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Электронный компонент: 74ABTH16245DGGRE4

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SN54ABTH16245, SN74ABTH16245
16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS662I MARCH 1996 REVISED MARCH 1999
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D
Members of the Texas Instruments
Widebus
TM
Family
D
State-of-the-Art
EPIC-
B
TM
BiCMOS Design
Significantly Reduces Power Dissipation
D
Typical V
OLP
(Output Ground Bounce) < 1 V
at V
CC
= 5 V, T
A
= 25
C
D
High-Impedance State During Power Up
and Power Down
D
Distributed V
CC
and GND Pin Configuration
Minimizes High-Speed Switching Noise
D
Flow-Through Architecture Optimizes PCB
Layout
D
High-Drive Outputs (32-mA I
OH
, 64-mA I
OL
)
D
Bus Hold on Data Inputs Eliminates the
Need for External Pullup/Pulldown
Resistors
D
Latch-Up Performance Exceeds 500 mA Per
JESD 17
D
Package Options Include Plastic Shrink
Small-Outline (DL), Thin Shrink
Small-Outline (DGG), and Thin Very
Small-Outline (DGV) Packages and 380-mil
Fine-Pitch Ceramic Flat (WD) Package
Using 25-mil Center-to-Center Spacings
description
The 'ABTH16245 devices are 16-bit noninverting
3-state transceivers that provide synchronous
two-way communication between data buses.
The control-function implementation minimizes
external timing requirements.
These devices can be used as two 8-bit transceivers or one 16-bit transceiver. They allow data transmission
from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control
(DIR) input. The output-enable (OE) input can be used to disable the devices so that the buses are effectively
isolated.
When V
CC
is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down.
However, to ensure the high-impedance state above 2.1 V, OE should be tied to V
CC
through a pullup resistor;
the minimum value of the resistor is determined by the current-sinking capability of the driver.
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.
The SN54ABTH16245 is characterized for operation over the full military temperature range of 55
C to 125
C.
The SN74ABTH16245 is characterized for operation from 40
C to 85
C.
Copyright
1999, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus and EPIC-
B are trademarks of Texas Instruments Incorporated.
SN54ABTH16245 . . . WD PACKAGE
SN74ABTH16245 . . . DGG, DGV, OR DL PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
1DIR
1B1
1B2
GND
1B3
1B4
V
CC
1B5
1B6
GND
1B7
1B8
2B1
2B2
GND
2B3
2B4
V
CC
2B5
2B6
GND
2B7
2B8
2DIR
1OE
1A1
1A2
GND
1A3
1A4
V
CC
1A5
1A6
GND
1A7
1A8
2A1
2A2
GND
2A3
2A4
V
CC
2A5
2A6
GND
2A7
2A8
2OE
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
SN54ABTH16245, SN74ABTH16245
16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS662I MARCH 1996 REVISED MARCH 1999
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
FUNCTION TABLE
(each 8-bit section)
INPUTS
OPERATION
OE
DIR
OPERATION
L
L
B data to A bus
L
H
A data to B bus
H
X
Isolation
logic symbol
1A2
46
1A3
44
1A4
43
1A5
41
1A6
40
1A7
38
1A8
37
2A2
35
2A3
33
2A4
32
2A5
30
2A6
29
2A7
27
2A8
26
1OE
2OE
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
1A1
47
G3
48
3 EN1 [BA]
1
1DIR
3 EN2 [AB]
G6
25
6 EN4 [BA]
24
2DIR
6 EN5 [AB]
1B1
2
1B2
3
1B3
5
1B4
6
1B5
8
1B6
9
1B7
11
1B8
12
2A1
36
2B1
13
2B2
14
2B3
16
2B4
17
2B5
19
2B6
20
2B7
22
2B8
23
1
2
4
5
SN54ABTH16245, SN74ABTH16245
16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS662I MARCH 1996 REVISED MARCH 1999
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
logic diagram (positive logic)
To Seven Other Channels
1DIR
1A1
1B1
1OE
To Seven Other Channels
2DIR
2A1
2B1
2OE
1
47
24
36
48
2
25
13
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
CC
0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, V
I
(except I/O ports) (see Note 1)
0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high or power-off state, V
O
0.5 V to 5.5 V
. . . . . . . . . . . . . . . . . . .
