TB62209FG

2005-03-02

TOSHIBA BiCD Processor IC Silicon Monolithic

TB62209FG

Stepping Motor Driver IC Using PWM Chopper Type

The TB62209FG is a stepping motor driver driven by chopper

micro-step pseudo sine wave.

The TB62209FG integrates a decoder for CLK input in micro

steps as a system to facilitate driving a two-phase stepping motor
using micro-step pseudo sine waves. Micro-step pseudo sine
waves are optimal for driving stepping motors with low-torque
ripples and at low oscillation. Thus, the TB62209FG can easily
drive stepping motors with low-torque ripples and at high
efficiency.

Also, TB62209FG consists output steps by DMOS (Power MOS

FET), and that makes possible to control the output power
dissipation much lower than ordinary IC with bipolar transistor
output.

The IC supports Mixed Decay mode for switching the attenuation ratio at chopping. The switching time for the

attenuation ratio can be switched in four stages according to the load.

Features

· Bipolar stepping motor can be controlled by a single driver IC
· Monolithic BiCD IC
· Low ON-resistance of R

= 0.5 (T

= 25°C @1.0 A: typ.)

· Built-in decoder and 4-bit DA converters for micro steps
· Built-in ISD, TSD, V

power monitor (reset) circuit for protection

· Built-in charge pump circuit (two external capacitors)
· 36-pin power flat package (HSOP36-P-450-0.65)
· Output voltage: 40 V max
· Output current: 1.8 A/phase max
· 2-phase, 1-2 (type 2) phase, W1-2 phase, 2W1-2 phase, 4W1-2 phase, or motor lock mode can be selected.
· Built-in Mixed Decay mode enables specification of four-stage attenuation ratio.
· Chopping frequency can be set by external resistors and capacitors.

High-speed chopping possible at 100 kHz or higher.

Note: When using the IC, pay attention to thermal conditions. These devices are easy damage by high static

voltage. In regards to this, please handle with care.

Weight: 0.79 g (typ.)

TB62209FG

2005-03-02

2. LOGIC UNIT A/B (C/D unit is the same as A/B unit)

Function

This circuit is used to input from the DATA pins micro-step current setting

data and to transfer

them to the subsequent stage. By switching the SETUP pin, the data in the mixed decay

timing table

can be overwritten.

D MODE 1

D MODE 2

D MODE 3

CW/CCW

CLK

STANDBY

MDT 1

MDT 2

Decay

2 bit

A unit side

TORQUE 1

TORQUE 2

DATA MODE

Micro-step decoder

Micro-step
current data

4 bit

A unit side

Phase

1 bit

A unit side

Current

feedback

circuit

Mixed

Decay

circuit

Output
control

circuit

D/A circuit

Output
control
circuit

ENABLE

RESET

Torque

2 bit

Decay

2 bit

B unit side

Phase

1 bit

B unit side

Micro-step
current data

4 bit

B unit side

TB62209FG

2005-03-02

3. Current feedback circuit and current setting circuit

Function

The current setting circuit is used to set the reference voltage of the output current using the current

setting decoder.

The current feedback circuit is used to output to the output control circuit the relation between the

set current value and

output current. This is done by comparing the reference voltage output to the

current setting circuit with the potential difference generated when current flows through the current
sense resistor connected between R

and V

The chopping waveform generator circuit to which CR is connected is used to generate clock used as

reference for the chopping frequency.

Note 1: R

S COMP1

: Compares the set current with the output current and outputs a signal when the output

current reaches the set current.

Note 2: R

S COMP2

: Compares the set current with the output current at the end of Fast mode during chopping.

Outputs a signal when the set current is below the output current.

Waveform shaping circuit

ref

100

Chopping waveform

generator circuit

circuit 1

(detects

potential

difference

between

and V

)

S COMP

circuit

(Note 1)

(set current

reached signal)

circuit 2

(detects

potential

difference

between

and R

)

S COMP

circuit

(Note 2)

RNF

(set current

monitor signal)

Use in FAST MODE

Use in Charge mode

Output
control

circuit

Mixed

Decay

timing
circuit

Output stop signal (ALL OFF)

Chopping reference circuit

Current feedback

circuit

Torque

control

circuit

Current setting

circuit

D/A circuit

TORQUE

0, 1

CURRENT

0-3

Decoder

Unit

15
14
13
12
11
10

9
8
7
6
5
4
3
2
1

Micro-step

current

setting

selector

circuit

4-bit

D/A

circuit

TB62209FG

2005-03-02

4. Output control circuit, current feedback circuit and current setting circuit

Note: The STANDBY pins are pulled down in the IC by 100-k

resistor.

When not using the pin, connect it to GND. Otherwise, malfunction may occur.

ISD

circuit

Output pin

circuit

DDR

circuit

TSD

circuit

Current

feedback

circuit

Current

setting

circuit

Charge

pump

circuit

Cop

CR counter

CR Selector

Chopping

reference circuit

Micro-step current setting

decoder circuit

LOGIC

DDR

: V

power on

Reset

: V

power on Reset

ISD: Current shutdown

circuit

TSD: Thermal shutdown

circuit

Protection

circuit

Charge pump

circuit

Micro-step current

setup latch

clear signal

Mixed Decay

timing table clear

signal

Cop

PHASE

DECAY

MODE

Mixed

Decay

timing
circuit

Output RESET signal

Output circuit

Output
circuit

Charge

pump

halt

signal

Power supply for
upper drive output

STANDBY

NF set current
reached signal

RNF set current
monitor signal

Output stop
signal

Output control circuit

Internal

stop

signal
select
circuit

Mixed

Decay

timing

Charge Start

U1
U2

L1
L2

TB62209FG

2005-03-02

Pin Assignment

(top view)

Pin Assignment for PWM in Data Mode

D MODE 1 GA+ (OUT A, A )
D MODE 2 GA- (OUT A, A )
D MODE 3 GB+ (OUT B, B )
CW/CCW GB- (OUT B, B )

Note: Pin assignment above is different at data mode and PWM.

