TL081, TL081A, TL081B, TL082, TL082A, TL082B
TL082Y, TL084, TL084A, TL084B, TL084Y
JFET-INPUT OPERATIONAL AMPLIFIERS
SLOS081E FEBRUARY 1977 REVISED FEBRUARY 1999
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D
Low Power Consumption
D
Wide Common-Mode and Differential
Voltage Ranges
D
Low Input Bias and Offset Currents
D
Output Short-Circuit Protection
D
Low Total Harmonic
Distortion . . . 0.003% Typ
D
High Input Impedance . . . JFET-Input Stage
D
Latch-Up-Free Operation
D
High Slew Rate . . . 13 V/
s Typ
D
Common-Mode Input Voltage Range
Includes V
CC+
description
The TL08x JFET-input operational amplifier family is designed to offer a wider selection than any previously
developed operational amplifier family. Each of these JFET-input operational amplifiers incorporates
well-matched, high-voltage JFET and bipolar transistors in a monolithic integrated circuit. The devices feature
high slew rates, low input bias and offset currents, and low offset voltage temperature coefficient. Offset
adjustment and external compensation options are available within the TL08x family.
The C-suffix devices are characterized for operation from 0
C to 70
C. The I-suffix devices are characterized
for operation from 40
C to 85
C. The Q-suffix devices are characterized for operation from 40
C to 125
C.
The M-suffix devices are characterized for operation over the full military temperature range of 55
C to 125
C.
symbols
+
+
OFFSET N1
IN +
IN
OUT
IN +
IN
OUT
TL082 (EACH AMPLIFIER)
TL084 (EACH AMPLIFIER)
TL081
OFFSET N2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright
1999, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
TL081, TL081A, TL081B, TL082, TL082A, TL082B
TL082Y, TL084, TL084A, TL084B, TL084Y
JFET-INPUT OPERATIONAL AMPLIFIERS
SLOS081E FEBRUARY 1977 REVISED FEBRUARY 1999
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
NC No internal connection
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1OUT
1IN
1IN +
V
CC +
2IN +
2IN
2OUT
4OUT
4IN
4IN +
V
CC
3IN +
3IN
3OUT
TL084, TL084A, TL084B
D, J, N, PW, OR W PACKAGE
(TOP VIEW)
3
2
1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
4IN +
NC
V
CC
NC
3IN +
1IN +
NC
V
CC +
NC
2IN +
TL084M . . . FK PACKAGE
(TOP VIEW)
1IN
1OUT
NC
3OUT
3IN
4OUT
4IN
2IN
2OUT
NC
3
2
1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
NC
V
CC +
NC
OUT
NC
NC
IN
NC
IN +
NC
TL081M . . . FK PACKAGE
(TOP VIEW)
NC
OFFSET
N1
NC
OFFSET
N2
NC
NC
NC
NC
NC
3
2
1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
NC
2OUT
NC
2IN
NC
NC
1IN
NC
1IN +
NC
TL082M . . . FK PACKAGE
(TOP VIEW)
NC
1OUT
NC
2IN +
NC
NC
NC
NC
1
2
3
4
8
7
6
5
OFFSET N1
IN
IN +
V
CC
NC
V
CC +
OUT
OFFSET N2
TL081, TL081A, TL081B
D, JG, P, OR PW PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
1OUT
1IN
1IN +
V
CC
V
CC +
2OUT
2IN
2IN +
TL082, TL082A, TL082B
D, JG, P, OR PW PACKAGE
(TOP VIEW)
V
CC
V
CC+
V
CC
1
2
3
4
5
10
9
8
7
6
NC
OFFSET N1
IN
IN+
V
CC
NC
NC
V
CC+
OUT
OFFSET N2
TL081M
U PACKAGE
(TOP VIEW)
1
2
3
4
5
10
9
8
7
6
NC
1OUT
1IN
1IN+
V
CC
NC
V
CC+
2OUT
2IN
2IN+
TL082M
U PACKAGE
(TOP VIEW)
TL081, TL081A, TL081B, TL082, TL082A, TL082B
TL082Y
, TL084, TL084A, TL084B, TL084Y
JFET
-INPUT OPERA
TIONAL
AMPLIFIERS
SLOS081E
FEBRUAR
Y
1977 REVISED FEBRUAR
Y
1999
POST
OFFICE BOX 655303 DALLAS,
TEXAS
75265
3
AVAILABLE OPTIONS
PACKAGED DEVICES
CHIP
TA
VIOmax
AT 25
C
SMALL
OUTLINE
(D008)
SMALL
OUTLINE
(D014)
CHIP
CARRIER
(FK)
CERAMIC
DIP
(J)
CERAMIC
DIP
(JG)
PLASTIC
DIP
(N)
PLASTIC
DIP
(P)
TSSOP
(PW)
FLAT
PACK
(U)
FLAT
PACK
(W)
CHIP
FORM
(Y)
15 mV
6 mV
3 mV
TL081CD
TL081ACD
TL081BCD
--
--
--
--
--
TL081CP
TL081ACP
TL081BCP
TL081CPW
--
--
--
0
C
to
70
C
15 mV
6 mV
3 mV
TL082CD
TL082ACD
TL082BCD
--
--
--
--
--
TL082CP
TL082ACP
TL082BCP
TL082CPW
--
--
TL082Y
15 mV
6 mV
3 mV
--
TL084CD
TL084ACD
TL084BCD
--
--
--
TL084CN
TL084ACN
TL084BCN
--
TL084CPW
--
--
TL084Y
40
C
to
85
C
6 mV
6 mV
6 mV
TL081ID
TL082ID
TL084ID
TL084ID
--
--
--
TL084IN
TL081IP
TL082IP
--
--
--
--
40
C
to
125
C
9 mV
--
TL084QD
--
--
--
--
--
--
--
--
--
55
C
to
125
C
6 mV
6 mV
9 mV
--
--
TL081MFK
TL082MFK
TL084MFK
TL084MJ
TL081MJG
TL082MJG
--
--
--
TL081MU
TL082MU
TL084MW
--
The D package is available taped and reeled. Add R suffix to the device type (e.g., TL081CDR).
TL081, TL081A, TL081B, TL082, TL082A, TL082B
TL082Y, TL084, TL084A, TL084B, TL084Y
JFET-INPUT OPERATIONAL AMPLIFIERS
SLOS081E FEBRUARY 1977 REVISED FEBRUARY 1999
4
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
schematic (each amplifier)
C1
VCC +
IN +
VCC
OFFSET N1
1080
1080
IN
TL081 Only
64
128
64
OUT
Component values shown are nominal.
OFFSET N2
TL081, TL081A, TL081B, TL082, TL082A, TL082B
TL082Y, TL084, TL084A, TL084B, TL084Y
JFET-INPUT OPERATIONAL AMPLIFIERS
SLOS081E FEBRUARY 1977 REVISED FEBRUARY 1999
5
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
TL082Y chip information
These chips, when properly assembled, display characteristics similar to the TL082. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
4 MINIMUM
TJmax = 150
C
TOLERANCES ARE
10%.
ALL DIMENSIONS ARE IN MILS.
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
+
1OUT
1IN +
1IN
VCC+
(8)
(6)
(3)
(2)
(5)
(1)
+
(7)
2IN +
2IN
2OUT
(4)
VCC
61
61
(7)
(6)
(5)
(4)
(8)
(3)
(2)
(1)
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