SN74CBTH16211
24-BIT FET BUS SWITCH
WITH BUS HOLD
SCDS062C JUNE 1998 REVISED NOVEMBER 2001
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D
5-
Switch Connection Between Two Ports
D
TTL-Compatible Input Levels
D
Bus Hold on Data Inputs/Outputs
Eliminates the Need for External
Pullup/Pulldown Resistors
description
The SN74CBTH16211 provides 24 bits of
high-speed TTL-compatible bus switching. The
low on-state resistance of the switch allows
connections to be made with minimal propagation
delay.
The device is organized as dual 12-bit bus
switches with separate output-enable (OE)
inputs. It can be used as two 12-bit bus switches
or one 24-bit bus switch. When OE is low, the
associated 12-bit bus switch is on, and the A port
is connected to the B port. When OE is high, the
switch is open, and a high-impedance state exists
between the two ports.
Active bus-hold circuitry is provided to hold
unused or floating A and B ports at a valid logic
level.
To ensure the high-impedance state during power
up or power down, OE should be tied to V
CC
through a pullup resistor; the minimum value of
the resistor is determined by the current-sinking
capability of the driver.
ORDERING INFORMATION
TA
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
SSOP
DL
Tube
SN74CBTH16211DL
CBTH16211
40
C to 85
C
SSOP DL
Tape and reel
SN74CBTH16211DLR
CBTH16211
40
C to 85
C
TSSOP DGG
Tape and reel
SN74CBTH16211DGGR
CBTH16211
TVSOP DGV
Tape and reel
SN74CBTH16211DGVR
CYH211
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Copyright
2001, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
DGG, DGV, OR DL PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
NC
1A1
1A2
1A3
1A4
1A5
1A6
GND
1A7
1A8
1A9
1A10
1A11
1A12
2A1
2A2
V
CC
2A3
GND
2A4
2A5
2A6
2A7
2A8
2A9
2A10
2A11
2A12
1OE
2OE
1B1
1B2
1B3
1B4
1B5
GND
1B6
1B7
1B8
1B9
1B10
1B11
1B12
2B1
2B2
2B3
GND
2B4
2B5
2B6
2B7
2B8
2B9
2B10
2B11
2B12
NC No internal connection
SN74CBTH16211
24-BIT FET BUS SWITCH
WITH BUS HOLD
SCDS062C JUNE 1998 REVISED NOVEMBER 2001
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
FUNCTION TABLE
(each bus switch)
INPUT
OE
FUNCTION
L
A port = B port
H
Disconnect
logic diagram (positive logic)
1A1
1A12
1OE
1B1
1B12
2A1
2A12
2OE
2B1
2B12
2
14
56
15
28
55
54
42
41
29
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
CC
0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, V
I
(see Note 1)
0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous channel current
128 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, I
IK
(V
I
< 0)
50 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
JA
(see Note 2): DGG package
64
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DGV package
48
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DL package
56
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
65
C to 150
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
MIN
MAX
UNIT
VCC
Supply voltage
4
5.5
V
VIH
High-level control input voltage
2
V
VIL
Low-level control input voltage
0.8
V
TA
Operating free-air temperature
40
85
C
NOTE 3: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SN74CBTH16211
24-BIT FET BUS SWITCH
WITH BUS HOLD
SCDS062C JUNE 1998 REVISED NOVEMBER 2001
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VIK
VCC = 4.5 V,
II = 18 mA
1.2
V
II
Control inputs
VCC = 0 V,
VI = 5.5 V
10
A
II
All inputs
VCC = 5.5 V,
VI = 5.5 V or GND
10
A
IBHL
VCC = 4.5 V,
VI = 0.8 V
100
A
IBHH
VCC = 4.5 V,
VI = 2 V
100
A
IBHLO
VCC = 5.5 V,
VI = 0 to 5.5 V
500
A
IBHHO#
VCC = 5.5 V,
VI = 0 to 5.5 V
500
A
ICC
VCC = 5.5 V,
IO = 0,
VI = VCC or GND
3
A
ICC||
Control inputs
VCC = 5.5 V,
One input at 3.4 V,
Other inputs at VCC or GND
2.5
mA
VCC = 4 V,
TYP at VCC = 4 V
VI = 2.4 V,
II = 15 mA
14
20
ron
k
VI = 0
II = 64 mA
5
7
on
VCC = 4.5 V
VI = 0
II = 30 mA
5
7
VI = 2.4 V,
II = 15 mA
8
12
All typical values are at VCC = 5 V (unless otherwise noted), TA = 25
C.
