1
Data sheet acquired from Harris Semiconductor
SCHS191C
Features
Buffered Inputs
Asynchronous Parallel Load
Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
Wide Operating Temperature Range . . . -55
o
C to 125
o
C
Balanced Propagation Delay and Transition Times
Significant Power Reduction Compared to LSTTL
Logic ICs
HC Types
- 2V to 6V Operation
- High Noise Immunity: N
IL
= 30%, N
IH
= 30% of V
CC
at V
CC
= 5V
HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
V
IL
= 0.8V (Max), V
IH
= 2V (Min)
- CMOS Input Compatibility, I
l
1
A at V
OL
, V
OH
Description
The 'HC597 and CD74HCT597 are high-speed silicon gate
CMOS devices that are pin-compatible with the LSTTL 597
devices. Each device consists of an 8-flip-flop input register
and an 8-bit parallel-in/serial-in, serial-out shift register. Each
register is controlled by its own clock. A "low" on the parallel
load input (PL) shifts parallel stored data asynchronously into
the shift register. A "low" master input (MR) clears the shift
register. Serial input data can also be synchronously shifted
through the shift register when PL is high.
Pinout
CD54HC597
(CERDIP)
CD74HC597
(PDIP, SOIC, SOP)
CD74HCT597
(PDIP, SOIC)
TOP VIEW
Ordering Information
PART NUMBER
TEMP. RANGE (
o
C)
PACKAGE
CD54HC597F3A
-55 to 125
16 Ld CERDIP
CD74HC597E
-55 to 125
16 Ld PDIP
CD74HC597M
-55 to 125
16 Ld SOIC
CD74HC597MT
-55 to 125
16 Ld SOIC
CD74HC597M96
-55 to 125
16 Ld SOIC
CD74HC597NSR
-55 to 125
16 Ld SOP
CD74HCT597E
-55 to 125
16 Ld PDIP
CD74HCT597M
-55 to 125
16 Ld SOIC
CD74HCT597MT
-55 to 125
16 Ld SOIC
CD74HCT597M96
-55 to 125
16 Ld SOIC
NOTE: When ordering, use the entire part number. The suffixes 96
and R denote tape and reel. The suffix T denotes a small-quantity
reel of 250.
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
D1
D2
D3
D4
D5
D6
GND
D7
V
CC
D
S
PL
ST
CP
SH
CP
MR
Q7
D0
January 1998 - Revised October 2003
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
2003, Texas Instruments Incorporated
CD54HC597, CD74HC597,
CD74HCT597
High-Speed CMOS Logic
8-Bit Shift Register with Input Storage
[ /Title
(CD74
HC597
,
CD74
HCT59
7)
/Sub-
ject
(High
Speed
CMOS
2
Functional Diagram
9
1
2
3
4
6
12
7
5
D1
D2
D3
D4
D5
D6
D7
ST
CP
Q7
11
13
10
15
14
D0
DS
SH
CP
PL
MR
8 F/F
STORAGE
REG.
8-BIT
SHIFT
REG.
PARALLEL
DATA
INPUTS
FUNCTION TABLE
ST
CP
SH
CP
PL
MR
FUNCTION
X
X
X
Data Loaded to Input Flip-Flops
X
L
H
Data Loaded from Inputs to Shift Register
No Clock Edge
X
L
H
Data Transferred from Input Flip-Flops to Shift Register
X
X
L
L
Invalid Logic, State of Shift Register Indeterminate when
Signals Removed
X
X
H
L
Shift Register Cleared
X
H
H
Shift Register Clocked Qn = Qn-1, Q0 = D
S
H = High Voltage Level, L = Low Voltage Level, X = Don't Care,
= Transition from Low to High CP Level
CD54HC597, CD74HC597, CD74HCT597
3
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, V
CC
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, I
IK
For V
I
< -0.5V or V
I
> V
CC
+ 0.5V
. . . . . . . . . . . . . . . . . . . . . .
20mA
DC Output Diode Current, I
OK
For V
O
< -0.5V or V
O
> V
CC
+ 0.5V
. . . . . . . . . . . . . . . . . . . .