D MODE 1

D MODE 2

CLK

D MODE 3

CW/CCW

ref

S B

)

S A

STANDBY

Ccp A

Ccp B

Ccp C

34 ENABLE

33 OUT B

32 RESET

31 DATA MODE

30 NC

29 OUT B

28 PGND

)

27 PGND

26 OUT A

25 NC

24 MDT 2

23 MDT 1

22 OUT A

21 TORQUE2

20 TORQUE1

19 PROTECT

TB62209FG

TB62209FG

2005-03-02

Pin Description 1

Pin Number

Pin Name

Function

Remarks

D MODE 1

D MODE 2

D MODE 3

Motor drive mode setting pin

D MODE 3, 2, 1

LLL: Same function as that of

STANDBY pin

LLH: Motor Lock mode

LHL: 2-Phase Excitation mode

LHH: 1-2 Phase Excitation (A) mode

HLL: 1-2 Phase Excitation (B) mode

HLH: W1-2 Phase Excitation mode

HHL: 2W1-2 Phase Excitation mode

HHH: 4W1-2 Phase Excitation mode

CW/CCW

Sets motor rotation direction

CW: Forward rotation

CCW: Reverse rotation

5 V

Logic power supply connecting pin

Connect to logic power supply (5 V).

6 V

ref

Reference power supply pin for setting output

current

Connect to supply voltage for setting current.

7 NC

Not

connected

Not

wired

8 NC

Not

connected

Not

wired

9 R

S B

Unit-B power supply pin

(connecting pin for power detection resistor)

Connect current sensing resistor between this
pin and V

FIN Logic ground pin

Connect to power ground.

The pin functions as a heat sink. Design pattern

taking heat into consideration.

10 R

S A

Unit-A power supply pin

(pin connecting power detection resistor)

Connect current sensing resistor between this

pin and V

11 NC

Not

connected

Not

wired

12 NC

Not

connected

Not

wired

Pin Assignment for PWM in Data Mode

D MODE 1 GA+ (OUT A, A )
D MODE 2 GA- (OUT A, A )
D MODE 3 GB+ (OUT B, B )
CW/CCW GB- (OUT B, B )

TB62209FG

2005-03-02

Pin Description 2

Pin Number

Pin Name

Function

Remarks

13 V

Motor power supply monitor pin

Connect to motor power supply.

STANDBY

All-function-initializing and Low Power
Dissipation mode pin

H: Normal operation

L: Operation halted
Charge pump output halted

15 Ccp

Pin connecting capacitor for boosting output
stage drive power supply (storage side

connected to GND)

Connect capacitor for charge pump (storage

side) V

and V

are generated.

16 Ccp

Pin connecting capacitor for boosting output
stage drive power supply

Connect capacitor for charge pump (charging
side) between this pin and Ccp C.

Ccp C

(charging side)

Connect capacitor for charge pump (charging

side between this pin and Ccp B.

18 MO

Electrical

angle

) monitor pin

Outputs High level in 4W1-2, 2W1-2, W1-2, or
1-2 Phase Excitation mode with electrical angle

of 0

(phase B: 100%, phase A: 0%).

In 2-Phase Excitation mode, outputs High level

with electrical angle of 0

(phase B: 100%,

phase A: 100%).

PROTECT

TSD operation detector pin

Detects thermal shut down (TSD) and outputs
High level.

20 TORQUE

21 TORQUE

Motor torque switch setting pin

Torque 2, 1

HH: 100%

LH:

85%

HL:

70%

LL:

50%

22 OUT

A Channel

A output pin

23 MDT

24 MDT

Mixed Decay mode setting pins

MDT 2, 1

HH:

100%

HL:

75%

LH:

37.5%

LL:

12.5%

TB62209FG

2005-03-02

Pin Description 3

Pin Number

Pin Name

Function

Remarks

25 NC

Not

connected

Not

wired

OUT A

Channel A output pin

Connect to motor

PGND

Power ground pin

Connect all power ground pins and V

to GND.

Logic ground pin

The pin functions as a heat sink. Design pattern
taking heat into consideration.

PGND

Power ground pin

Connect all power ground pins to GND.

OUT B

Channel B output pin

Connect to motor

30 NC

Not

connected

Not

wired

DATA MODE

Clock input and PWM

H: Controls external PWM.

L: CLK-IN mode

We recommend this pin normally be used as
CLK-IN mode pin (Low).

In PWM mode, functions such as constant
current control do not operate.

RESET

Initializes electrical angle.

Forcibly initializes electrical angle.

At this time we recommend ENABLE pin be set
to Low to prevent misoperation.

H: Resets electrical angle.

L: Normal operation

33 OUT

B Channel

B output pin

ENABLE

Output enable pin

Forcibly turns all output transistors off.

35 CLK

Inputs CLK for determining number of motor
rotations.

Electrical angle is incremented by one for each
CLK input.

CLK is reflected at rising edge.

36 CR

Chopping reference frequency reference pin (for
setting chopping frequency)

Determines chopping frequency.

TB62209FG

2005-03-02

1. Function

CW/CCW

CW/CCW switches the direction of stepping motor rotation.