The bus hold circuit can sink at least the minimum low sustaining current at VIL max. IBHL should be measured after lowering VIN to GND and
then raising it to VIL max.
The bus hold circuit can source at least the minimum high sustaining current at VIH min. IBHH should be measured after raising VIN to VCC and
then lowering it to VIH min.
An external driver must source at least IBHLO to switch this node from low to high.
# An external driver must sink at least IBHHO to switch this node from high to low.
|| This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND.
k
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. On-state resistance is determined by
the lowest voltage of the two (A or B) terminals.
switching characteristics over recommended operating free-air temperature range, C
L
= 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC = 4 V
VCC = 5 V
0.5 V
UNIT
(INPUT)
(OUTPUT)
MIN
MAX
MIN
MAX
tpd
h
A or B
B or A
0.35
0.25
ns
ten
OE
A or B
9.9
1
9.6
ns
tdis
OE
A or B
9.5
1
8.3
ns
h
The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
SN74CBTH16211
24-BIT FET BUS SWITCH
WITH BUS HOLD
SCDS062C JUNE 1998 REVISED NOVEMBER 2001
4
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VOH
VOL
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
S1
7 V
Open
GND
500
500
tPLH
tPHL
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 7 V
(see Note B)
Output
Waveform 2
S1 at Open
(see Note B)
tPZL
tPZH
tPLZ
tPHZ
1.5 V
1.5 V
1.5 V
1.5 V
3 V
0 V
1.5 V
1.5 V
VOH
VOL
0 V
1.5 V
VOL + 0.3 V
1.5 V
VOH 0.3 V
0 V
Input
3 V
3.5 V
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
Output
tpd
tPLZ/tPZL
tPHZ/tPZH
Open
7 V
Open
TEST
S1
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR
10 MHz, ZO = 50
, tr
2.5 ns, tr
2.5 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
74CBTH16211DGGRE4
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CBTH16211DGVRE4
ACTIVE
TVSOP
DGV
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CBTH16211DLRG4
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBTH16211DGGR
ACTIVE
TSSOP
DGG
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBTH16211DGVR
ACTIVE
TVSOP
DGV
56
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBTH16211DL
ACTIVE
SSOP
DL
56
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBTH16211DLG4
ACTIVE
SSOP
DL
56
20
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBTH16211DLR
ACTIVE
SSOP
DL
56
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
24-Feb-2006
Addendum-Page 1
MECHANICAL DATA
MPDS006C FEBRUARY 1996 REVISED AUGUST 2000
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50
4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
1
12
24
13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
38
24
16
4,90
5,10
3,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0
8
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins MO-153
14/16/20/56 Pins MO-194
MECHANICAL DATA
MSSO001C JANUARY 1995 REVISED DECEMBER 2001
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
DL (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
4040048 / E 12/01
48 PINS SHOWN
56
0.730
(18,54)
0.720
(18,29)
48
28
0.370
(9,40)
(9,65)
0.380
Gage Plane
DIM
0.420 (10,67)
0.395 (10,03)
A MIN
A MAX
0.010 (0,25)
PINS **
0.630
(16,00)
(15,75)
0.620
0.010 (0,25)
Seating Plane
0.020 (0,51)
0.040 (1,02)
25
24
0.008 (0,203)
0.0135 (0,343)
48
1
0.008 (0,20) MIN
A
0.110 (2,79) MAX
0.299 (7,59)
0.291 (7,39)
0.004 (0,10)
M
0.005 (0,13)
0.025 (0,635)
0
8
0.005 (0,13)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).
D. Falls within JEDEC MO-118
MECHANICAL DATA
MTSS003D JANUARY 1995 REVISED JANUARY 1998
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
DGG (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
4040078 / F 12/97
48 PINS SHOWN
0,25
0,15 NOM
Gage Plane
6,00
6,20
8,30
7,90
0,75
0,50
Seating Plane
25
0,27
0,17
24
A
48
1
1,20 MAX
M
0,08
0,10
0,50
0
8
56
14,10
13,90
48
DIM
A MAX
A MIN
PINS **
12,40
12,60
64
17,10
16,90
0,15
0,05
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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