XC25BS6 Series
Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit
September 17, 2003 V1
Preliminary
CMOS
Low Power Consumption
APPLICATIONS
Low Operating Supply Voltage
2.3V (MIN.)
Crystal Oscillation Modules
Output Frequency
32.768kHz
Clocks for Micro-computers, DSPs, etc.
Oscillation Frequency
2MHz ~ 36MHz (fundamental)
Communication Equipment
Built-In Divider Circuit
Selectable from divisions of
Various System Clocks
1024, 512, 256, 128
Clock Time-Base
Output
3-State
Ultra Small Package
SOT-26
Chip Form
GENERAL DESCRIPTION
FEATURES
Oscillation Frequency
2MHz ~ 36MHz (fundamental)
- Oscillation feedback resistor built-in
- External oscillation capacitor
Divider Ratio
f0/1024, f0/ 512, f0/256, f0/128
Output
3-State
Operating Supply
2.3 ~ 4.0V
Voltage Range
Supply Current
0.5
A (MAX.) when stand-by mode
Chip Form
Chip size 1.3 x 0.8mm
Package
SOT-26 mini mold
PIN CONFIGURATION
PIN ASSIGNMENT
* The stand-by control pin (pin #4) has a pull-down resistor built-in.
PAD LAYOUT FOR CHIP FORM
PAD LOCATIONS
(Unit:
m)
* The stand-by control pin (pin #4) has a pull-down resistor built-in.
BLOCK DIAGRAM
CE, Q0 PIN FUNCTION
'L' or Open
High Impedance
Q0
Clock Output
5
399.0
CE
'H'
9
VDD
Power Supply
189.0
1172.0
430.0
4
VSS
Ground
952.0
3
(NC)
No Connection
741.0
PIN NUMBER
PIN
NAME
FUNCTIONS
1
/ XT
Crystal Oscillator
Connection (Output)
VSS
Ground
Q0
187.0
PAD DIMENSIONS
X
Y
672.0
672.0
672.0
128.0
610.0
328.0
672.0
1172.0
1172.0
CE
VDD
FUNCTIONS
Crystal Oscillator
Connection (Output)
Ground
Stand-by Control *
Power Supply
Clock Output
7
6
Power Supply
Crystal Oscillator
Connection (Input)
1
6
XT
VSS
Q0
2
3
4
5
VDD
Clock Output
Stand-by Control *
2
CE
PIN
NAME
/ XT
PIN NUMBER
8
128.0
Crystal Oscillator
Connection (Input)
XT
128.0
Semiconductor Ltd.
The XC25BS6 is a low operating voltage, low current consumption
series of CMOS ICs with built-in crystal oscillator and divider circuits
designed for clock generators. Oscillation capacitors Cg and Cd are
externally set up.
Output is selectable from any one of the following values for f0:f0/1024,
f0/512, f0/256, and f0/128.
With oscillation feedback resistors built-in, it is possible to configure a
stable fundamental oscillator using about 10pF of external oscillation
capacitor and an external crystal.
The series has a stand-by function. The oscillation completely stops in
the stand-by state and output will be one of high-impedance.
6
5
4
3
2
1
/XT
VSS
Q0
XT
VDD
CE
VDD
Q0
CE
XT
/XT
VSS
VSS
(NC)
VDD
(1300,800)
(0,0)
Chip Size
Chip Thickness
Chip Back
Pad Aperture
: 1300 x 800
m
: 280
20
m
: VDD level
: 88 x 88
m
Note)
There are two VSS
pads and two VDD
pads. Please connect
both VSS pads to
GND, and connect
both VDD pads to a
power supply.
Counter
VDD
/XT
XT
VSS
Q0
CE
Data Sheet
1
XC25BS6 Series
Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit
Preliminary
ABSOLUTE MAXIMUM RATINGS
Ta=25
O
C
** SOT-26 package, When implemented on a glass epoxy PCB.
PRODUCT CLASSIFICATION
Ordering Information
XC25BS6
12345
Divider Ratio:
Package:
128 = 128 divider
C : Chip Form
256 = 256 divider
W : Wafer Form
512 = 512 divider
M : SOT-26
A24 = 1024 divider
Device Orientation:
R : Embossed Tape : Standard Feed
L : Embossed Tape : Reverse Feed
T : Chip Tray
W : Wafer
MARKING RULE
1
Represents XC25BS6 Series
2
Represents XC25BS6 Series
3
Represents divider ratio
4
Represents the assembly lot no.
(Based on internal standards)
PACKAGING INFORMATION
SOT-26
A
f0/1024
MARK
Divider Ratio
2
f0/256
MARK
1
5
Divider Ratio
f0/128
f0/512
DESCRIPTION
4
5
123
DESCRIPTION
DESIGNATOR
DESIGNATOR
- 65 ~ + 150 (Chip Form)
O
C
Tstg
Storage Temperature Range
- 55 ~ + 125 (SOT-26)
Topr
- 40 ~ + 85
O
C
Operating Temperature Range
mA
Q0 Output Current
Pd
150 **
mW
Continuous Power Dissipation
VQ0
VSS -0.3 ~ VDD +0.3
IQ0
50
CE Pin Voltage
Q0 Pin Voltage
V
VDD
VSS -0.3 ~ VSS +7.0
V
Supply Voltage
VCE
VSS -0.3 ~ VDD +0.3
V
SYMBOL
RATINGS
UNITS
PARAMETER
MARK
Product Name
B
XC25BS6
MARK
Product Name
6
XC25BS6
Semiconductor Ltd.
