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Электронный компонент: TA6009FM

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TA6009FM
2002-01-17
1
TOSHIBA Bipolar Linear Integrated Circuit Silicon Monolithic
TA6009FM
Shock Sensor IC (1 ch version)

TA6009FM detects an existence of external shock through the
shock sensor and output.
Features
TA6009FM operates from 2.7 to 5.5 V DC single power supply
voltage.
Signal from the shock sensor is amplified according to setting
gain, and is detected through the internal window
comparator.
TA6009FM incorporates 1-ch shock detecting circuitry.
Input terminal of sensor signal is designed high impedance.
Differential input impedance = 100 M (typ.)
LPF (Low Pass Filter) circuitry is incorporated.
Cut-off frequency of LPF = 7 kHz
Sensitivity of shock detection can be adjusted by external devices.
Small package
SON10-P-0303-0.50 (0.5 mm pitch)
Block Diagram
Pin Connection
(top view)
Weight: 0.016 g (typ.)
3
4
7
8
9
10
6
V
CC
5
GND
1
2
A
B
Comparator
+
-
Comparator
+
-
OP-AMP
-
+
BUFFER
50 M
W
BUFFER
50 M
W
GUARD
0.57 V
( )
= 10 pin GND
R 1.7 V (1.7 V)
E 1.4 V (1.2 V)
F 1.1 V (0.7 V)
GUARD
DIFF&LPF
10 7 kHz
W-CONT
10
DO
AI
AO
V
CC
9
8
7
6
SIA
1
2
3
4
5
SIB
GUARD
OUT
GND
TA6009FM
2002-01-17
2
Pin Function
Pin No.
Pin Name
Function
1
SIA
Connection terminal of shock sensor
2
SIB
Connection terminal of shock sensor
3
GUARD
Input (1, 2 pin) GUARD terminal
4 OUT
Output
terminal
(output
= "L" when shock is detected.)
5 GND
Ground
terminal
6 V
CC
Power
supply
voltage
7 AO
Op-Amp
output
terminal
8 AI
Op-Amp
input
terminal
9
DO
Differential-Amp output terminal
10
W-CONT
WindComp. trip voltage selection terminal
Maximum Ratings
(Ta
=
=
=
=
25C)
Characteristics Symbol
Rating
Unit
Power supply voltage
V
CC
7 V
Power dissipation
P
D
150
mW
Storage temperature
T
stg
-55 to 150
C



Recommend Operating Condition
Characteristics Symbol
Rating
Unit
Power supply voltage
V
CC
2.7
to
5.5 V
Operating temperature
T
opr
-25 to 85
C

Note: The IC may be destroyed due to short circuit between adjacent pins, incorrect orientation of device's mounting,
connecting positive and negative power supply pins wrong way round, air contamination fault, or fault by
improper grounding.