Current into any output in the low state, I
O
: SN54ABTH16245 96
mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74ABTH16245 128
mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, I
IK
(V
I
< 0)
18 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, I
OK
(V
O
< 0)
50 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
JA
(see Note 2): DGG package
89
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DGV package
93
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DL package
94
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
65
C to 150
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51.
recommended operating conditions (see Note 3)
SN54ABTH16245
SN74ABTH16245
UNIT
MIN
MAX
MIN
MAX
UNIT
VCC
Supply voltage
4.5
5.5
4.5
5.5
V
VIH
High-level input voltage
2
2
V
VIL
Low-level input voltage
0.8
0.8
V
VI
Input voltage
0
VCC
0
VCC
V
IOH
High-level output current
24
32
mA
IOL
Low-level output current
48
64
mA
t/
v
Input transition rise or fall rate
Outputs enabled
10
10
ns/V
TA
Operating free-air temperature
55
125
40
85
C
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SN54ABTH16245, SN74ABTH16245
16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS662I MARCH 1996 REVISED MARCH 1999
4
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
TA = 25
C
SN54ABTH16245
SN74ABTH16245
UNIT
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNIT
VIK
VCC = 4.5 V,
II = 18 mA
1.2
1.2
1.2
V
VCC = 4.5 V,
IOH = 3 mA
2.5
2.5
2.5
VOH
VCC = 5 V,
IOH = 3 mA
3
3
3
V
VOH
VCC = 4 5 V
IOH = 24 mA
2
2
V
VCC = 4.5 V
IOH = 32 mA
2*
2
VOL
VCC = 4 5 V
IOL = 48 mA
0.55
0.55
V
VOL
VCC = 4.5 V
IOL = 64 mA
0.55*
0.55
V
Vhys
100
mV
II
Control
inputs
VCC = 5.5 V,
VI = VCC or GND
1
1
1
A
I
A or B ports
CC
,
I
CC
100
100
100
II(h ld)
VCC = 4 5 V
VI = 0.8 V
100
100
100
A
II(hold)
VCC = 4.5 V
VI = 2 V
100
100
100
A
I
VCC = 0 to 1.9 V
VO = 0.5 V to 2.7 V,
50**
50**
A
IOZPU
VCC = 0 to 2.1 V
O
,
OE = X
50
50
A
I
VCC = 1.9 V to 0
VO = 0.5 V to 2.7 V,
50**
50**
A
IOZPD
VCC = 2.1 V to 0
O
,
OE = X
50
50
A
Ioff
VCC = 0,
VI or VO
4.5 V
100
100
A
ICEX
VCC = 5.5 V,
VO = 5.5 V
Outputs high
50
50
50
A
IO
VCC = 5.5 V,
VO = 2.5 V
50
100
180
50
180
50
180
mA
VCC = 5.5 V,
Outputs high
2
2
2
ICC
A or B ports
VCC = 5.5 V,
IO = 0,
Outputs low
32
32
32
mA
VI = VCC or GND
Outputs disabled
2
2
2
ICC
VCC = 5.5 V, One input at 3.4 V,
Other inputs at VCC or GND
1.5
1.5
1.5
mA
Ci
Control
inputs
VI = 2.5 V or 0.5 V
3
pF
Cio
A or B ports
VO = 2.5 V or 0.5 V
6
pF
* On products compliant to MIL-PRF-38535, this parameter does not apply.
** On products compliant to MIL-PRF-38535, this parameter is not production tested.
All typical values are at VCC = 5 V.
Not more than one output should be tested at a time, and the duration of the test should not exceed one second.
