1
Data sheet acquired from Harris Semiconductor
SCHS219D
Features
Four Independent EXCLUSIVE NOR Gates
Buffered Inputs and Outputs
Logical Comparators
Parity Generators and Checkers
Adders/Subtracters
Fanout (Over Temperature Range)
- Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
Wide Operating Temperature Range . . . -55
o
C to 125
o
C
Balanced Propagation Delay and Transition Times
Significant Power Reduction Compared to LSTTL
Logic ICs
HC Types
- 2V to 6V Operation
- High Noise Immunity: N
IL
= 30%, N
IH
= 30%of V
CC
at
V
CC
= 5V
Description
The 'HC7266 contains four independent Exclusive NOR
gates in one package. They provide the system designer
with a means for implementation of the EXCLUSIVE NOR
function.
This device is functionally the same as the TTL226. They
differ in that the 'HC7266 has active high and low outputs
whereas the 226 has open collector outputs.
Pinout
CD54HC7266
(CERDIP)
CD74HC7266
(PDIP, SOIC)
TOP VIEW
Ordering Information
PART NUMBER
TEMP. RANGE
(
o
C)
PACKAGE
CD54HC7266F3A
-55 to 125
14 Ld CERDIP
CD74HC7266E
-55 to 125
14 Ld PDIP
CD74HC7266M
-55 to 125
14 Ld SOIC
CD74HC7266MT
-55 to 125
14 Ld SOIC
CD74HC7266M96
-55 to 125
14 Ld SOIC
NOTE: When ordering, use the entire part number. The suffix 96
denotes tape and reel. The suffix T denotes a small-quantity reel
of 250.
1A
1B
1Y
2Y
2A
2B
GND
V
CC
4B
4A
4Y
3Y
3B
3A
1
2
3
4
5
6
7
14
13
12
11
10
9
8
August 1997 - Revised September 2003
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright
2003, Texas Instruments Incorporated
CD54HC7266, CD74HC7266
High-Speed CMOS Logic
Quad 2-Input EXCLUSIVE NOR Gate
[ /Title
(CD74H
C7266)
/Subject
(High
Speed
CMOS
Logic
Quad 2-
Input
EXCLU-
SIVE
2
Functional Diagram
Logic Symbol
TRUTH TABLE
INPUTS
OUTPUT
nA
nB
nY
L
L
H
L
H
L
H
L
L
H
H
H
H = High Voltage Level, L = Low Voltage Level
1A
1B
2A
2B
3A
3B
4A
4B
1
2
5
6
8
9
12
13
3
4
10
11
1Y
2Y
3Y
4Y
GND = 7
V
CC
= 14
nA
nB
nY
CD54HC7266, CD74HC7266
3
Absolute Maximum Ratings
Thermal Information
DC Supply Voltage, V
CC
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, I
IK
For V
I
< -0.5V or V
I
> V
CC
+ 0.5V
. . . . . . . . . . . . . . . . . . . . . .
20mA
DC Output Diode Current, I
OK
For V
O
< -0.5V or V
O
> V
CC
+ 0.5V
. . . . . . . . . . . . . . . . . . . .
20mA
DC Output Source or Sink Current per Output Pin, I
O
For V
O
> -0.5V or V
O
< V
CC
+ 0.5V
. . . . . . . . . . . . . . . . . . . .
25mA
DC V
CC
or Ground Current, I
CC or
I
GND
. . . . . . . . . . . . . . . . . .
50mA
Operating Conditions
Temperature Range (T
A
) . . . . . . . . . . . . . . . . . . . . . -55
o
C to 125
o
C
Supply Voltage Range, V
CC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, V
I
, V
O
. . . . . . . . . . . . . . . . . 0V to V
CC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
Thermal Resistance (Typical, Note 1)
JA
(
o
C/W)
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . .
80
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . .
86
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150
o
C
Maximum Storage Temperature Range . . . . . . . . . .-65
o
C to 150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300
o
C
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
PARAMETER
SYMBOL
TEST
CONDITIONS
V
CC
(V)
25
o
C
-40
o
C TO 85
o
C -55
o
C TO 125
o
C
UNITS
V
I
(V)
I
O
(mA)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
HC TYPES
High Level Input
Voltage
V
IH
-
-
2
1.5
-
-
1.5
-
1.5
-
V
4.5
3.15
-
-
3.15
-
3.15
-
V
6
4.2
-
-
4.2
-
4.2
-
V
Low Level Input
Voltage
V
IL
-
-
2
-
-
0.5
-
0.5
-
0.5
V
4.5
-
-
1.35
-
1.35
-
1.35
V
6
-
-
1.8
-
1.8
-
1.8
V
High Level Output
Voltage
CMOS Loads
V
OH
V
IH
or V
IL
-0.02
2
1.9
-
-
1.9
-
1.9
-
V
-0.02
4.5
4.4
-
-
4.4
-
4.4
-
V
-0.02
6
5.9
-
-
5.9
-
5.9
-
V
High Level Output
Voltage
TTL Loads
-4
4.5
3.98
-
-
3.84
-
3.7
-
V
-5.2
6
5.48
-
-
5.34
-
5.2
-
V
Low Level Output
Voltage
CMOS Loads
V
OL
V
IH
or V
IL
0.02
2
-
-
0.1
-
0.1
-
0.1
V
0.02
4.5
-
-
0.1
-
0.1
-
0.1
V
0.02
6
-
-
0.1
-
0.1
-
0.1
V
Low Level Output
Voltage
TTL Loads
4
4.5
-
-
0.26
-
0.33
-
0.4
V
5.2
6
-
-
0.26
-
0.33
-
0.4
V
CD54HC7266, CD74HC7266
4
Input Leakage
Current
I
I
V
CC
or
GND
-
6
-
-
0.1
-
1
-
1
A
Quiescent Device
Current
I
CC
V
CC
or
GND
0
6
-
-
2
-
20
-
40
A
DC Electrical Specifications
(Continued)
PARAMETER
SYMBOL
TEST
CONDITIONS
V
CC
(V)
25
o
C
-40
o
C TO 85
o
C -55
o
C TO 125
o
C
UNITS
V
I
(V)
I
O
(mA)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
Switching Specifications
Input t
r
, t
f
= 6ns
PARAMETER
SYMBOL
TEST
CONDITIONS
V
CC
(V)
25
o
C
-40
o
C TO 85
o
C
-55
o
C TO 125
o
C
UNITS
TYP
MAX
MAX
MAX
HC TYPES
Propagation Delay
t
PLH,
t
PHL
C
L
= 50pF
2
-
115
145
150
ns
4.5
-
23
29
35
ns
6
-
30
25
30
ns
Propagation Delay Time, Any
Input
t
PLH,
t
PHL
C
L
= 15pF
5
9
-
-
-
ns
Output Transition Times
(Figure 1)
t
TLH
, t
THL
C
L
= 50pF
2
-
75
95
110
ns
4.5
-
15
19
22
ns
6
-
13
16
19
ns
Input Capacitance
C
IN
-
-
-
10
10
10
pF
Power Dissipation
Capacitance
C
PD
(Note 2)
C
L
= 15pF
5
33
-
-
-
pF
NOTE:
2. C
PD
is used to determine the dynamic power consumption per gate, P
D
= V
CC
2
f
i
(C
PD
+ C
L
) where f
i
= Input Frequency, C
L
= Output
Load Capacitance, V
CC
= Supply Voltage.
Test Circuit and Waveform
FIGURE 1. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC
t
PHL
t
PLH
t
THL
t
TLH
90%
50%
10%
50%
10%
INVERTING
OUTPUT
INPUT
GND
V
CC
t
r
= 6ns
t
f
= 6ns
90%
CD54HC7266, CD74HC7266
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
8404302CA
ACTIVE
CDIP
J
14
1
TBD
Call TI
Level-NC-NC-NC
CD54HC7266F3A
ACTIVE
CDIP
J
14
1
TBD
Call TI
Level-NC-NC-NC
CD74HC7266E
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD74HC7266EE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
CD74HC7266M
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC7266M96
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC7266M96E4
ACTIVE
SOIC
D
14
2500 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC7266ME4
ACTIVE
SOIC
D
14
50
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC7266MT
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CD74HC7266MTE4
ACTIVE
SOIC
D
14
250
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco
Plan
-
The
planned
eco-friendly
classification:
Pb-Free
(RoHS)
or
Green
(RoHS
&
no
Sb/Br)
-
please
check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
Addendum-Page 1
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