Input Function

H Forward

(CW)

L Reverse

(CCW)

2. Function of MDT 1/MDT 2

MDT 1/MDT 2 specifies the current attenuation speed at constant current control.
The larger the rate (%), the larger the attenuation of the current. Also, the peak current value (current

ripple) becomes larger. (Typical value is 37.5%.)

MDT 2

MDT 1

Function

12.5% Mixed Decay mode

37.5% Mixed Decay mode

75% Mixed Decay mode

100% Mixed Decay mode (Fast Decay mode)

3. Function of TORQUE X

TORQUE X changes the current peak value in four steps. Used to change the value of the current used,

for example, at startup and fixed-speed rotation.

TORQUE 2

TORQUE 1

Comparator Reference Voltage

H H

100%

L H

85%

H L

70%

L L

50%

4. Function of RESET (forced initialization of electrical angle)

With the CLK input method (decoder method), unless CLKs are counted, except MO, where the electrical

angle is at that time is not known. Thus, this method is used to forcibly initialize the electrical angle.

For example, used to change the excitation mode to another drive mode during output from MO

(electrical angle = 0°).

Input Function

Initializes electrical angle to 0

L Normal

operation

TB62209FG

2005-03-02

5. Function of ENABLE (output operation)

ENABLE forcibly turns OFF all output transistors at operation.
Data such as electrical angle and operating mode are all retained.

Input Function

Operation enabled (active)

Output halted (operation other

than output active)

6. Function

of STANDBY

STANDBY halts the charge pump circuit (power supply booster circuit) as well as halting output.

We recommend setting to Standby mode at power on.

(At this time, data on the electrical angle are retained.)

Input Function

Operation enabled (active)

Output halted (Low Power

Dissipation mode)

Charge pump halted

7. Functions of Excitation Modes

Excitation

Mode DM3 DM2

DM1 Remarks

Low Power

Dissipation mode

0 0 0

Standby mode

Charge pump halted

Motor Lock mode

Locks only at 0

electrical angle.

2-Phase Excitation

mode

0 1 0

135

225

315

1-2 Phase Excitation

(A)

Low-torque, 1-bit micro-step change

1-2 Phase Excitation

(B)

High-torque, 1-bit micro-step change

W1-2 Phase

Excitation

1 0 1

2-bit

micro-step

change

2W1-2 Phase

Excitation

1 1 0

3-bit

micro-step

change

4W1-2 Phase

Excitation

1 1 1

4-bit

micro-step

change

TB62209FG

2005-03-02

8. Function of DATA MODE

DATA MODE switches external duty control (forced PWM control) and constant current CLK-IN control.

In Phase mode, H-bridge can be forcibly inverted and output only can be turned off. Constant current drive
including micro-step drive can only be controlled in CLK-IN mode.

Input Function

H PHASE

MODE

L CLK-IN

MODE

Note 1: Normally, use CLK-IN mode.

9. Electrical Angle Setting immediately after Initialization

In Initialize mode (immediately after RESET is released), the following currents are set.
In Low Power Dissipation mode, the internal decoder continues incrementing the electrical angle but

current is not output.

Note that the initial electrical angle value in 2-Phase Excitation mode differs from that in nW1-2 (n = 0,

1, 2, 4) Phase Excitation mode.

Excitation Mode

IB (%)

IA (%)

Remarks

Low Power

Dissipation mode

100

Electrical angle incremented but no current output

Motor Lock mode

100

Electrical angle incremented but no motor rotation
due to no IA output

3 2-Phase

Excitation

100

1-2 Phase Excitation

(A)

100 0

1-2 Phase Excitation

(B)

100 0

W1-2 Phase

Excitation

100 0

2W1-2 Phase

Excitation

100 0

4W1-2 Phase

Excitation

100 0

Note 2: Where, IB

100% and IA

0%, the electrical angle is 0

. Where, IB

0% and IA

100%, the electrical

angle is

TB62209FG

2005-03-02

10. Function of DATA MODE (Phase A mode used for explanation)

DATA MODE inputs the external PWM signal (duty signal) and controls the current. Functions such as

constant current control and overcurrent protector do not operate.

Use this mode only when control cannot be performed in CLK-IN mode.

Output

State

(1) L

Output

off

(2) L

phase: Low A

phase: High

(3) H

phase: High A

phase: Low

(4) H

Output

off

Note: Output is off at (1) and (4).

D MODE 1 GA+ (OUT A, A )
D MODE 2 GA- (OUT A, A )
D MODE 3 GB+ (OUT B, B )
CW/CCW GB- (OUT B, B )

OFF

PGND

OFF

(1)

(4)

OFF

(Note)

Load

PGND

(2)

OFF

(Note)

Load

PGND

(3)

TB62209FG

2005-03-02

Maximum Ratings

(Ta

25°C)

Characteristics Symbol

Rating

Unit

Logic supply voltage

7 V

Motor supply voltage

Output current

(Note 1)

OUT

1.8

A/phase

Current detect pin voltage

4.5 V

Charge pump pin maximum voltage

(CCP1 Pin)

7.0

Logic input voltage

(Note 2)

0.4

(Note 3)

1.4

Power dissipation

(Note 4)

3.2

Operating temperature

opr

40 to 85

°C

Storage temperature

stg

55 to 150

°C

Junction temperature

150

°C

Note 1: Perform thermal calculations for the maximum current value under normal conditions. Use the IC at 1.5 A or

less per phase.
The current velue maybe controled according to the ambient temperature or board conditions.

