Document Outline
- FEATURES
- APPLICATIONS
- DESCRIPTION
- ABSOLUTE MAXIMUM RATINGS
- PACKAGE/ORDERING INFORMATION
- PIN CONFIGURATIONS
- ELECTRICAL CHARACTERISTICS
- TYPICAL CHARACTERISTICS
- APPLICATIONS INFORMATION
- INPUT BIAS CURRENT GUARDING
- APPLICATION CIRCUITS
- PACKAGE DRAWINGS
- P(R-PDIP-T8) PLASTIC DUAL-IN-LINE
- D (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
High-Speed Precision
Difet
OPERATIONAL AMPLIFIER
APPLICATIONS
q
PRECISION INSTRUMENTATION
q
OPTOELECTRONICS
q
SONAR, ULTRASOUND
q
PROFESSIONAL AUDIO EQUIPMENT
q
MEDICAL EQUIPMENT
q
DATA CONVERSION
Cascode
In
(2)
+In
(3)
+V
S
(7)
Output
(6)
V
S
(4)
(1)
(5)
Difet
Burr-Brown Corp.
FEATURES
q
WIDE BANDWIDTH: 6.5MHz
q
HIGH SLEW RATE: 35V/
s
q
LOW OFFSET:
250
V max
q
LOW BIAS CURRENT:
1pA max
q
FAST SETTLING TIME: 1
s to 0.01%
q
UNITY-GAIN STABLE
DESCRIPTION
The OPA602 is a precision, wide bandwidth FET operational
amplifier. Monolithic
Difet (dielectrically isolated FET) con-
struction provides an unusual combination of high-speed and
accuracy.
Its wide-bandwidth design minimizes dynamic errors. High
slew rate and fast settling time allow accurate signal process-
ing in pulse and data conversion applications. Wide band-
width and low distortion minimize AC errors. All specifications
are rated with a 1k
resistor in parallel with 500pF load. The
OPA602 is unity-gain stable and easily drives capacitive
loads up to 1500pF.
Laser-trimmed input circuitry provides offset voltage and drift
performance normally associated with precision bipolar op
amps.
Difet construction achieves extremely low input bias
currents (1pA max) without compromising input voltage noise.
The OPA602's unique input cascode circuitry maintains low
input bias current and precise input characteristics over its
full input common-mode voltage range.
OPA602
SBOS155A AUGUST 1987 REVISED OCTOBER 2002
www.ti.com
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright 1987, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
OPA6
02
OPA6
02
OPA602
2
SBOS155A
www.ti.com
Supply Voltage ...............................................................................
18V
DC
Internal Power Dissipation (T
J
+175
C) .................................... 1000mW
Differential Input Voltage .............................................................. Total V
S
Input Voltage Range ............................................................................
V
S
Storage Temperature Range
P and U Packages ....................................................... 40
C to +125
C
Operating Temperature Range
P and U Packages ........................................................ 25
C to + 85
C
Lead Temperature
U Package, SO (3s) .................................................................... +260
C
Output Short-Circuit to Ground (+25
C) ................................... Continuous
Junction Temperature .................................................................... +175
C
NOTE: (1) Stresses above those listed under "Absolute Maximum Ratings"
may cause permanent damage to the device. Exposure to absolute maximum
conditions for extended periods may affect device reliability.
ELECTROSTATIC
DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Texas Instru-
ments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degrada-
tion to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
OFFSET
SPECIFIED
VOLTAGE MAX
PACKAGE
TEMPERATURE
PACKAGE
ORDERING
TRANSPORT
PRODUCT
(
V) AT 25
C
PACKAGE-LEAD
DESIGNATOR
(1)
RANGE
MARKING
NUMBER
MEDIA, QUANTITY
OPA602AP
2000
DIP-8
P
25
C to +85
C
602AP
602AP
Tubes, 50
OPA602BP
1000
"
"
"
602BP
602BP
Tubes, 50
OPA602AU
3000
SO-8
D
25
C to +85
C
602AU
602AU
Tubes, 100
NOTE: (1) For the most current specifications and package information, refer to our web site at www.ti.com.