20mA
DC Drain Current, per Output, I
O
For -0.5V < V
O
< V
CC
+ 0.5V
. . . . . . . . . . . . . . . . . . . . . . . . . .
25mA
DC Output Source or Sink Current per Output Pin, I
O
For V
O
> -0.5V or V
O
< V
CC
+ 0.5V
. . . . . . . . . . . . . . . . . . . .
25mA
DC V
CC
or Ground Current, I
CC
. . . . . . . . . . . . . . . . . . . . . . . . .
50mA
Operating Conditions
Temperature Range, T
A
. . . . . . . . . . . . . . . . . . . . . . -55
o
C to 125
o
C
Supply Voltage Range, V
CC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
DC Input or Output Voltage, V
I
, V
O
. . . . . . . . . . . . . . . . . 0V to V
CC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
Thermal Resistance (Typical, Note 1)
JA
(
o
C/W)
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . .
67
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . .
73
NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . .
64
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150
o
C
Maximum Storage Temperature Range . . . . . . . . . .-65
o
C to 150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300
o
C
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
PARAMETER
SYMBOL
TEST
CONDITIONS
V
CC
(V)
25
o
C
-40
o
C TO 85
o
C -55
o
C TO 125
o
C
UNITS
V
I
(V)
I
O
(mA)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
HC TYPES
High Level Input
Voltage
V
IH
-
-
2
1.5
-
-
1.5
-
1.5
-
V
4.5
3.15
-
-
3.15
-
3.15
-
V
6
4.2
-
-
4.2
-
4.2
-
V
Low Level Input
Voltage
V
IL
-
-
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
High Level Output
Voltage
CMOS Loads
V
OH
V
IH
or V
IL
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-0.02
6
5.9
-
-
5.9
-
5.9
-
V
High Level Output
Voltage
TTL Loads
-
-
-
-
-
-
-
-
-
V
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
-5.2
6
5.48
-
-
5.34
-
5.2
-
V
Low Level Output
Voltage
CMOS Loads
V
OL
V
IH
or V
IL
0.02
2
-
-
0.1
-
0.1
-
0.1
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
0.02
6
-
-
0.1
-
0.1
-
0.1
V
Low Level Output
Voltage
TTL Loads
-
-
-
-
-
-
-
-
-
V
4
4.5
-
-
0.26
-
0.33
-
0.4
V
5.2
6
-
-
0.26
-
0.33
-
0.4
V
Input Leakage
Current
I
I
V
CC
or
GND
-
6
-
-
0.1
-
1
-
1
A
CD54HC597, CD74HC597, CD74HCT597
4
Quiescent Device
Current
I
CC
V
CC
or
GND
0
6
-
-
8
-
80
-
160
A
HCT TYPES
High Level Input
Voltage
V
IH
-
-
4.5 to
5.5
2
-
-
2
-
2
-
V
Low Level Input
Voltage
V
IL
-
-
4.5 to
5.5
-
-
0.8
-
0.8
-
0.8
V
High Level Output
Voltage
CMOS Loads
V
OH
V
IH
or V
IL
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
High Level Output
Voltage
TTL Loads
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
Low Level Output
Voltage
CMOS Loads
V
OL
V
IH
or V
IL
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
Low Level Output
Voltage
TTL Loads
4
4.5
-
-
0.26
-
0.33
-
0.4
V
Input Leakage
Current
I
I
V
CC
and
GND
0
5.5
-
0.1
-
1
-
1
A
Quiescent Device
Current
I
CC
V
CC
or
GND
0
5.5
-
-
8
-
80
-
160
A
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
I
CC
(Note 2)
V
CC
-2.1
-
4.5 to
5.5
-
100
360
-
450
-
490
A
NOTE:
2. For dual-supply systems theoretical worst case (V
I
= 2.4V, V
CC
= 5.5V) specification is 1.8mA.
HCT Input Loading Table
INPUT
UNIT LOADS
D
S
0.2
D
n
0.3
PL, MR
1.5
ST
CP
, SH
CP
1.5
NOTE: Unit Load is
I
CC
limit specified in DC Electrical Specifications
Table, e.g., 360
A max. at 25
o
C.