TA6009FM
2002-01-17
3
Electrical Characteristics
(unless otherwise specified, V
CC
=
=
=
=
3.3 V, Ta
=
=
=
=
25C)
Characteristics Symbol
Test
Circuit
Test Condition
Min
Typ.
Max
Unit
Supply voltage
V
CC
2.7 3.3 5.5 V
V
CC
= 3.3 V
1.8
2.4
Supply current
I
CC
(1)
V
CC
= 5.0 V
1.8
2.4
mA
(GUARD)
Characteristics Symbol
Test
Circuit
Test Condition
Min
Typ.
Max
Unit
Output voltage
VoGur
(2)
0.52 0.57 0.62
V
(DIFF-AMP)
Characteristics Symbol
Test
Circuit
Test Condition
Min
Typ.
Max
Unit
Input impedance
(Note 1)
Zin
50
100
M
W
Gain GvBuf
(3)
19.6 20 20.4
dB
Output DC voltage
VoBuf
(4)
Connect C
= 100 pF between
1 pin and 2 pin
0.7 1 1.3 V
Low pass filter cut-off freq.
fc
(5)
Frequency at
-3dB point
5
7
10
kHz
Output source current
IBso
(6)
Voh
= V
CC
- 1 V
400
800
mA
Output sink current
IBsi
(7)
Vol
= 0.3 V
75
130
mA
Note 1: Marked parameters are reference data.
(OP-AMP)
Characteristics Symbol
Test
Circuit
Test Condition
Min
Typ.
Max
Unit
Cut-off frequency
(Note 1)
fT
1.5
2
MHz
Openloop gain
(Note 1)
Gvo
80
90
dB
Input voltage 1
Vin1
(8)
10 pin
OPEN
(Note 2)
1.33
1.4
1.47
V
Input voltage 2
Vin2
(9)
10 pin
GND
(Note 2)
1.14
1.2
1.26
V
Input current
I
in
(10)
25
50
nA
Offset voltage
(Note 1)
Voff
-5 0 5 mV
Output source current
IAso
(11)
Voh
= V
CC
- 1 V
300
800
mA
Output sink current
IAsi
(12)
Vol
= 0.3 V
130
200
mA
Note 1: Marked parameters are reference data.
Note 2: 10 pin must be non-connected otherwise connected to GND.
(Window-comparator)
Characteristics Symbol
Test
Circuit
Test Condition
Min
Typ.
Max
Unit
Trip voltage 1
(Note 1)
Vtrp1
10
pin
OPEN
(Note 2)
Vin1
0.285
Vin1
0.3
Vin1
0.315
V
Trip voltage 2
(Note 1)
Vtrp2
10
pin
GND
(Note 2)
Vin2
0.475
Vin2
0.5
Vin2
0.525
V
Output source current
IWso
(13)
Voh
= V
CC
- 0.5 V
30
50
mA
Output sink current
IWsi
(14)
Vol
= 0.3 V
300
800
mA
Note 1: Marked parameters are reference data.
Note 2: 10 pin must be non-connected otherwise connected to GND.
TA6009FM
2002-01-17
4
Application Note

Figure 1 is the composition of G-Force sense amplifier.
The shock sensor is connected between 1 and 2 terminal.
When G-force Sensor (sensor sensibility = s (mV/G)) is used to detect external shock of g (G), the external
parts are determined as following.
(Gain setting) * 10 PIN GND
500/(s g) = G1
G1/10 = G (OP-AMP)

(HPF setting)
fc = 1/(2 p R
1
C
1
)

(LPF setting)
fc = 1/(2 p R
2
C
2
)
Figure 1 The configuration of G-force sensor amplifier
1
Buffer
1
LPF
2
Buffer
1
Shock
sensor
AMP
10
9
8
R
1
C
1
7
C
2
R
2
4 OUT
1.1 V (0.7 V)
1.7 V (1.7 V)
Window
Comparator
1.4 V (1.2 V) REF
TA6009FM
2002-01-17
5
Reference Data
(1) 9 pin (DIFF-AMP output) CMRR, PSRR
(2) 7 pin (OP-AMP output) source current
(3) 7 pin (OP-AMP output) sink current
CMRR, PSRR (9 pin)
(Hz)
(dB
)
-30
-80
100
100000
1000
10000
CMRR
PSRR
-40
-50
-60
-70
Source Current (7 pin)
Voh (V)
S
ourc
e

c
u
rr
en
t (
m
A)
1800
0
1.8
2.6
300
600
900
1200
1500
2.0 2.2 2.4
85C
25C
-25C
Sink Current (7 pin)
Vol (V)
S
i
nk cu
rr
ent

(
m
A)
300
0
0
0.5
50
100
150
200
250
0.1 0.2 0.3 0.4
85C
25C
-25C
TA6009FM
2002-01-17
6
Equivalent Circuit
9
500
W
50
m
A
1.
5 k
W
10
m
A
100
W
7
250
W
50
m
A
1 k
W
10
m
A
100
W
3
10 k
W
50
m
A
100
W
7
10
m
A
4
50
m
A
10
m
A
8
1.
7 V
VREF
6 k
W
6 k
W
22 k
W
AMP
10 k
W
13.
59 k
W
10
TA6009FM
2002-01-17
7
Test Circuit
(1) Supply
current
I
I
I
I
CC
CC
CC
CC
(2)
GUARD
Output
voltage
VoGur
VoGur
VoGur
VoGur