PACKAGE/ORDERING INFORMATION
ABSOLUTE MAXIMUM RATINGS
(1)
PIN CONFIGURATIONS
Top View
DIP, SO
8
7
5
6
+V
S
Output
Offset Trim
NC
DIP-8
1
2
4
3
In
+In
V
S
Offset Trim
1
2
3
4
8
7
6
5
NC
+V
S
Output
Offset Trim
Offset Trim
In
+In
V
S
SO-8
NC = No Connection
OPA602
3
SBOS155A
www.ti.com
ELECTRICAL CHARACTERISTICS
At V
S
=
15V
DC
and T
A
= +25
C, unless otherwise noted.
Same specifications as OPA602BP.
NOTE: (1) OPA602AP, AU ensured by design with a 99% confidence level.
OPA602BP
OPA602AP, AU
PARAMETER
CONDITIONS
MIN
TYP
MAX
MIN
TYP
MAX
UNITS
INPUT NOISE
Voltage:
f
O
= 10Hz
23
nV/
Hz
f
O
= 100Hz
19
nV/
Hz
f
O
= 1kHz
13
nV/
Hz
f
O
= 10kHz
12
nV/
Hz
f
B
= 10Hz to 10kHz
1.4
Vrms
f
B
= 0.1Hz to 10Hz
0.95
Vp-p
Current:
f
B
= 0.1Hz to 10Hz
12
fAp-p
f
O
= 0.1Hz to 20kHz
0.6
fA/
Hz
OFFSET VOLTAGE
Input Offset Voltage:
P Package
0.5
1
1
2
mV
U Package
1
3
mV
Over Specified Temperature
P, U Packages
0.75
1.5
1.5
mV
Average Drift
(1)
T
A
= T
MIN
to T
MAX
3
5
15
V/
C
Supply Rejection
V
S
= 12V to 18V
80
100
70
dB
BIAS CURRENT
Input Bias Current
V
CM
= 0V
DC
1
2
2
10
pA
Over Specified Temperature
20
200
20
500
pA
OFFSET CURRENT
Input Offset Current
V
CM
= 0V
DC
0.5
2
1
10
pA
Over Specified Temperature
20
200
20
500
pA
INPUT IMPEDANCE
Differential
10
13
|| 1
||
pF
Common-Mode
10
14
|| 3
||
pF
INPUT VOLTAGE RANGE
Common-Mode Input Range
10.2
+13, 11
V
Common-Mode Rejection
V
IN
=
10V
DC
88
100
75
dB
OPEN-LOOP GAIN, DC
Open-Loop Voltage Gain
R
L
1k
88
100
75
dB
FREQUENCY RESPONSE
Gain Bandwidth
Gain = 100
4
6.5
3.5
MHz
Full-Power Response
20Vp-p, R
L
= 1k
570
kHz
Slew Rate
V
O
=
10V, R
L
= 1k
24
35
20
V/
s
Settling Time:
0.1%
Gain = 1, R
L
= 1k
0.6
s
0.01%
C
L
= 500pF, 10V Step
1.0
s
RATED OUTPUT
Voltage Output
R
L
= 1k
11.5
+12.9,
11
V
13.8
Current Output
V
O
=
10V
DC
15
20
mA
Output Resistance
1MHz, Open Loop
80
Load Capacitance Stability
Gain = +1
1500
pF
Short-Circuit Current
30
50
25
mA
POWER SUPPLY
Rated Voltage
15
V
DC
Voltage Range, Derated Performance
5
18
V
DC
Current, Quiescent
I
O
= 0mADC
3
4
mA
Over Specified Temperature
3.5
4.5
mA
TEMPERATURE RANGE
Specification
Ambient Temperature
25
+85
C
Operating:
P, U Packages
25
+85
C
Storage:
P, U Packages
40
+125
C
JA
200
C/W
OPA602
4
SBOS155A
www.ti.com
TYPICAL CHARACTERISTICS
At T
A
= +25
C and V
S
=
15V
DC
, unless otherwise noted.