Note 2: Input 7 V or less as V

Note 3: Measured for the IC only. (Ta

25°C)

Note 4: Measured when mounted on the board. (Ta

25°C)

Ta: IC ambient temperature

opr

: IC ambient temperature when starting operation

: IC chip temperature during operation T

(max) is controlled by TSD (thermal shut down circuit)

Recommended Operating Conditions

(Ta

0 to 85°C, (Note 5))

Characteristics Symbol

Test

Condition

Min

Typ.

Max

Unit

Power supply voltage

4.5

5.0

5.5

Motor supply voltage

5.0 V, Ccp1

0.22

Ccp2

0.02

13 24 34 V

Output current

OUT (1)

25°C, per phase

1.2 1.5 A

Logic input voltage

GND

Clock frequency

CLK

5.0 V

150 KHz

Chopping frequency

chop

5.0 V

100

150

KHz

Reference voltage

ref

24 V, Torque

100%

2.0

3.0

Current detect pin voltage

5.0 V

1.0

4.5 V

Note 5: Because the maximum value of T

is 120°C, recommended maximum current usage is below 120°C.

TB62209FG

2005-03-02

Electrical Characteristics

(unless otherwise specified, Ta

25°C, V

5 V, V

24 V)

Characteristics Symbol

Test

Circuit

Test Condition

Min

Typ.

Max

Unit

HIGH V

IN (H)

2.0

0.4

Input voltage

LOW V

IN (L)

Data input pins

GND

0.4

GND 0.8

Input hysteresis voltage

IN (HIS)

Data input pins

200

400

700

IN (H)

Data input pins with resistor

IN (H)

1.0

Input current 1

IN (L)

Data input pins without resistor

1.0

DD1

5 V (STROBE, RESET,

DATA

L), RESET

L, Logic,

output all off

1.0 2.0 3.0

Power dissipation (V

Pin)

DD2

Output OPEN, f

CLK

1.0 kHz

LOGIC ACTIVE, V

5 V,

Charge Pump

charged

1.0 2.5 3.5

Output OPEN (STROBE,

RESET, DATA

L), RESET

L, Logic, output all off, Charge

Pump

no operation

1.0 2.0 3.0

Output OPEN, f

CLK

1 kHz

LOGIC ACTIVE, V

5 V,

24 V, Output off,

Charge Pump

charged

2.0 4.0 5.0

Power dissipation (V

Pin)

Output OPEN, f

CLK

4 kHz

LOGIC ACTIVE, 100 kHz

chopping (emulation), Output
OPEN,

Charge Pump

charged

10 13

Output standby current

Upper

24 V, V

OUT

0 V,

STANDBY

H, RESET

CLK

200

150

Output bias current

Upper

OUT

0 V, STANDBY

RESET

L, CLK

100

Output leakage current

Lower

CcpA

OUT

24 V, LOGIC IN

ALL

1.0

HIGH

(Reference)

RS (H)

ref

3.0 V, V

ref

(Gain)

1/5.0

TORQUE

(H)

100% set

100

MID

HIGH

RS (MH)

ref

3.0 V, V

ref

(Gain)

1/5.0

TORQUE

(MH)

85% set

83 85 87

MID

LOW

RS (ML)

ref

3.0 V, V

ref

(Gain)

1/5.0

TORQUE

(ML)

70% set

68 70 72

Comparator reference

voltage ratio

LOW V

RS (L)

ref

3.0 V, V

ref

(Gain)

1/5.0

TORQUE

(L)

50% set

48 50 52

Output current differential

OUT1

Differences between output

current channels

5 %

Output current setting differential

OUT2

OUT

1000 mA

5 %

RS pin current

24 V, V

24 V,

RESET

L (RESET state)

1 2

ON (D-S) 1

OUT

1.0 A, V

5.0 V

25°C, Drain-Source

0.5 0.6

ON (S-D) 1

OUT

1.0 A, V

5.0 V

25°C, Source-Drain

0.5 0.6

ON (D-S) 2

OUT

1.0 A, V

5.0 V

105°C, Drain-Source

0.6 0.75

Output transistor drain-source

ON-resistance

ON (S-D) 2

OUT

1.0 A, V

5.0 V

105°C, Source-Drain

0.6 0.75

TB62209FG

2005-03-02

Electrical Characteristics 2

(Ta

25°C, V

5 V, V

24 V, I

OUT

1.0 A)

Characteristics Symbol

Test

Circuit

Test Condition

Min

Typ.

Max

Unit

90 (

16)

100

84 (

15)

100

79 (

14)

93 98

73 (

13)

91 96

68 (

12)

87 92 97

62 (

11)

83 88 93

56 (

10)

78 83 88

51 (

72 77 82

45 (

66 71 76

40 (

58 63 68

34 (

51 56 61

28 (

42 47 52

23 (

33 38 43

17 (

24 29 34

11 (

15 20 25

6 (

1) 5

Chopper current

Vector

0 (

TB62209FG

2005-03-02

Electrical Characteristics 3 (unless otherwise specified, Ta

25°C, V

5 V, V

24 V)

Characteristics Symbol

Test

Circuit

Test Condition

Min

Typ.

