Single-Chip Smart Card
Terminal Controller
73S1121F Product Brief
The 73S1121F is the industry's first extensive low-cost system-on-a-
chip smart-card terminal controller. The chip incorporates all the
functionality required to build a low-cost, dual smart-card terminal in
a single package. Based on an 80C52 core,
with two built-in EMV smart card interfaces,
communication capabilities and peripherals,
the 73S1121F has been optimized for
either standalone or host-connected
applications. The 73S1121F facilitates a
low external component count and fast
design cycle.
TDK Semiconductor has developed the
73S1121F together with a comprehensive software layer stack, based
Microcontroller:
80C52 Core
64KB internal Flash (Program Memory)
1KB IRAM (internal RAM and registers) + 4 KB internal XRAM
(User Data Memory), expandable to 64KB
ROM boot-loader enabling In-System-Programming (ISP) of the
internal Flash (Program Memory)
Optional DMA interface when using external memory
128 Bytes Flash IFB (Information Block for serial #, firmware
version...)
Single low cost 12MHz crystal
Optional 32kHz crystal (with internal counter for real time
clock support)
Smart Card Interfaces:
(2) ISO-7816 / EMV2000 smart card interfaces w/embedded step-up
converter for 3v/5v smart cards
ISO-7816 UART (9600Kbps to 115Kbps with 12MHz crystal) for
protocols T=0, T=1 with (2) dedicated 2-Byte FIFOs
Auxiliary I/O lines for C4/C8 signals and UART bypass for
synchronous card support
Shared 4-wire interface enabling connection of external SAMs
Security:
Embedded fuses to allow designers to permanently disable access to
the embedded Flash memory, the external memory interface, the
In-System Programming (ISP) mode or any combination of the three.
Communication:
USB Full-speed interface (12Mbps with 4 Endpoints)
(1) Serial interface 1200Kbps to 115Kbps (Standard 8052 serial UART)
Peripherals:
5x6 Keyboard interface with hardware scanning, de-bouncing
and scrambling
(7) Dedicated LCD I/Os (to control any external LCD driver)
(8) User I/Os
(4) GPIOs compatible with interfacing voltages up to 5.5v
(3) Analog inputs for voltage detection (for battery monitoring
or any DC voltage comparison from 0.2v to 2.5v)
Software:
Two-level API (C-language libraries) for fast application development
Sample USB driver compatible with Microsoft PC/SC and
WindowsTM Hardware Quality Laboratory test suite
Power: Single 2.7v to 3.6v power supply
Packaging: 128 pin TQFP and Die form
on a two-level Application Programming Interface (API) using functions
written in ANSI-C.
The low-level API functions are used to control the entire
73S1121F and low-level parameters (register settings, clock
settings and power modes, resource sharing such as interrupts
and timers, interface configuration).
The high-level API functions include protocol layers to
communicate with asynchronous cards (protocols T=0 and T=1,
compliant with ISO-7816 and EMV-2000) and with the USB
interface. It also provides services for PIN management,
memory management and display.
This two-level API will shorten the development time of any 73S1121F-
based products, providing a dramatic reduction in time-to-market.
Features
Applications
Payphones
Meters
Pre-paid Card Terminals
Set-top Boxes
Physical and Logical Access PIN-pad Smart-Card Terminals
E-purse Terminals
Ticketing and Vending Machines
Inexpensive Point-of-Sale Terminals
Smart Card Terminal Controller for e-Transaction, Control
Access and Advanced Smart Card Reader Applications
Keyboard
Interface
8052
Core
ISO-7816
UART
DC-to-DC
Converter
12MHz Main
Oscillator
32.768kHz
Sub-System
Oscillator
ISO-7816
Driver and
Sequencer
ICC#2
VCC1
CLK1
RST1
IO1
C41
C81
DET_CARD1
ISO-7816
Driver and
Sequencer
ICC#1
VCC1
CLK1
RST1
IO1
C41
C81
DET_CARD1
SCLK
SIO
SC4
SC8
Interface for
Ext. ICCs
Timer
T0
Timer
T1
Timer
T2
LCD I/Os
I/Os
GPIOs
5
COL(4:0)
6
ROW(5:0)
4
LCD_RW
LCD_En
LCD_RS
LCD_DAT(3:0)
8
USR(7:0)
4
GPIO(3:0)
3
ANA_IN(5:3)
2.5V
Vref.
VREF
USB
Full Speed
12Mbps
USB+
USB-
Serial
UART
RX
TX
Clock
Circuitry
RTC
Counter
VPC
VNC
VPD
VND
5
5
2
VPA
VNA
VPG
8
Vref Divider
INT0
INT2
RESET
CC1P
CC1N
CC2P
CC2N
OSCIN12
OSCOUT12
OSCIN32
OSCOUT32
VCC1 VCC2
OSCOUT
128B IFB
(Flash)
Ext. Memory
Interface
(Optional)
8
16
AD(7:0)
A(15:0)
WR
RD
PSEN
EA
ALE
ROM
Boot-Loader
ISP_Pr
ogram
64kB
Flash
4kB XRAM
+
1kB IRAM
SEC1
SEC2
VCCIN1
VCCIN2
GND_RTN
TDK Semiconductor Corp.
2642 Michelle Dr.
Tustin, CA 92780
714-508-8800 (phone) 714-508-8877 (fax)
support@tdksemiconductor.com
www.tdksemiconductor.com
No responsibility is assumed by TDK Semiconductor Corporation for use of this product nor for any infringements of
patents and trademarks or other rights of third parties resulting from its use. No license is granted under any patents,
patent rights or trademarks of TDK Semiconductor Corporation, and the company reserves the right to make changes
in specifications at any time without notice. Accordingly, the reader is cautioned to verify that the data sheet is current
before placing orders.
2003 TDK Semiconductor Corporation
3/03 - rev 3.2
73S1121F Block Diagram
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