INPUT CURRENT NOISE SPECTRAL DENSITY
100
10
1
0.1
1
10
100
1k
10k
100k
1M
Frequency (Hz)
Current Noise (fA/
Hz)
INPUT VOLTAGE NOISE SPECTRAL DENSITY
1k
100
10
1
1
10
100
1k
10k
100k
1M
Frequency (Hz)
Voltage Noise (nV/
Hz)
POWER-SUPPLY REJECTION AND COMMON-MODE
REJECTION vs TEMPERATURE
110
75
Temperature (
C)
CMR and PSR (dB)
105
100
95
90
50
25
0
25
50
75
100
125
CMR
PSR
E
O
R
S
TOTAL INPUT VOLTAGE NOISE SPECTRAL DENSITY
AT 1kHz vs SOURCE RESISTANCE
1k
100
10
1
100
1k
10k
100k
1M
10M
100M
Source Resistance (
)
Voltage Noise, E
O
(nV/
Hz)
OPA602 + Resistor
Resistor Noise Only
COMMON-MODE REJECTION
vs INPUT COMMON-MODE VOLTAGE
120
15
10
5
0
+5
+10
+15
Common-Mode Rejection (dB)
Common-Mode Voltage (V)
110
100
90
80
70
OPEN-LOOP FREQUENCY RESPONSE
140
1
Frequency (Hz)
Voltage Gain (dB)
10
100
1k
10k
100k
1M
10M
120
100
80
60
40
20
0
45
90
135
180
Phase Shift (degrees)
R
L
= 1k
C
L
= 100pF
A
OL
OPA602
5
SBOS155A
www.ti.com
TYPICAL CHARACTERISTICS
(Cont.)
At T
A
= +25
C and V
S
=
15V
DC
, unless otherwise noted.
GAIN BANDWIDTH AND SLEW RATE
vs TEMPERATURE
10
75
Ambient Temperature (
C)
Gain Bandwidth (MHz)
Slew Rate (V/
s)
8
6
4
2
50
25
0
25
50
75
100
125
37
35
33
31
29
GBW
Slew Rate
GAIN BANDWIDTH AND SLEW RATE
vs SUPPLY VOLTAGE
8
0
Supply Voltage (
V
CC
)
Gain Bandwidth (MHz)
Slew Rate (V/
s)
5
5
10
15
20
38
32
7
6
36
34
A
V
= 1
GBW
Slew Rate
OPEN-LOOP GAIN vs TEMPERATURE
120
75
Ambient Temperature (
C)
Voltage Gain (dB)
110
100
90
80
50
25
0
25
50
75
100
125
MAXIMUM OUTPUT VOLTAGE SWING
vs FREQUENCY
30
10k
100k
1M
10M
Frequency (Hz)
Output Voltage (Vp-p)
20
10
0
R
L
= 1k
LARGE-SIGNAL TRANSIENT RESPONSE
Output V
oltage (V)
Time (
s)
10
0
10
0
1
2
3
4
5
SMALL-SIGNAL TRANSIENT RESPONSE
Output V
oltage (mV)
Time (
s)
150
100
50
0
50
100
150
0
2
5
OPA602
6
SBOS155A
www.ti.com
TYPICAL CHARACTERISTICS
(Cont.)
At T
A
= +25
C and V
S
=
15V
DC
, unless otherwise noted.
SETTLING TIME vs CLOSED-LOOP GAIN
5
4
3
2
1
0
1
10
100
1k
Closed-Loop Gain (V/V)
Settling Time (
s)
0.1%
R
L
= 1k
C
L
= 100pF
0.01%
SUPPLY CURRENT vs TEMPERATURE
3.5
3.25
3.0
2.75
2.5
75
Ambient Temperature (
C)
Supply Current (mA)
50
25
0
25
50
75
100
125
OPEN-LOOP GAIN vs SUPPLY VOLTAGE
104
0
Supply Voltage (
V
CC
)
Voltage Gain
92
5
10
15
20
100
96
TOTAL HARMONIC DISTORTION
vs FREQUENCY
1
0.1
0.01
0.001
0.1
Frequency (Hz)
THD + Noise (%rms)
1
10
100
1k
10k
100k
A
V
= +101V/V
A
V
= +1V/V
6.5Vrms
1k
402
40.2k
A
V
= +101V/V
BIAS AND OFFSET CURRENT vs TEMPERATURE
10nA
Bias Current (pA)
50
Ambient Temperature (
C)
10nA
Offset Current (pA)
25
0
25
50
75
100
125
1nA
100
10
1
0.1
1nA
100
10
1
0.1
BIAS AND OFFSET CURRENT
vs INPUT COMMON MODE VOLTAGE
10
1
0.1
0.01
Bias Current (pA)
15
Common-Mode Voltage (V)
10
1
0.1
0.01
Offset Current (pA)
10
5
0
5
10
15
Bias Current
Offset Current
OPA602
7
SBOS155A
www.ti.com
TYPICAL CHARACTERISTICS
(Cont.)