DC Electrical Specifications
(Continued)
PARAMETER
SYMBOL
TEST
CONDITIONS
V
CC
(V)
25
o
C
-40
o
C TO 85
o
C -55
o
C TO 125
o
C
UNITS
V
I
(V)
I
O
(mA)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
Prerequisite for Switching Specifications
PARAMETER
SYMBOL
V
CC
(V)
25
o
C
-40
o
C TO 85
o
C
-55
o
C TO 125
o
C
UNITS
MIN
TYP
MAX
MIN
TYP
MAX
MIN
TYP
MAX
HC TYPES
SH
CP
Frequency
f
MAX
2
6
-
-
5
-
-
4
-
-
MHz
4.5
30
-
-
25
-
-
20
-
-
MHz
6
35
-
-
29
-
-
23
-
-
MHz
CD54HC597, CD74HC597, CD74HCT597
5
SH
CP
Pulse Width
t
W
2
80
-
-
100
-
-
120
-
-
ns
4.5
16
-
-
20
-
-
24
-
-
ns
6
14
-
-
17
-
-
20
-
-
ns
ST
CP
Pulse Width
t
W
2
60
-
-
75
-
-
90
-
-
ns
4.5
12
-
-
15
-
-
18
-
-
ns
6
10
-
-
13
-
-
15
-
-
ns
MR Pulse Width
t
W
2
80
-
-
100
-
-
120
-
-
ns
4.5
16
-
-
20
-
-
24
-
-
ns
6
14
-
-
17
-
-
20
-
-
ns
PL Pulse Width
t
W
2
70
-
-
90
-
-
105
-
-
ns
4.5
14
-
-
18
-
-
21
-
-
ns
6
12
-
-
15
-
-
18
-
-
ns
ST
CP
to SH
CP
Setup
Time
t
SU
2
100
-
-
125
-
-
150
-
-
ns
4.5
20
-
-
25
-
-
30
-
-
ns
6
17
-
-
21
-
-
26
-
-
ns
D
S
to SH
CP
Setup Time
D
n
to ST
CP
Setup Time
t
SU
2
50
-
-
65
-
-
75
-
-
ns
4.5
10
-
-
13
-
-
15
-
-
ns
6
9
-
-
11
-
-
13
-
-
ns
ST
CP
to SH
CP
Setup
Time
t
H
2
0
-
-
0
-
-
0
-
-
ns
4.5
0
-
-
0
-
-
0
-
-
ns
6
0
-
-
0
-
-
0
-
-
ns
D
S
to SH
CP
Hold Time
D
n
to ST
CP
Hold Time
t
H
2
3
-
-
3
-
-
3
-
-
ns
4.5
3
-
-
3
-
-
3
-
-
ns
6
3
-
-
3
-
-
3
-
-
ns
MR to SH
CP
Removal
Time
t
REM
2
3
-
-
3
-
-
3
-
-
ns
4.5
3
-
-
3
-
-
3
-
-
ns
6
3
-
-
3
-
-
3
-
-
ns
HCT TYPES
SH
CP
Frequency
f
MAX
4.5
25
-
-
20
-
-
16
-
-
MHz
SH
CP
Pulse Width
t
W
4.5
20
-
-
25
-
-
30
-
-
ns
ST
CP
Pulse Width
t
W
4.5
13
-
-
16
-
-
20
-
-
ns
MR Pulse Width
t
W
4.5
18
-
-
23
-
-
27
-
-
ns
PL Pulse Width
t
W
4.5
16
-
-
20
-
-
24
-
-
ns
ST
CP
to SH
CP
Setup
Time
t
SU
4.5
24
-
-
30
-
-
36
-
-
ns
Prerequisite for Switching Specifications
(Continued)
PARAMETER
SYMBOL
V
CC
(V)
25
o
C
-40
o
C TO 85
o
C
-55
o
C TO 125
o
C
UNITS
MIN
TYP
MAX
MIN
TYP
MAX
MIN
TYP
MAX
CD54HC597, CD74HC597, CD74HCT597
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