Max

Unit

ref

input voltage

ref

24 V, V

5 V,

STANDBY

H, RESET

Output on, CLK

1 kHz

2.0

ref

input current

ref

STANDBY

H, RESET

Output off, V

24 V,

5 V, V

ref

3.0 V

20 35 50

ref

attenuation ratio

ref

(GAIN)

24 V, V

5 V,

STANDBY

H, RESET

Output on,
V

ref

2.0 to V

1.0 V

1/4.8

1/5.0 1/5.2

TSD temperature

(Note 1)

TSD DC

5 V, V

24 V

130

170 °C

TSD return temperature difference

(Note

TSD DC

TSD

130 to 170°C

TSD

°C

return voltage

DDR

24 V,

STANDBY

H 2.0 3.0 4.0 V

return voltage

5 V,

STANDBY

H 2.0 3.5 5.0 V

Over current protected circuit

operation current

(Note 2)

ISD DC

5 V, V

24 V

3.0

High temperature monitor pin
output current

protect

5 V,

TSD

operating condition

1.0 3.0 5.0 mA

Electrical angle monitor pin output

current

5 V,

electrical angle

0°

(IB

100%, IA

0%)

1.0 3.0 5.0 mA

protect (H)

5 V,

TSD

operating condition

5.0

High temperature monitor pin

output voltage

protect (L)

5 V,

TSD

not operating

condition

0.0

MO2 (H)

5 V,

electrical angle

except 0°

(IB

100%,

Except 0% set)

5.0

Electrical angle monitor pin output
voltage

MO2 (L)

5 V,

electrical angle

0°

(IB

100%, IA

0%)

0.0

Note 1: Thermal shut down (TSD) circuit

When the IC junction temperature reaches the specified value and the TSD circuit is activated, the internal
reset circuit is activated switching the outputs of both motors to off.
When the temperature is set between 130 (min) to 170°C (max), the TSD circuit operates.
When the TSD circuit is activated, the charge pump is halted, and TROTECT pin outputs V

voltage.

Even if the TSD circuit is activated and

Standby

goes H

H instantaneously, the IC is not reset until

the IC junction temperature drops

20°C (typ.) below the TSD operating temperature (hysteresis function).

Note 2: Overcurrent protection circuit

When current exceeding the specified value flows to the output, the internal reset circuit is activated, and the
ISD turns off the output.
Until the

Standby

signal goes Low to High, the overcurrent protection circuit remains activated.

During ISD, IC turns

Standby

mode and the charge pump halts.

TB62209FG

2005-03-02

AC Characteristics

(Ta

25°C, V

24 V, V

5 V, 6.8 mH/5.7

)

Characteristics Symbol

Test

Circuit

Test Condition

Min

Typ.

Max

Unit

Clock frequency

CLK

120 kHz

CLK

) AC

100

Minimum clock pulse width

Output Load: 6.8 mH/5.7

100

pLH

CLK

OUT

1000

pHL

Output Load: 6.8 mH/5.7

2000

pLH

CR to OUT

500

Output transistor switching
characteristic

pHL

Output Load: 6.8 mH/5.7

1000

pLH

Transistor switching characteristics

(MO, PROTECT)

pHL

Noise rejection dead band time

BRANK

OUT

1.0 A

200

300

400

CR reference signal oscillation

frequency

osc

560 pF, R

osc

3.6 k

800

kHz

Chopping frequency range

chop (min)

chop (max)

24 V, V

5 V,

Output ACTIVE (I

OUT

1.0 A)

Step fixed, Ccp1

0.22

Ccp2

0.01

40 100 150 kHz

Chopping frequency

chop

Output ACTIVE (I

OUT

1.0 A),

CR CLK

800 kHz

100

kHz

Charge pump rise time

ONG

Ccp

0.22

F, Ccp

0.01

24 V, V

5 V,

STANDBY

OFF

100 200

TB62209FG

2005-03-02

11. Current Waveform and Setting of Mixed Decay Mode

At constant current control, in current amplitude (pulsating current) Decay mode, a point from 0 to 3 can

be set using 2-bit parallel data.

NF is the point where the output current reaches the set current value. RNF is the timing for monitoring

the set current.

The smaller the MDT value, the smaller the current ripple (peak current value). Note that current decay

capability deteriorates.

chop

12.5%
MIXED
DECAY
MODE

CR pin
internal
CLK
waveform

Charge mode

NF: set current value reached

Slow mode

Mixed decay timing

Fast mode

current monitored

(when set current value

output current) Charge mode

RNF

Set current value

RNF

MDT

DECAY MODE 0

37.5%
MIXED
DECAY
MODE

Charge mode

NF: set current value reached

Slow mode

Mixed decay timing

Fast mode

current monitored

(when set current value

output current) Charge mode

RNF

Set current value

DECAY MODE 1

75%
MIXED
DECAY
MODE

Charge mode

NF: set current value reached

Slow mode

Mixed decay timing

Fast mode

current monitored

(when set current value

output current) Charge mode

RNF

Set current value

MDT

DECAY MODE 2

FAST
DECAY
MODE

Fast mode

RNF: current monitored (when set current value

output current) Charge mode

Fast mode

RNF

Set current value

DECAY MODE 3

100% 75% 50%

25%

MDT

TB62209FG

2005-03-02

12. CURRENT MODES

(MIXED

(

SLOW

FAST) DECAY MODE Effect)

· Current value in increasing (Sine wave)

Sine wave in decreasing (When using MIXED DECAY Mode with large attenuation ratio (MDT%) at

attenuation)

· Sine wave in decreasing (When using MIXED DECAY Mode with small attenuation ratio (MDT%) at

attenuation)

If RNF, current watching point, was the set current value (output current) in the mixed decay mode and

in the fast decay mode, there is no charge mode but the slow + fast mode (slow to fast is at MDT) in the
next chopping cycle.

Note: The above charts are schematics. The actual current transient responses are curves.

Slow Slow

Slow

Fast

Charge

Fast

Charge

Fast

Charge

Set current

value

Set current

value

Set current

value

Set current

value

Slow Slow

Fast

Charge

Fast

Charge

Slow

Fast

Slow

Fast

Charge

Because current attenuates so quickly, the current
immediately follows the set current value.