6
5
4
3
2
1
1
2
3
4
Data Sheet
2
XC25BS6 Series
Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit
Preliminary
WIRE BONDING CONNECTION
TYPICAL APPLICATION CIRCUIT
* Please use oscillation capacitors Cg, Cd =10pF externally
* The same power supply can be used for VDD and CE.
NOTES ON USE
(1) The oscillation circuit of this IC does not have internal oscillation capacitors.
Please make the oscillation circuitry using an external crystal transducer and oscillation capacitors Cg and Cd.
*) A higher harmonic wave oscillation may occur without Cg and Cd.
*) Cg and Cd can be connected either to GND or VDD. (Cg and Cd in the above circuit example are connected to GND.)
*) It is recommended to use around for 10pF of Cg and Cd. For trimmer capacitors, 10pF as a standard value is appropriate.
*) The crystal oscillation frequency should be measured at the output of the Q0 pin.
When a probe is directly connected to the XT pin or the /XT pin, oscillation frequency will change and a precise value can not be taken.
(2) Please insert a by-pass capacitor of 0.1
F between VDD and GND.
(3) The use of a matching resistor Rq0 of 50
connected in series to the Q0 pin is recommended in order to counter unwanted radiations.
(5) When the CE pin is not controlled by external signals, please connect the CE pin to VDD power supply.
*) When the CE pin is not connected, the IC goes into stand-by mode due to the internal pull-down resistor.
(6) As for the supply voltage, it is recommended to apply a low noise power supply, such as a series regulator. Using a power supply like a switching
regulator might lead to an unstable oscillation jitter which in turn may lead the oscillation frequency to fluctuate due to the ripple of the switching
regulator.
(4) Please place a by-pass capacitor and the matching resistor as close to the IC as possible. If the by-pass capacitor is placed away from the IC, it
may cause abnormal oscillation. If the matching resistor is placed away from the IC, it may cause unwanted radiations in the pattern between the
Q0 pin and the resistor.
* There are two VSS pads and VDD pads.
Please connect both VSS pads to GND, and connect both VDD pads to a power supply.
Semiconductor Ltd.
VDD
Q0
CE
XT
/XT
VSS
VSS
VDD
(NC)
fQ0 measurement
VDD
/XT
XT
VSS
Q0
CE
Cg
Cd
Rq0
0.1uF
Data Sheet
3
XC25BS6 Series
Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit
Preliminary
DC ELECTRICAL CHARACTERISTICS
XC25BS6xxxxx
3.0V Operation (unless otherwise stated, VDD=3.0V, fOSC=16MHz, No load, Ta=25
O
C)
* External oscillation capacitor
AC ELECTRICAL CHARACTERISTICS
XC25BS6xxxxx
3.0V Operation (unless otherwise stated, VDD=3.0V, fOSC=16MHz, CL=15pF, Ta=25
O
C)
*1 R&D guarantee
AC ELECTRICAL CHARACTERISTICS MEASUREMENT WAVE FORMS
(1) Output Rise Time , Output Fall Time
(2) Duty Cycle
M
K
V
MHz
V
V
0.5
1.6
M
A
mA
A
V
V
0.2
0.5
1.0
-
0.5
3.0
55
90
-
-
-
0.6
CE=0.3V
XT Pin, CE=/XT=3.0V
Q0 Pin, VDD=4.0V, CE=0V
-
22
-
CE=0V
CE=3.0V
-
(0.8)
(1.6)
-
(1.0)
(1.8)
-
0.5
2.4
-
(0.4)
(0.8)
-
(0.5)
(1.0)
2.3
-
-
-
-
0.4
(2.3)
3.0
4.0
2
-
36
VDD=2.7V, IOL=4mA
CE=3.0V
fOSC=4MHz, XC25BS6128
fOSC=8MHz, XC25BS6256
fOSC=16MHz, XC25BS6512
fOSC=36MHz, XC25BS6A24
FUNCTIONS
Cf=Cd=10pF (External)
VDD=2.7V, IOH= - 4mA
UNIT
MIN
TYP
MAX
STANDARD VALUE
Rp1
Rp2
Rf
IOZ
IDD1
IDD2
VCEH
VCEL
CE Pull-Down Resistance 1
CE Pull-Down Resistance 2
Output Disable Leakage Current
Operating Supply Voltage
Supply Current 1
CE H Level Voltage
CE L Level Voltage
Internal Oscillation Feedback Resistance
Crystal Oscillation Frequency
H Level Output Voltage
L Level Output Voltage
Supply Current 2
PARAMETER
VDD
SYMBOL
fOSC
VOH
VOL
PARAMETER
SYMBOL
FUNCTIONS
STANDARD VALUE
UNIT
MIN
TYP
MAX
-
Output Rise Time
Tr
VDD=3.0V (10% to 90%) *1
-
Output Start Time
Ton
*1
-
50
55
Output Fall Time
Tf
VDD=3.0V (10% to 90%) *1
Duty Cycle
DUTY
45
3.0
-
%
10
15
ns
10
15
ns
ms
0.9VDD
0.1VDD
tr
tf
0.9VDD
0.1VDD
Semiconductor Ltd.
0.5VDD
DUTY Measurement Level
TW
T
DUTY = (TW/T) x 100 [%]
Data Sheet
4
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