This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
SN54ABTH16245, SN74ABTH16245
16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS662I MARCH 1996 REVISED MARCH 1999
5
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, C
L
= 50 pF (unless otherwise noted) (see Figure 1)
SN54ABTH16245
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC = 5 V,
TA = 25
C
MIN
MAX
UNIT
MIN
TYP
MAX
tPLH
A or B
B or A
1
2.2
3.6
0.5
4.1
ns
tPHL
A or B
B or A
1
2.3
3.8
0.5
4.4
ns
tPZH
OE
B or A
1
3.6
5.2
0.8
6.4
ns
tPZL
OE
B or A
1
3.7
6.1
0.9
6.5
ns
tPHZ
OE
B or A
2
4.4
6.7
1.3
7.9
ns
tPLZ
OE
B or A
1.5
3.3
4.7
1.4
5.6
ns
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature, C
L
= 50 pF (unless otherwise noted) (see Figure 1)
SN74ABTH16245
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC = 5 V,
TA = 25
C
MIN
MAX
UNIT
MIN
TYP
MAX
tPLH
A or B
B or A
1
2.2
3.4
1
3.9
ns
tPHL
A or B
B or A
1
2.3
3.7
1
4.2
ns
tPZH
OE
B or A
1
3.6
5.2
1
6.3
ns
tPZL
OE
B or A
1
3.7
5.4
1
6.4
ns
tPHZ
OE
B or A
2
4.4
5.8
2
6.3
ns
tPLZ
OE
B or A
1.5
3.3
4.7
1.5
5.2
ns
SN54ABTH16245, SN74ABTH16245
16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCBS662I MARCH 1996 REVISED MARCH 1999
6
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
1.5 V
th
tsu
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
S1
7 V
Open
GND
500
500
Data Input
Timing Input
1.5 V
3 V
0 V
1.5 V
1.5 V
3 V
0 V
3 V
0 V
1.5 V
tw
Input
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
PULSE DURATION
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
1.5 V
1.5 V
3 V
0 V
1.5 V
1.5 V
Input
1.5 V
Output
Control
Output
Waveform 1
S1 at 7 V
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
1.5 V
1.5 V
3.5 V
0 V
1.5 V
VOL + 0.3 V
1.5 V
VOH 0.3 V
0 V
3 V
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
Output
Output
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
7 V
Open
TEST
S1
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR
10 MHz, ZO = 50
, tr
2.5 ns, tf
2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
1.5 V
Figure 1. Load Circuit and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
5962-9762501QXA
ACTIVE
CFP
WD
48
1
TBD
A42 SNPB
N / A for Pkg Type
74ABTH16245DGGRE4
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ABTH16245DGVRE4
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74ABTH16245DLRG4
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABTH16245DGGR
ACTIVE
TSSOP
DGG
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABTH16245DGVR
ACTIVE
TVSOP
DGV
48
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABTH16245DL
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABTH16245DLG4
ACTIVE
SSOP
DL
48
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74ABTH16245DLR
ACTIVE
SSOP
DL
48
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54ABTH16245WD
ACTIVE
CFP
WD
48
1
TBD
A42 SNPB
N / A for Pkg Type
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
29-Jun-2006
Addendum-Page 1
MECHANICAL DATA
MCFP010B JANUARY 1995 REVISED NOVEMBER 1997
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
WD (R-GDFP-F**)
CERAMIC DUAL FLATPACK
4040176 / D 10/97
48 LEADS SHOWN
48
48
25
56
0.610
(18,80)
0.710
(18,03)
0.740
0.640
0.390 (9,91)
0.370 (9,40)
0.870 (22,10)
1.130 (28,70)
1
A
0.120 (3,05)
0.075 (1,91)
LEADS**
24
NO. OF
A MIN
A MAX
(16,26)
(15,49)
0.025 (0,635)
0.009 (0,23)
0.004 (0,10)
0.370 (9,40)
0.250 (6,35)
0.370 (9,40)
0.250 (6,35)
0.014 (0,36)
0.008 (0,20)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification only
E. Falls within MIL STD 1835: GDFP1-F48 and JEDEC MO -146AA
GDFP1-F56 and JEDEC MO -146AB
MECHANICAL DATA
MPDS006C FEBRUARY 1996 REVISED AUGUST 2000
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50
4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
1
12
24
13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
38
24
16
4,90
5,10
3,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0
8
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins MO-153
14/16/20/56 Pins MO-194
MECHANICAL DATA

MSSO001C JANUARY 1995 REVISED DECEMBER 2001
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
4040048 / E 12/01
48 PINS SHOWN
56
0.730
(18,54)
0.720
(18,29)
48
28
0.370
(9,40)
(9,65)
0.380
Gage Plane
DIM
0.420 (10,67)
0.395 (10,03)
A MIN
A MAX
0.010 (0,25)
PINS **
0.630
(16,00)
(15,75)
0.620
0.010 (0,25)
Seating Plane
0.020 (0,51)
0.040 (1,02)
25
24
0.008 (0,203)
0.0135 (0,343)
48
1
0.008 (0,20) MIN
A
0.110 (2,79) MAX
0.299 (7,59)
0.291 (7,39)
0.004 (0,10)
M
0.005 (0,13)
0.025 (0,635)
0
8
0.005 (0,13)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
MECHANICAL DATA

MTSS003D JANUARY 1995 REVISED JANUARY 1998
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
4040078 / F 12/97
48 PINS SHOWN
0,25
0,15 NOM
Gage Plane
6,00
6,20
8,30
7,90
0,75
0,50
Seating Plane
25
0,27
0,17
24
A
48
1
1,20 MAX
M
0,08
0,10
0,50
0
8
56
14,10
13,90
48
DIM
A MAX
A MIN
PINS **
12,40
12,60
64
17,10
16,90
0,15
0,05
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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