At T
A
= +25
C and V
S
=
15V
DC
, unless otherwise noted.
POWER-SUPPLY REJECTION vs FREQUENCY
140
1
Frequency (Hz)
Power-Supply Rejection (dB)
10
100
1k
10k
100k
1M
10M
120
100
80
60
40
20
0
+
COMMON-MODE REJECTION vs FREQUENCY
140
1
Frequency (Hz)
Common-Mode Rejection (dB)
10
100
1k
10k
100k
1M
10M
120
100
80
60
40
20
0
APPLICATIONS INFORMATION
Unity-gain stability with good phase margin and excellent
output drive characteristics bring freedom from the subtle
problems associated with other high-speed amplifiers. How-
ever, as with any high-speed, wide bandwidth circuitry, care-
ful circuit layout will ensure best performance. Make short,
direct interconnections and avoid stray wiring capacitance--
especially at the inverting input pin.
Power supplies should be bypassed with good high-frequency
capacitors positioned close to the op amp pins. In most cases
0.1
F ceramic capacitors are adequate. Applications with
heavier loads and fast transient waveforms may benefit from
use of additional 1.0
F tantalum bypass capacitors.
INPUT BIAS CURRENT GUARDING
Leakage currents across printed circuit boards can easily
exceed the input bias current of the OPA602. A circuit board
"guard" pattern, as shown in Figure 1, is an effective solution
to difficult leakage problems. This guard pattern must be
repeated on all layers of a multilayer board. By surrounding
critical high impedance input circuitry with a low impedance
circuit connection at the same potential, leakage currents will
flow harmlessly to the low-impedance node.
Input bias current may also be degraded by improper han-
dling or cleaning. Contamination from handling parts and
circuit boards may be cleaned with appropriate solvents and
deionized water. Each rinsing operation should be followed
by a 30-minute bake at +85
C.
Board Layout for Input Guarding:
Guard top and bottom of board.
Alternate--use Teflon
standoff for sensitive input pins.
Teflon
E.I. Du Pont de Nemours & Co.
FIGURE 1. Connection of Input Guard.
2
3
In
Noninverting
6
Out
2
3
In
Inverting
6
Out
2
3
In
Buffer
6
Out
OPA602
OPA602
OPA602
OPA602
8
SBOS155A
www.ti.com
V
V
B
B
B
B
V
V
V
V
V
OUT
REF
REF
OUT
REF
= -
+
+
+
+
-
+
-
1
2
3
12
2
4
8
4096
10
10
0
4095
4096
L
Where: B
N
= 1 if the B
N
digital input is high.
B
N
= 0 if the B
N
digital input is low.
APPLICATION CIRCUITS
FIGURE 2. Offset Voltage Trim.
FIGURE 3. Voltage Output Digital-to-Analog Converter.
3
6
2
OPA602
5
1
4
7
+V
S
V
S
(1)
10mV Typical
Trim Range
2
OPA602
V
OUT
4
5 6 7
8
9 10 11 12 13 14 15
DAC7541A
16
17
V
REFERENCE
+15V
Out 2
R
F
Out 1
C
1
15pF
3
V
CC
B
1
B
12
MSB
1
18
Single-Point Ground
100k
FIGURE 4. Settling Time and Slew Rate Test Circuit.
Output
+15V
2k
47pF
2k
15V
OPA602
High-Quality
Pulse Generator
Pulse In
5V
2k
1
F Tantalum
1
F Tantalum
+
+
2k
51
C
L
500pF
1
F
+
+
+
1
F
1
F
1
F
(2)
HP 5082-2835
+15V
1/2 2N5564
1/2 2N5564
15V
+
510
510
50
Error Out
0.5mV
(0.01%)
NOTE: (1) 10k
to 1M
trim potentiometer (100k
recommended).
