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Электронный компонент: 8415101SA

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PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
84151012A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
8415101RA
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
8415101RA
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
8415101SA
ACTIVE
CFP
W
20
1
TBD
Call TI
Level-NC-NC-NC
8415101SA
ACTIVE
CFP
W
20
1
TBD
Call TI
Level-NC-NC-NC
84152012A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
8415201RA
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
8415201SA
ACTIVE
CFP
W
20
1
TBD
Call TI
Level-NC-NC-NC
84153012A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
8415301RA
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
8415301SA
ACTIVE
CFP
W
20
1
TBD
Call TI
Level-NC-NC-NC
SN54LS682J
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
SN54LS682J
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
SN54LS684J
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
SN54LS688J
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
SN74LS682DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS682N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS682NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS682NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS682NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS682NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
Addendum-Page 1
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
SN74LS684DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS684DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS684DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS684DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS684N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS684NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS684NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS686DW
OBSOLETE
SOIC
DW
24
TBD
Call TI
Call TI
SN74LS686NT
OBSOLETE
PDIP
NT
24
TBD
Call TI
Call TI
SN74LS687NT
OBSOLETE
PDIP
NT
24
TBD
Call TI
Call TI
SN74LS687NT
OBSOLETE
PDIP
NT
24
TBD
Call TI
Call TI
SN74LS688DW
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS688DWE4
ACTIVE
SOIC
DW
20
25
Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS688DWR
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS688DWRE4
ACTIVE
SOIC
DW
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS688N
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS688N3
OBSOLETE
PDIP
N
20
TBD
Call TI
Call TI
SN74LS688NE4
ACTIVE
PDIP
N
20
20
Pb-Free
(RoHS)
CU NIPDAU
Level-NC-NC-NC
SN74LS688NSR
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN74LS688NSRE4
ACTIVE
SO
NS
20
2000 Green (RoHS &
no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SNJ54LS682FK
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS682FK
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS682J
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS682J
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS682W
ACTIVE
CFP
W
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS682W
ACTIVE
CFP
W
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS684FK
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS684J
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS684W
ACTIVE
CFP
W
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS688FK
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS688J
ACTIVE
CDIP
J
20
1
TBD
Call TI
Level-NC-NC-NC
SNJ54LS688W
ACTIVE
CFP
W
20
1
TBD
Call TI
Level-NC-NC-NC
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
Addendum-Page 2
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco
Plan
-
The
planned
eco-friendly
classification:
Pb-Free
(RoHS)
or
Green
(RoHS
&
no
Sb/Br)
-
please
check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2005
Addendum-Page 3
MECHANICAL DATA

MLCC006B OCTOBER 1996
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
FK (S-CQCC-N**)
LEADLESS CERAMIC CHIP CARRIER
4040140 / D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MIN
MAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)
(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
13
14
15
16
18
17
11
10
8
9
7
5
4
3
2
0.020 (0,51)
0.010 (0,25)
6
1
28
26
27
19
21
B SQ
A SQ
22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
MECHANICAL DATA

MPDI004 OCTOBER 1994
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
NT (R-PDIP-T**)
PLASTIC DUAL-IN-LINE PACKAGE
4040050 / B 04/95
24 PINS SHOWN
1.425
(36,20)
1.385
0.295
(7,49)
(8,00)
0.315
(35,18)
28
PINS **
A MIN
A MAX
B MAX
B MIN
13
0.250 (6,35)
0.280 (7,11)
12
0.200 (5,08) MAX
DIM
24
1.230
(31,24)
(32,04)
1.260
0.310
(7,87)
(7,37)
0.290
B
0.125 (3,18) MIN
Seating Plane
0.010 (0,25) NOM
A
0.070 (1,78) MAX
24
1
0.015 (0,38)
0.021 (0,53)
0.020 (0,51) MIN
0.100 (2,54)
M
0.010 (0,25)
0
15
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
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amplifier.ti.com
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www.ti.com/audio
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dataconverter.ti.com
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dsp.ti.com
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www.ti.com/broadband
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interface.ti.com
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www.ti.com/digitalcontrol
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logic.ti.com
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www.ti.com/military
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power.ti.com
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www.ti.com/opticalnetwork
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microcontroller.ti.com
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www.ti.com/security
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www.ti.com/telephony
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www.ti.com/video
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www.ti.com/wireless
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Copyright
2005, Texas Instruments Incorporated