SN74CBTLV3251
LOW VOLTAGE 1 OF 8 FET MULTIPLEXER/DEMULTIPLEXER
SCDS054I - MARCH 1998 - REVISED OCTOBER 2003
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D
5-
Switch Connection Between Two Ports
D
Rail-to-Rail Switching on Data I/O Ports
D
I
off
Supports Partial-Power-Down Mode
Operation
D
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
B4
B3
B2
B1
A
NC
OE
GND
V
CC
B5
B6
B7
B8
S0
S1
S2
D, DBQ, DGV, OR PW PACKAGE
(TOP VIEW)
NC - No internal connection
RGY PACKAGE
(TOP VIEW)
1
16
8
9
2
3
4
5
6
7
15
14
13
12
11
10
B5
B6
B7
B8
S0
S1
B3
B2
B1
A
NC
OE
B4
S2
V
GND
CC
NC - No internal connection
description/ordering information
The SN74CBTLV3251 device is a 1-of-8 high-speed FET multiplexer/demultiplexer. The low on-state resistance
of the switch allows connections to be made with minimal propagation delay.
The select inputs (S0, S1, S2) control the data flow. The FET multiplexers/demultiplexers are disabled when
the output-enable (OE) input is high.
This device is fully specified for partial-power-down applications using I
off
. The I
off
feature ensures that
damaging current will not backflow through the device when it is powered down. The device has isolation during
power off.
To ensure the high-impedance state during power up or power down, OE should be tied to V
CC
through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
TA
PACKAGE
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
QFN - RGY
Tape and reel
SN74CBTLV3251RGYR
CL251
SOIC - D
Tube
SN74CBTLV3251D
CBTLV3251
-40
C to 85
C
SOIC - D
Tape and reel
SN74CBTLV3251DR
CBTLV3251
-40
C to 85
C
SSOP (QSOP) - DBQ
Tape and reel
SN74CBTLV3251DBQR
CL251
TSSOP - PW
Tape and reel
SN74CBTLV3251PWR
CL251
TVSOP - DGV
Tape and reel
SN74CBTLV3251DGVR
CL251
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines
are available at www.ti.com/sc/package.
Copyright
2003, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
SN74CBTLV3251
LOW VOLTAGE 1 OF 8 FET MULTIPLEXER/DEMULTIPLEXER
SCDS054I - MARCH 1998 - REVISED OCTOBER 2003
2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
FUNCTION TABLE
INPUTS
FUNCTION
OE
S2
S1
S0
FUNCTION
L
L
L
L
A port = B1 port
L
L
L
H
A port = B2 port
L
L
H
L
A port = B3 port
L
L
H
H
A port = B4 port
L
H
L
L
A port = B5 port
L
H
L
H
A port = B6 port
L
H
H
L
A port = B7 port
L
H
H
H
A port = B8 port
H
X
X
X
Disconnect
logic diagram (positive logic)
B5
B1
A
S0
S1
S2
OE
B2
B3
B4
B6
B7
B8
SW
SW
SW
SW
SW
SW
SW
SW
5
11
10
9
7
4
3
2
1
15
14
13
12
SN74CBTLV3251
LOW VOLTAGE 1 OF 8 FET MULTIPLEXER/DEMULTIPLEXER
SCDS054I - MARCH 1998 - REVISED OCTOBER 2003
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
simplified schematic, each FET switch
A
(OE)
B
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
CC
-0.5 V to 4.6 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, V
I
(see Note 1)
-0.5 V to 4.6 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous channel current
128 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, I
K
(V
I/O
< 0)
-50 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
JA
(see Note 2): D package
73
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): DBQ package
90
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): DGV package
120
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): PW package
108
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 3): RGY package
39
C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, T
stg
-65
C to 150
C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3. The package thermal impedance is calculated in accordance with JESD 51-5.
recommended operating conditions (see Note 4)
MIN
MAX
UNIT
VCC
Supply voltage
2.3
3.6
V
VIH
High-level control input voltage
VCC = 2.3 V to 2.7 V
1.7
V
VIH
High-level control input voltage
VCC = 2.7 V to 3.6 V
2
V
VIL
Low-level control input voltage
VCC = 2.3 V to 2.7 V
0.7
V
VIL
Low-level control input voltage
VCC = 2.7 V to 3.6 V
0.8
V
TA
Operating free-air temperature
-40
85
C
NOTE 4: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
SN74CBTLV3251
LOW VOLTAGE 1 OF 8 FET MULTIPLEXER/DEMULTIPLEXER
SCDS054I - MARCH 1998 - REVISED OCTOBER 2003
4
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
VIK
VCC = 3 V,
II = -18 mA
-1.2
V
II
VCC = 3.6 V,
VI = VCC or GND
1
A
Ioff
VCC = 0,
VI or VO = 0 to 3.6 V
20
A
ICC
VCC = 3.6 V,
IO = 0,
VI = VCC or GND
10
A
ICC
Control inputs
VCC = 3.6 V,
One input at 3 V,
Other inputs at VCC or GND
300
A
Ci
Control inputs
VI = 3 V or 0
3
pF
Cio(OFF)
A port
VO = 3 V or 0,
OE = VCC
40.5
pF
Cio(OFF)
B port
VO = 3 V or 0,
OE = VCC
6
pF
VCC = 2.3 V,
VI = 0
II = 64 mA
5
8
VCC = 2.3 V,
TYP at VCC = 2.5 V
VI = 0
II = 24 mA
5
8
ron
TYP at VCC = 2.5 V
VI = 1.7 V,
II = 15 mA
27
40
ron
VI = 0
II = 64 mA
5
7
VCC = 3 V
VI = 0
II = 24 mA
5
7
VCC = 3 V
VI = 2.4 V,
II = 15 mA
10
15
All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25
C.