OPA602
9
SBOS155A
www.ti.com
PACKAGE DRAWINGS
P (R-PDIP-T8)
PLASTIC DUAL-IN-LINE
8
4
0.015 (0,38)
Gage Plane
0.325 (8,26)
0.300 (7,62)
0.010 (0,25) NOM
MAX
0.430 (10,92)
4040082/D 05/98
0.200 (5,08) MAX
0.125 (3,18) MIN
5
0.355 (9,02)
0.020 (0,51) MIN
0.070 (1,78) MAX
0.240 (6,10)
0.260 (6,60)
0.400 (10,60)
1
0.015 (0,38)
0.021 (0,53)
Seating Plane
M
0.010 (0,25)
0.100 (2,54)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
OPA602
10
SBOS155A
www.ti.com
PACKAGE DRAWINGS
(Cont)
D (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
8 PINS SHOWN
8
0.197
(5,00)
A MAX
A MIN
(4,80)
0.189
0.337
(8,55)
(8,75)
0.344
14
0.386
(9,80)
(10,00)
0.394
16
DIM
PINS **
4040047/E 09/01
0.069 (1,75) MAX
Seating Plane
0.004 (0,10)
0.010 (0,25)
0.010 (0,25)
0.016 (0,40)
0.044 (1,12)
0.244 (6,20)
0.228 (5,80)
0.020 (0,51)
0.014 (0,35)
1
4
8
5
0.150 (3,81)
0.157 (4,00)
0.008 (0,20) NOM
0
8
Gage Plane
A
0.004 (0,10)
0.010 (0,25)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion, not to exceed 0.006 (0,15).
D. Falls within JEDEC MS-012
PACKAGING INFORMATION
ORDERABLE DEVICE
STATUS(1)
PACKAGE TYPE
PACKAGE DRAWING
PINS
PACKAGE QTY
OPA602AM
OBSOLETE
TO/SOT
LMC
8
OPA602AM2
OBSOLETE
TO/SOT
LMC
8
OPA602AP
ACTIVE
PDIP
P
8
50
OPA602AU
ACTIVE
SOIC
D
8
100
OPA602AU/2K5
ACTIVE
SOIC
D
8
2500
OPA602BM
OBSOLETE
TO/SOT
LMC
8
OPA602BM1
OBSOLETE
TO/SOT
LMC
8
OPA602BP
ACTIVE
PDIP
P
8
50
OPA602CM
OBSOLETE
TO/SOT
LMC
8
OPA602SM
OBSOLETE
TO/SOT
LMC
8
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
PACKAGE OPTION ADDENDUM
www.ti.com
3-Oct-2003
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,
enhancements, improvements, and other changes to its products and services at any time and to discontinue
any product or service without notice. Customers should obtain the latest relevant information before placing
orders and should verify that such information is current and complete. All products are sold subject to TI's terms
and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in
accordance with TI's standard warranty. Testing and other quality control techniques are used to the extent TI
deems necessary to support this warranty. Except where mandated by government requirements, testing of all
parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for
their products and applications using TI components. To minimize the risks associated with customer products
and applications, customers should provide adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,
copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process
in which TI products or services are used. Information published by TI regarding third-party products or services
does not constitute a license from TI to use such products or services or a warranty or endorsement thereof.
Use of such information may require a license from a third party under the patents or other intellectual property
of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of information in TI data books or data sheets is permissible only if reproduction is without
alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction
of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for
such altered documentation.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that
product or service voids all express and any implied warranties for the associated TI product or service and
is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.
Following are URLs where you can obtain information on other Texas Instruments products and application
solutions:
Products
Applications
Amplifiers
amplifier.ti.com
Audio
www.ti.com/audio
Data Converters
dataconverter.ti.com
Automotive
www.ti.com/automotive
DSP
dsp.ti.com
Broadband
www.ti.com/broadband
Interface
interface.ti.com
Digital Control
www.ti.com/digitalcontrol
Logic
logic.ti.com
Military
www.ti.com/military
Power Mgmt
power.ti.com
Optical Networking
www.ti.com/opticalnetwork
Microcontrollers
microcontroller.ti.com
Security
www.ti.com/security
Telephony
www.ti.com/telephony
Video & Imaging
www.ti.com/video
Wireless
www.ti.com/wireless
Mailing Address:
Texas Instruments
Post Office Box 655303 Dallas, Texas 75265
Copyright
2003, Texas Instruments Incorporated
PDF 
ZIP