Set current

value

Set current

value

Slow

Fast

Charge

Slow

Fast

Charge

Fast

Slow

Fast

Slow

Because current attenuates slowly, it takes a long time
for the current to follow the set current value (or the
current does not follow).

TB62209FG

2005-03-02

13. MIXED DECAY MODE waveform (Current Waveform)

· When NF is after MIXED DECAY TIMING

· In MIXED DECAY MODE, when the output current > the set current value

37.5%
MIXED
DECAY
MODE

OUT

chop

Set current
value

CLK signal input

chop

MDT (MIXED DECAY TIMING) point

Set current value

RNF

Because the set current value is the output
current, no CHARGE MODE in the next cycle.
(Charge cancel function)

37.5%
MIXED
DECAY
MODE

OUT

chop

Set current
value

Set current value

MDT (MIXED DECAY TIMING) point

CLK signal input

Fast Decay mode after Charge mode

RNF

37.5%
MIXED
DECAY
MODE

Internal
CR CLK
signal

OUT

chop

Set current
value

Set current value

RNF

MDT (MIXED DECAY TIMING) point

TB62209FG

2005-03-02

12.5

MIXED DECAY MODE

15. CLK SIGNAL, INTERNAL CR CLK, AND OUTPUT CURRENT waveform

(When CLK signal is input in SLOW DECAY MODE)

When CLK signal is input, the chopping counter (CR-CLK counter) is forced to reset at the next CR-CLK

timing.

Because of this, compared with a method in which the counter is not reset, response to the input data is

faster.

The delay time, the theoretical value in the logic portion, is expected to be a one-cycle CR waveform: 5 µs

at 100 kHz CHOPPING.

When the CR counter is reset due to CLK signal input, CHARGE MODE is entered momentarily due to

current comparison.

Note: In FAST DECAY MODE, too, CHARGE MODE is entered momentarily due to current comparison.

CLK signal input

Set current value

OUT

RNF

Set current value

chop

Internal
CR CLK
signal

Momentarily enters CHARGE MODE

Reset CR-CLK counter here

RNF

MDT

chop

TB62209FG

2005-03-02

Current Discharge Path when ENABLE Input During Operation

In Slow Mode, when all output transistors are forced to switch off, coil energy is discharged in the

following MODES:

Note: Parasitic diodes are located on dotted lines. In normal MIXED DECAY MODE, the current does not flow

to the parasitic diodes.

As shown in the figure at right, an output transistor has parasitic diodes.
To discharge energy from the coil, each transistor is switched on allowing current to flow in the reverse

direction to that in normal operation. As a result, the parasitic diodes are not used. If all the output
transistors are forced to switch off, the energy of the coil is discharged via the parasitic diodes.

PGND

OFF

(Note)

Load

PGND

OFF

(Note)

Load

PGND

(Note)

Load

Charge mode

Slow mode

Forced OFF mode

power supply

OFF

Input ENABLE

OFF

TB62209FG

2005-03-02

Output Transistor Operating Mode

Output Transistor Operation Functions

CLK U1 U2 L1 L2

CHARGE

ON OFF OFF ON

SLOW OFF OFF ON ON

FAST OFF ON ON OFF

Note: The above table is an example where current flows in the direction of the arrows in the above figures.

When the current flows in the opposite direction of the arrows, see the table below.

CLK U1 U2 L1 L2

CHARGE

OFF ON ON OFF

SLOW OFF OFF ON ON

FAST ON OFF OFF ON

PGND

OFF

(Note)

Load

PGND

(Note)

Load

PGND

(Note)

Load

Charge mode

Slow mode

Fast mode

OFF

TB62209FG

2005-03-02

Power Supply Sequence

(Recommended)

Note 1: If the V

drops to the level of the V

DDR

or below while the specified voltage is input to the V

pin, the IC is

internally reset.
This is a protective measure against malfunction. Likewise, if the V

drops to the level of the V

or below

while regulation voltage is input to the V

, the IC is internally reset as a protective measure against

malfunction.
To avoid malfunction, when turning on V

or V

, to input the

Standby

signal at the above timing is

recommended.
It takes time for the output control charge pump circuit to stabilize. Wait up to t

ONG

time after power on

before driving the motors.

Note 2: When the V

value is between 3.3 to 5.5 V, the internal reset is released, thus output may be on. In such a

case, the charge pump cannot drive stably because of insufficient voltage. The

Standby

state should be

maintained until V

reaches 13 V or more.

Note 3: Since V

0 V and V

voltage within the rating are applied, output is turned off by internal reset.

At that time, a current of several mA flows due to the Pass between V

and V

When voltage increases on V

output, make sure that specified voltage is input.

DD (max)

DD (min)

DDR

GND

M (min)

GND

NON-RESET

RESET

Internal reset

STANDBY

INPUT (Note 1)

Takes up to t

ONG

until operable.

Non-operable area

STANDBY

TB62209FG

2005-03-02

How to Calculate Set Current

This IC controls constant current in CLK-IN mode.
At that time, the maximum current value (set current value) can be determined by setting the sensing

resistor (R

) and reference voltage (V

ref

1/5.0 is V

ref

(gain): V

ref

attenuation ratio. (For the specifications, see the electrical characteristics.)

For example, when inputting V

ref

= 3 V and torque = 100% to output I

OUT

= 0.8 A, R

= 0.75 (0.5 W

or more) is required.

