
C
1
C
0
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
S
T
O
P
Data
A
C
K
1
0
0
1
A
2
Bus Address
A
1
A
0
Figure 20 - Configuration Register with Slave Address 1001
BIN
Write
S
T
A
R
T
W
A
C
K
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
S
T
O
P
N
A
C
K
Master
Master
Slave
Slave
A
C
K
Data (n)
Configuration
Register Address
C
7
C
6
C
5
C
4
C
3
C
2
C
1
C
0
S
T
A
R
T
R
A
C
K
A
C
K
D
7
D
6
D
5
D
2
D
1
D
0
A
C
K
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
Data (1)
1
0
0
1
A
2
Bus Address
A
1
A
0
1
0
0
1
A
2
Bus Address
A
1
A
0
Figure 21 - Configuration Register with Slave Address 1001
BIN
Read
I
2
C PROGRAMMING INFORMATION (CONTINUED)
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
26
S
T
A
R
T
1
Bus Address
W
A
C
K
Master
Slave
A
C
K
0
1
S
A
0
Memory Address
C
7
C
6
C
5
C
4
C
3
C
2
C
1
C
0
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
S
T
O
P
Data
A
C
K
0
A
2
0
/
1
Figure 22 General Purpose Memory Byte Write
Bus Address
0
A
2
0
/
1
S
T
A
R
T
1
W
A
C
K
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
S
T
O
P
Master
Master
Slave
Slave
A
C
K
Data (16)
0
1
S
A
0
Memory Address
C
7
C
6
C
5
C
4
C
3
C
2
C
1
C
0
A
C
K
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
Data (1)
A
C
K
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
Data (2)
A
C
K
D
7
D
6
D
5
D
2
D
1
D
0
A
C
K
Figure 23 - General Purpose Memory Page Write
S
T
A
R
T
1
W
A
C
K
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
S
T
O
P
N
A
C
K
Master
Master
Slave
Slave
A
C
K
Data (n)
0
1
S
A
0
Memory Address
C
7
C
6
C
5
C
4
C
3
C
2
C
1
C
0
S
T
A
R
T
1
R
A
C
K
1
S
A
0
0
A
C
K
D
7
D
6
D
5
D
2
D
1
D
0
A
C
K
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
Data (1)
Bus Address
0
A
2
0
/
1
Bus Address
0
A
2
0
/
1
Figure 24 - General Purpose Memory Read
I
2
C PROGRAMMING INFORMATION (CONTINUED)
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
27
S
T
A
R
T
W
A
C
K
Master
Slave
A
C
K
Command and Status
Register Address
C
7
C
6
C
5
C
4
C
3
C
2
C
1
C
0
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
S
T
O
P
Data
A
C
K
1
0
0
1
A
2
Bus Address
A
1
A
0
Figure 25 Command and Status Register Write
S
T
A
R
T
W
A
C
K
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
S
T
O
P
N
A
C
K
Master
Master
Slave
Slave
A
C
K
Data (n)
Command and Status
Register Address
C
7
C
6
C
5
C
4
C
3
C
2
C
1
C
0
S
T
A
R
T
R
A
C
K
A
C
K
D
7
D
6
D
5
D
2
D
1
D
0
A
C
K
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
Data (1)
1
0
0
1
A
2
Bus Address
A
1
A
0
1
0
0
1
A
2
Bus Address
A
1
A
0
Figure 26 - Command and Status Register Read
S
T
A
R
T
1
0
0
1
A
2
Bus Address
A
1
A
0
W
C
H
3
C
H
2
C
H
1
C
H
0
A
C
K
S
T
A
R
T
1
0
0
1
A
2
Bus Address
A
1
A
0
R
S
T
A
R
T
1
0
0
1
A
2
Bus Address
A
1
A
0
R
C
H
3
C
H
2
C
H
1
C
H
0
D
9
D
8
D
7
D
6
D
5
D
4
D
3
D
2
D
1
D
0
S
T
O
P
N
A
C
K
N
A
C
K
Master
Master
Slave
Slave
Channel Address Echo
Channel Address
0
0
0
0
A
C
K
10-Bit ADC Data
A
C
K
A
C
K
0
0
Figure 27 ADC Conversion Read
I
2
C PROGRAMMING INFORMATION (CONTINUED)
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
28
DEFAULT CONFIGURATION REGISTER SETTINGS SMM665BFC-266
Register Contents Register Contents Register Contents Register Contents
R0 0D R40
0D R98 41 RBF
E0
R1 83 R41
B9 R99 3E RC0
0B
R2 0D R42
0E R9A
81 RC1
38
R3 FF R43
39 R9B
33 RC2
0B
R4 0E R44
0E R9C
29 RC3
38
R5 61 R45
A4 R9D
9A RC4
09
R6 0E R46
0F R9E
11 RC5
90
R7 C7 R47
16 R9F
AE RC6
09
R8 0F R48
0F RA0
41 RC7
90
R9 54 R49
B4 RA1
0B RC8
0C
RA 0B R4A
06 RA2 80 RC9
00
RB 22 R4B
7F RA3 F6 RCA
0C
RC 7F R4C
00 RA4 29 RCB
00
RD 3F R4D
12 RA5 5D RCC
0F
RE 03 R4E
50 RA6
11 RCD
FF
RF 01 R80
42 RA7
71 RCE
0F
R10 8F R81 48 RA8 40 RCF FF
R11 9F R82 82 RA9 CE RD0 0C
R12 AF R83 3E RAA 80 RD1 00
R13 BF R84 2A RAB 8F RD2 0C
R14 CF R85 B8 RAC 29 RD3 00
R15 DF R86 12 RAD 1F RD4 0F
R18
00 R87
F6 RAE
11 RD5
D8
R19
00 R88
41 RAF
33 RD6
0F
R30 0D R89 C8 RB0 2A RD7 D8
R31
60 R8A
81 RB1
67 RE0
00
R32 0D R8B B9 RB2 0A RE1 3D
R33 DC R8C 2A RB3 52 RE2 00
R34 0E R8D 34 RB4 03 RE3 3D
R35 45
R8E 12
RB5 FF RE4 00
R36 0E R8F 49 RB6 03 RE5 3D
R37
A2 R90
49 RB7
FF RE6
00
R38 0F R91 5C RB8 0D RE7 3D
R39 08 R92 81 RB9 9A RE8 00
R3A 0F R93 52 RBA 0D RE9 3D
R3B D6 R94 29 RBB 56 REA 00
R3C 00
R95 D7 RBC 0F REB 3D
R3D 12
R96 11
RBD E0
R3E 50 R97 EB RBE 0F
RC1
The default device ordering number is SMM665BFC-266. It is programmed with the register contents as shown above
and tested over the commercial temperature range with a default VREF setting of 1.25V. Other standard external
VREF voltage settings that can be specified and tested are values of: 1.024, 1.225, 1.250, 2.048, 2.500, 3.000 or
3.300. The value is derived from the customer supplied hex file. New device suffix numbers are assigned for all non-
default VREF requirements. If other VREF values are required, please contact a Summit Microelectronics Sales
Representative.
Application Note 33 contains a complete description of the Windows GUI and the default settings of each of
the 154 individual Configuration Registers.
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
29
PACKAGE
A
B
Pin 1
Indicator
Inches
(Millimeters)
0.002 - 0.006
(0.05-0.15)
MAX.
0.047
(1.2)
0.037 - 0.041
0.95 - 1.05
0.018 - 0.030
(0.45 - 0.75)
0.039
(1.00)
0.02
(0.5)
BSC
0.007 - 0.011
(0.17 - 0.27)
DETAIL "A"
DETAIL "B"
(B)
(A)
(A)
0.354
(9.00) BSC
0.276
(7.00)
BSC (B)
48 PIN TQFP PACKAGE
0
o
Min to
7
o
Max
Ref Jedec M S-026
Ref
SMM665B
Preliminary Information
Summit Microelectronics, Inc
2089 1.1 10/20/04
30
PART MARKING