This is the increase in supply current for each input that is at the specified voltage level, rather than VCC or GND.
Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. On-state resistance is determined
by the lower of the voltages of the two (A or B) terminals.
switching characteristics over recommended operating free-air temperature range (unless
otherwise noted) (see Figure 1)
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
VCC = 2.5 V
0.2 V
VCC = 3.3 V
0.3 V
UNIT
PARAMETER
(INPUT)
(OUTPUT)
MIN
MAX
MIN
MAX
UNIT
tpd
A or B
B or A
0.15
0.25
ns
tpd
S
A
1
6.1
1
5.3
ns
ten
S
B
1
4.1
1
3.6
ns
tdis
S
B
1
3.5
1
3.3
ns
ten
OE
A or B
1
5.2
1
4.5
ns
tdis
OE
A or B
1
6.7
1
7.2
ns
The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the specified load capacitance, when
driven by an ideal voltage source (zero output impedance).
SN74CBTLV3251
LOW VOLTAGE 1 OF 8 FET MULTIPLEXER/DEMULTIPLEXER
SCDS054I - MARCH 1998 - REVISED OCTOBER 2003
5
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VCC/2
th
tsu
From Output
Under Test
CL
(see Note A)
LOAD CIRCUIT
S1
2
VCC
Open
GND
RL
RL
Data Input
Timing Input
VCC
0 V
VCC
0 V
0 V
tw
Input
VOLTAGE WAVEFORMS
SETUP AND HOLD TIMES
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
INVERTING AND NONINVERTING OUTPUTS
VOLTAGE WAVEFORMS
PULSE DURATION
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
VCC
0 V
Input
Output
Waveform 1
S1 at 2
VCC
(see Note B)
Output
Waveform 2
S1 at GND
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
VCC
0 V
VOL + V
VOH - V
0 V
VCC
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
LOW- AND HIGH-LEVEL ENABLING
Output
Output
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2
VCC
GND
TEST
S1
NOTES: A. CL includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR
10 MHz, ZO = 50
, tr
2 ns, tf
2 ns.
D. The outputs are measured one at a time with one transition per measurement.
E. tPLZ and tPHZ are the same as tdis.
F. tPZL and tPZH are the same as ten.
G. tPLH and tPHL are the same as tpd.
H. All parameters and waveforms are not applicable to all devices.
Output
Control
VCC/2
VCC/2
VCC/2
VCC/2
VCC/2
VCC/2
VCC/2
VCC/2
VCC/2
VCC/2
VCC/2
VCC/2
VCC
VCC/2
VCC/2
2.5 V
0.2 V
3.3 V
0.3 V
500
500
VCC
RL
0.15 V
0.3 V
V
CL
30 pF
50 pF
Figure 1. Load Circuit and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
74CBTLV3251DBQRE4
ACTIVE
SSOP/
QSOP
DBQ
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
74CBTLV3251DGVRE4
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CBTLV3251PWRE4
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
74CBTLV3251RGYRG4
ACTIVE
QFN
RGY
16
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74CBTLV3251D
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBTLV3251DBQR
ACTIVE
SSOP/
QSOP
DBQ
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
SN74CBTLV3251DE4
ACTIVE
SOIC
D
16
40
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBTLV3251DGVR
ACTIVE
TVSOP
DGV
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBTLV3251DR
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBTLV3251DRE4
ACTIVE
SOIC
D
16
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBTLV3251PWR
ACTIVE
TSSOP
PW
16
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74CBTLV3251RGYR
ACTIVE
QFN
RGY
16
1000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-2-260C-1YEAR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco
Plan
-
The
planned
eco-friendly
classification:
Pb-Free
(RoHS)
or
Green
(RoHS
&
no
Sb/Br)
-
please
check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
25-Oct-2005
Addendum-Page 1
MECHANICAL DATA
MPDS006C FEBRUARY 1996 REVISED AUGUST 2000
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
DGV (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
24 PINS SHOWN
14
3,70
3,50
4,90
5,10
20
DIM
PINS **
4073251/E 08/00
1,20 MAX
Seating Plane
0,05
0,15
0,25
0,50
0,75
0,23
0,13
1
12
24
13
4,30
4,50
0,16 NOM
Gage Plane
A
7,90
7,70
38
24
16
4,90
5,10
3,70
3,50
A MAX
A MIN
6,60
6,20
11,20
11,40
56
9,60
9,80
48
0,08
M
0,07
0,40
0
8
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.
D. Falls within JEDEC: 24/48 Pins MO-153
14/16/20/56 Pins MO-194
MECHANICAL DATA
MTSS001C JANUARY 1995 REVISED FEBRUARY 1999
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65
M
0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
20
16
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
8
0,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM
PINS **
0,05
4,90
5,10
Seating Plane
0
8
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI's terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright
2005, Texas Instruments Incorporated
PDF 
ZIP