How to Calculate the Chopping and OSC Frequencies

At constant current control, this IC chops frequency using the oscillation waveform (saw tooth waveform)

determined by external capacitor and resistor as a reference.

The TB62209FG requires an oscillation frequency of eight times the chopping frequency.
The oscillation frequency is calculated as follows:

600

0.523

For example, when C

osc

= 560 pF and R

osc

= 3.6 k are connected, f

= 813 kHz.

At this time, the chopping frequency f

chop

is calculated as follows:

chop

= f

/8 = 101

kHz

When determining the chopping frequency, make the setting taking the above into consideration.

IC Power Dissipation

IC power dissipation is classified into two: power consumed by transistors in the output block and power

consumed by the logic block and the charge pump circuit.
· Power consumed by the Power Transistor (calculated with R

= 0.60 )

In Charge mode, Fast Decay mode, or Slow Decay mode, power is consumed by the upper and lower

transistors of the H bridges.

The following expression expresses the power consumed by the transistors of a H bridge.

P (out) = 2 (T

) × I

OUT

(A) × V

(V) = 2 × I

OUT2

× R

..............................(1)

The average power dissipation for output under 4-bit micro step operation (phase difference between

phases A and B is 90°) is determined by expression (1).

Thus, power dissipation for output per unit is determined as follows (2) under the conditions below.

= 0.60 (@ 1.0 A)

OUT

(Peak: max) = 1.0 A

= 24 V

= 5 V

P (out) = 2 (T

) × 1.0

(A) × 0.60 () = 1.20 (W) ..............................................(2)

Power consumed by the logic block and IM
The following standard values are used as power dissipation of the logic block and IM at operation.

I (LOGIC) =

2.5 mA (typ.):

I (I

)

10.0 mA (typ.): operation/unit

I (I

)

2.0 mA (typ.): stop/unit

The logic block is connected to V

(5 V). IM (total of current consumed by the circuits connected to

and current consumed by output switching) is connected to V

(24 V). Power dissipation is

calculated as follows:

P (Logic&IM) = 5 (V) × 0.0025 (A) + 24 (V) × 0.010 (A) = 0.25 (W) ...............(3)

Thus, the total power dissipation (P) is

P = P (out) + P (Logic&IM) = 1.45 (W)

Power dissipation at standby is determined as follows:

P (standby) + P (out) = 24 (V) × 0.002 (A) + 5 (V) × 0.0025 (A) = 0.06 (W)

For thermal design on the board, evaluate by mounting the IC.

100%

)

(

50%)

70,

85,

100,

(Torque

Torque

(V)

ref

5.0

(max)

OUT

TB62209FG

2005-03-02

Relationship between Drive Mode Input Timing and MO

· If drive mode input changes before MO timing

Parallel set signal is reflected.

· If drive mode input changes after MO timing

Parallel set signal occurs after the rising edge of CLK, therefore, it is not reflected. The drive mode is

changed when the electrical angle becomes 0°.

Note: The TB62209FG uses the drive mode change reserve method to prevent the motor from step out

when changing drive modes.
Note that the following rules apply when switching drive modes at or near the MO signal output
timing.

Drive Mode Input
Internal Reflection (1)

Drive Mode Input
Waveform (1)

Drive Mode Input
Internal Reflection (2)

Drive Mode Input
Waveform (2)

CLK Waveform

MO Waveform

TB62209FG

2005-03-02

Reflecting Points of Signals

Point where Drive Mode

Setting Reflected

CW/CCW

2-Phase Excitation mode

(MO)

Before half-clock of phase

phase A

100%

At rising edge of CLK input

1-2 Phase Excitation mode

W1-2 Phase Excitation

mode

2W1-2 Phase Excitation

mode

4W1-2 Phase Excitation

mode

(MO)

Before half-clock of phase

100%

At rising edge of CLK input

Other parallel set signals can be changed at any time (they are reflected immediately).

Recommended Point for Switching Drive Mode

MO Waveform

CLK Waveform

When Drive Mode
Data Switching
can be Input

During MO output (phase data halted) to forcibly switch drive modes, a function to set RESET

Low

and to initialize the electrical angle is required.

Drive mode reflected

TB62209FG

2005-03-02

Relationship between V

and V

(charge pump voltage)

Note: V

5 V

Ccp 1

0.22

F, Ccp 2

0.022

F, f

chop

150 kHz

(Be aware the temperature charges of charge pump capacitor.)

(&Vcharge UP)

o
l
t
age

, c

har

o
l
t
ag

)

Supply voltage VM (V)

Charge pump voltage VH

VDD

VM (

Ccp A) (V)

VH voltage

charge up voltage

VM voltage

2 3

4 5 6 7 8 9

11 12 13

15 16 17 18

21 22 23 24 25 26

27 28 29

31 32 33 34 35 36 37 38 39

Input

STANDBY

VMR

VM voltage

Maximum rating

Charge pump
voltage

Usable area

Recommended operation area

TB62209FG

2005-03-02

Operation of Charge Pump Circuit

· Initial charging

(1) When RESET is released, T

is turned ON and T

turned OFF. Ccp 2 is charged from Ccp 2 via

Di1.

(2) T

is turned OFF, T

is turned ON, and Ccp 1 is charged from Ccp 2 via Di2.

(3) When the voltage difference between V

and V

(Ccp A pin voltage = charge pump voltage)

reaches V

or higher, operation halts (Steady state).

· Actual operation

(4) Ccp 1 charge is used at f

chop

switching and the V

potential drops.

(5) Charges up by (1) and (2) above.