ORDERING INFORMATION
NOTICE
NOTE 1 - This is a Preliminary Information data sheet that describes a Summit product currently in pre-production with limited characterization.

Revision 1.1 - This document supersedes all previous versions. Data Sheet updates can be accessed by "right" or "left" mouse clicking on the link:
http://www.summitmicro.com/prod_select/summary/SMM665/SMM665.htm

Device Errata sheets can be accessed by "right" or "left" mouse clicking on the link:
http://www.summitmicro.com/errata/SMM665B
SUMMIT Microelectronics, Inc. reserves the right to make changes to the products contained in this publication in order to improve design,
performance or reliability. SUMMIT Microelectronics, Inc. assumes no responsibility for the use of any circuits described herein, conveys no license
under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained
herein reflect representative operating parameters, and may vary depending upon a user's specific application. While the information in this
publication has been carefully checked, SUMMIT Microelectronics, Inc. shall not be liable for any damages arising as a result of any error or
omission.
SUMMIT Microelectronics, Inc. does not recommend the use of any of its products in life support or aviation applications where the failure or
malfunction of the product can reasonably be expected to cause any failure of either system or to significantly affect their safety or effectiveness.
Products are not authorized for use in such applications unless SUMMIT Microelectronics, Inc. receives written assurances, to its satisfaction, that:
(a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; and (c) potential liability of SUMMIT Microelectronics, Inc.
is adequately protected under the circumstances.

Copyright 2004 SUMMIT MICROELECTRONICS, Inc.
PROGRAMMABLE ANALOG FOR A DIGITAL WORLDTM
ADOC
TM
is a registered trademark of Summit Microelectronics Inc., I2C is a trademark of Philips Corporation.
SUMMIT
SMM665BF
AYYWW
Pin 1
Annn
Summit Part Number
Date Code (YYWW)
Part Number suffix (Contains Customer specific programming and
ordering requirements. The default device ordering number is not
marked on the device)
Lot tracking code (Summit use)
Drawing not to scale
xx
Status Tracking Code
(Blank, MS, ES, 01, 02,...)
(Summit Use)
Product Tracking Code (Summit use)
SMM665B F
Package
F=48 Lead TQFP
Summit
Part
Number
Specific requirements are contained in the suffix such as
Hex code, Hex code revision, etc. The calibrated VREF voltage
settings are standard values of: 1.024, 1.225, 1.250, 2.048,
2.500, 3.000 or 3.300
nnn
Part Number Suffix (see page 28)
C
Temp Range
C=Commercial
Blank=Industrial