(3) DIFF-AMP
Gain
GvBuf
GvBuf
GvBuf
GvBuf
Step 1
Step 2

(4) DIFF-AMP
(5) DIFF-AMP
Output DC voltage VoBuf
VoBuf
VoBuf
VoBuf
Low pass filter cut-off freq. fc
fc
fc
fc
10
9
8
7
6
1
2
3
4
5
3.
3 V
M
30 k
W
10
9
8
7
6
1
2
3
4
5
3.
3 V
M
10
9
8
7
6
1
2
3
4
5
3.
3 V
M
10
9
8
7
6
1
2
3
4
5
3.
3 V
M1
M
M2
0.
68 V
0.
6 V
0.60
0.68
1
2
Gain
-
-
=
10
9
8
7
6
1
2
3
4
5
3.
3 V
M
100 pF
100 pF
10
9
8
7
6
1
2
3
4
5
3.
3 V
M
100 k
W
100 k
W
0.1
mF
TA6009FM
2002-01-17
8
(6) DIFF-AMP
(7) DIFF-AMP
Output source current IBso
IBso
IBso
IBso
Output sink current IBsi
IBsi
IBsi
IBsi

(8) OP-AMP
(9) OP-AMP
Input voltage 1 Vin1
Vin1
Vin1
Vin1
Input voltage 2 Vin2
Vin2
Vin2
Vin2

(10) OP-AMP
Input
current
I
I
I
I
in
in
in
in

(11) OP-AMP
(12) OP-AMP
Output source current IAso
IAso
IAso
IAso
Output sink current IAsi
IAsi
IAsi
IAsi
10
9
8
7
6
1
2
3
4
5
3.
3 V
M
10
9
8
7
6
1
2
3
4
5
3.
3 V
M
0.
5 V
0.
62 V
0.
3 V
2.
3 V
0.
65 V
0.
45 V
10
9
8
7
6
1
2
3
4
5
3.
3 V
M
10
9
8
7
6
1
2
3
4
5
3.
3 V
M
30 k
W
30 k
W
10
9
8
7
6
1
2
3
4
5
3.
3 V
M
1.
2 V
10
9
8
7
6
1
2
3
4
5
3.
3 V
M
1.
2 V
2.
3 V
10
9
8
7
6
1
2
3
4
5
3.
3 V
M
1.
6 V
0.
3 V
TA6009FM
2002-01-17
9
(13) Window comparator
(14) Window comparator
Output source current IWso
IWso
IWso
IWso
Output sink current IWsi
IWsi
IWsi
IWsi

Test Circuit
(for reference)
(a) DIFF-AMP
(b) DIFF-AMP
CMRR
CMRR
CMRR
CMRR
PSRR
PSRR
PSRR
PSRR
10
9
8
7
6
1
2
3
4
5
3.
3 V
3.
3 V
1.
2 V
2.
85 V
M
10
9
8
7
6
1
2
3
4
5
3.
3 V
1.
4 V
0.
6 V
0.
3 V
M
10
9
8
7
6
1
2
3
4
5
3.
3 V
M
10
9
8
7
6
1
2
3
4
5
3.
3 V
M
TA6009FM
2002-01-17
10
Marking












D01: Product number
Q: Monthly and Weekly code
A1: Lot code

Mold material: Epoxy resin
Lead material and disposition: An alloy of copper, soldering
Production country: JAPAN
Production factory: Front end process
TOSHIBA Kitakyushu factory
Back end process
TOSHIBA Kitakyushu factory
D 0 1
Q A 1
D 0 1
Q A 1
Week 1-26
D 0 1
Q A 1
Week 27-53
TA6009FM
2002-01-17
11
Package Dimensions

Weight: 0.016 g (typ.)

TA6009FM
2002-01-17
12
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
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such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability
Handbook" etc..
The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
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document shall be made at the customer's own risk.
The products described in this document are subject to the foreign exchange and foreign trade laws.
The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other
rights of the third parties which may result from its use. No license is granted by implication or otherwise under
any intellectual property or other rights of TOSHIBA CORPORATION or others.
The information contained herein is subject to change without notice.
000707EBA
RESTRICTIONS ON PRODUCT USE