Output switching

Initial charging

Steady state

(1)

(2) (3)

(4)

(5)

(4)

(5)

charge pump voltage

charge pump current

gate block power dissipation

5 V

24 V

Comparator

Controller

Output

Output
H switch

Ccp 1
0.22

Ccp A

Ccp B

Ccp C

Ccp 2
0.01

Di2

Di1

Di3

(2)

(1)

(2)

TB62209FG

2005-03-02

Charge Pump Rise Time

ONG

Time taken for capacitor Ccp 2 (charging capacitor) to fill up Ccp 1 (storing capacitor) to V

+ V

after

a reset is released.

The internal IC cannot drive the gates correctly until the voltage of Ccp 1 reaches V

+ V

. Be sure to

wait for t

ONG

or longer before driving the motors.

Basically, the larger the Ccp 1 capacitance, the smaller the voltage fluctuation, though the initial charge

up time is longer.

The smaller the Ccp 1 capacitance, the shorter the initial charge-up time but the voltage fluctuation is

larger.

Depending on the combination of capacitors (especially with small capacitance), voltage may not be

sufficiently boosted. When the voltage does not increase sufficiently, output DMOS R

turns lower than

the normal, and it raises the temperature.

Thus, use the capacitors under the capacitor combination conditions (Ccp 1 = 0.22 µF, Ccp 2 = 0.02 µF)

recommended by Toshiba.

50%

90%)

Ccp 1 voltage

5 V

0 V

STANDBY

ONG

TB62209FG

2005-03-02

External Capacitor for Charge Pump

When driving the stepping motor with V

= 5 V, f

chop

= 150 kHz, L = 10 mH under the conditions of V

= 13 V and 1.5 A, the logical values for Ccp 1 and Ccp 2 are as shown in the graph below:

Choose Ccp 1 and Ccp 2 to be combined from the above applicable range. We recommend Ccp 1:Ccp 2 at

10:1 or more. (If our recommended values (Ccp = 0.22 µF, Ccp 2 = 0.02 µF) are used, the drive conditions in
the specification sheet are satisfied. (There is no capacitor temperature characteristic as a condition.)

When setting the constants, make sure that the charge pump voltage is not below the specified value and

set the constants with a margin (the larger Ccp 1 and Ccp 2, the more the margin).

Some capacitors exhibit a large change in capacitance according to the temperature. Make sure the above

capacitance is obtained under the usage environment temperature.

Ccp 1 capacitance (

Ccp 1 Ccp 2

p 2

p
a
c
i
t
a

nce

(

0.05

Recommended

value

0.005

0.01

0.015

0.02

0.025

0.03

0.035

0.04

0.045

0.05 0.1 0.15 0.2 0.25

0.35 0.4 0.45 0.5

0.3

Applicable range

TB62209FG

2005-03-02

(1) Low Power Dissipation mode

Low Power Dissipation mode turns off phases A and B, and also halts the charge pump.
Operation is the same as that when the STANDBY pin is set to Low.

(2) Motor Lock mode

Motor Lock mode turns phase B output only off with phase A off.
From reset, with IA = 0 and IB = 100%, the normal 4W1-2 phase operating current is output.
Use this mode when you want to hold (lock) the rotor at any desired value.

(3) 2-Phase

Excitation

mode

Electrical angle 360° = 4 CLKs

Note: 2-phase excitation has a large load change due to motor induced electromotive force. If a mode in

which the current attenuation capability (current control capability) is small is used, current increase
due to induced electromotive force may not be suppressed. In such a case, use a mode in which
the mixed decay ratio is large.
We recommend 37.5% Mixed Decay mode as the initial value (general condition).

100

Phase B

Phase A

[%]

100

STEP

IB (%)

2-Phase Excitation Mode (typ.A)

)

100

TB62209FG

2005-03-02

Recommended Application Circuit

The values for the devices are all recommended values. For values under each input condition, see the

above-mentioned recommended operating conditions.

Note: Adding bypass capacitors is recommended.

Make sure that GND wiring has only one contact point, and to design the pattern that allows the heat
radiation.
To control setting pins in each mode by SW, make sure to pull down or pull up them to avoid high
impedance.
To input the data, see the section on the recommended input data.

Because there may be shorts between outputs, shorts to supply, or shorts to ground, be careful when
designing output lines, V

) lines, and GND lines.

osc

3.6 k

osc

560 pF

ref AB

RS A

RS B

)

PROTECT

DMODE 3

DMODE 2

DMODE 1

MDT 1

MDT 2

STANDBY

P-GND

RESET

CW/CCW

ENABLE

CLK

DATA MODE

ref AB

SGND

RS A

0.66

Stepping
Motor

0.66

RS B

SGND

5 V

Ccp C

Ccp B

Ccp A

Ccp 2
0.01

Ccp 1
0.22

DATA MODE

TORQUE 2

TORQUE 1

OPEN

0 V

5 V

0 V

24 V

SGND

100

5 V

0 V

5 V

0 V

5 V

0 V

5 V

0 V

5 V

0 V

5 V

0 V

5 V

0 V

5 V

0 V

5 V

0 V

5 V

0 V

5 V

0 V

5 V

PGND

TB62209FG

2005-03-02

The information contained herein is subject to change without notice.

The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed
by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.

TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in
general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility
of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire
system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life,
bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the
most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the
"Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc..

The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal
equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products
are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a
malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include
atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments,
combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products
listed in this document shall be made at the customer's own risk.

The products described in this document are subject to the foreign exchange and foreign trade laws.

TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced and sold, under
any law and regulations.

030619EBA

RESTRICTIONS ON PRODUCT USE

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