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Электронный компонент: TAS5162

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TM
www.ti.com
PRODUCT PREVIEW
FEATURES
APPLICATIONS
DESCRIPTION
P
O
- Output Power - W
10
1
THD+N - T
otal Harmonic Distortion + Noise - %
0.01
0.1
10
1
T
C
= 75
C
PVDD = 32 V
One Channel
100
4
6
8
G001
TAS5162
SLES194 OCTOBER 2006
2 x 210 Watt STEREO DIGITAL AMPLIFIER POWER STAGE
TAS5162 does not require power-up sequencing due
to internal power-on reset. The efficiency of this
2
165 W at 10% THD+N Into 8-
BTL
digital amplifier is greater than 90% into 6
, which
2
210 W at 10% THD+N Into 6-
BTL
enables the use of smaller power supplies and
heatsinks.
1
300 W at 10% THD+N Into 4-
PBTL
(1)
>110 dB SNR (A-Weighted, TAS5518
The TAS5162 has an innovative protection system
Modulator)
integrated on-chip, safeguarding the device against a
wide range of fault conditions that could damage the
<0.09% THD+N at 1 W
system.
These
safeguards
are
short-circuit
Two Thermally Enhanced Package Options:
protection,
overcurrent
protection,
undervoltage
DKD (36-pin PSOP3)
protection, and overtemperature protection. The
TAS5162 has a new proprietary current-limiting
DDV (44-pin HTSSOP)
circuit that reduces the possibility of device shutdown
High-Efficiency Power Stage (>90%) With
during
high-level
music
transients.
A
new
80-m
Output MOSFETs
programmable overcurrent detector allows the use of
Power-On Reset for Protection on Power Up
lower-cost inductors in the demodulation output filter.
Without Any Power-Supply Sequencing
BTL OUTPUT POWER vs SUPPLY VOLTAGE
Integrated Self-Protection Circuits Including
Undervoltage, Overtemperature, Overload,
Short Circuit
Error Reporting
EMI Compliant When Used With
Recommended System Design
Intelligent Gate Drive
Mini/Micro Audio System
DVD Receiver
Home Theater
The TAS5162 is a high performance, integrated
stereo digital amplifier power stage with an improved
protection system. The TAS5162 is capable of
driving a 6-
bridge-tied load (BTL) at up to 210 W
(1)
The DDV package will deliver 300 W peak; however, this
per channel at THD = 10%, low integrated noise at
is dependant on system configuration. The smaller pad
area also makes the thermal interface to the heatsink
the output, low THD+N performance without clipping,
more important. For multichannel systems that require
and low idle power dissipation.
two channels to be driven at full power with the DDV
A low-cost, high-fidelity audio system can be built
package option, it is recommended to design the system
using a TI chipset, comprising a modulator (e.g.,
so that the two channels are in two separate devices.
TAS5508) and the TAS5162. This system only
PurePath DigitalTM
requires a simple passive LC demodulation filter to
deliver
high-quality,
high-efficiency
audio
amplification with proven EMI compliance. This
device requires two power supplies, at 12 V for
GVDD and VDD, and at 50V for PVDD. The
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PurePath Digital, PowerPad are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
PRODUCT PREVIEW information concerns products in the
Copyright 2006, Texas Instruments Incorporated
formative or design phase of development. Characteristic data and
other specifications are design goals. Texas Instruments reserves
the right to change or discontinue these products without notice.
www.ti.com
PRODUCT PREVIEW
GENERAL INFORMATION
Terminal Assignment
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8
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10
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36
35
34
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32
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27
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GVDD_B
OTW
SD
PWM_A
RESET_AB
PWM_B
OC_ADJ
GND
AGND
VREG
M3
M2
M1
PWM_C
RESET_CD
PWM_D
VDD
GVDD_C
GVDD_A
BST_A
PVDD_A
OUT_A
GND_A
GND_B
OUT_B
PVDD_B
BST_B
BST_C
PVDD_C
OUT_C
GND_C
GND_D
OUT_D
PVDD_D
BST_D
GVDD_D
DKD PACKAGE
(TOP VIEW)
P0018-01
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
GVDD_B
OTW
NC
NC
SD
PWM_A
RESET_AB
PWM_B
OC_ADJ
GND
AGND
VREG
M3
M2
M1
PWM_C
RESET_CD
PWM_D
NC
NC
VDD
GVDD_C
DDV PACKAGE
(TOP VIEW)
GVDD_A
BST_A
NC
PVDD_A
PVDD_A
OUT_A
GND_A
GND_B
OUT_B
PVDD_B
BST_B
BST_C
PVDD_C
OUT_C
GND_C
GND_D
OUT_D
PVDD_D
PVDD_D
NC
BST_D
GVDD_D
44
43
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36
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P0016-02
TAS5162
SLES194 OCTOBER 2006
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
The TAS5162 is available in two thermally enhanced packages:
36-pin PSOP3 package (DKD)
44-pin HTSSOP PowerPadTM package (DDV)
Both package types contain a heat slug that is located on the top side of the device for convenient thermal
coupling to the heatsink.
2
Submit Documentation Feedback
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
MSL Peak Temp
(3)
TAS5162DDV
PREVIEW
HTSSOP
DDV
44
35
TBD
Call TI
Call TI
TAS5162DKD
PREVIEW
SSOP
DKD
36
29
TBD
Call TI
Call TI
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent
for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com
28-Sep-2006
Addendum-Page 1