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Электронный компонент: TB6562ANG

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TB6562ANG
2004-07-02
1
TOSHIBA Bi-CMOS Integrated Circuit Silicon Monolithic
TB6562ANG
Dual Full-Bridge Driver IC for Stepping Motors


The TB6562ANG is a 2-phase bipolar stepping motor driver that
contains DMOS transistors in the output stage. The driver
achieves high efficiency through the use of low ON-resistance
DMOS transistors and PWM current control circuitry.
Features
2-phase/1-2 phase/W 1-2 phase excitation
PWM current control
Power supply voltage: 40 V (max)
Output current: 1.5 A (max)
Low ON-resistance: 1.5 (upper and lower transistors/typ.)
Power-saving function
Overcurrent protection: Ilim2.5 A (typ.)
Thermal shutdown
Package: SDIP24-P-300-1.78
Weight: 1.62 g (typ.)
Preliminary
TB6562ANG:
TB6562ANG is Pb-free product.
The following conditions apply to solderability:
*Solderability
1. Use of Sn-63Pb solder bath
*solder bath temperature = 230C
*dipping time = 5 seconds
*number of times = once
*use of R-type flux
2. Use of Sn-3.0Ag-0.5Cu solder bath
*solder bath temperature = 245C
*dipping time = 5 seconds
*number of times = once
*use of R-type flux
TB6562ANG
2004-07-02
2
Block Diagram
Some functional blocks, circuits, or constants may be omitted or simplified in the block diagram for explanatory purposes
.



GND
5 V
24
2
3
22
23
11
7
8
14
18
17
1
4
5
6
21
20
19
9
10
16
15
Vreg
SB OSC V
CC
OUT2A
Vcc
OUT1A
OUT2B
Vcc OUT1B GND
GND Phase
A X1A X2A
Phase
B
X1B
X2B
VrefA
RSA
VrefB RSB GND
OSC
Waveform
squaring
circuit
Control logic
Thermal
shutdown
Decoder
13
12
TB6562ANG
2004-07-02
3
Maximum Ratings
(Ta
=
25C)
Characteristics Symbol
Rating
Unit
Power supply voltage
V
CC
40 V
Output voltage
Vo
40
V
Output current
I
O (Peak)
1.5 A
Input voltage
Vin
5.5
V
Power dissipation
P
D
2.5
(Note
1)
W
Operating temperature
T
opr
-
20 to 85
C
Storage temperature
T
stg
-
55 to 150
C
Junction temperature
Tjmax
150
C
Note 1: When mounted on a board (50 mm
50 mm
1.6 mm, Cu area: 50%)
The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must not be
exceeded during operation, even for an instant.
If any of these ratings are exceeded during operation, the electrical characteristics of the device may be irreparably
altered, in which case the reliability and lifetime of the device can no longer be guaranteed.
Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation in other
equipment. Applications using the device should be designed so that no maximum rating will ever be exceeded under
any operating condition.
Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set forth in this
document.

Operating Range
(Ta
=
25C)
Characteristics Symbol
Rating
Unit
Power supply voltage
VCC
10~ 34
V
Input voltage
Vin
0~ 5
V
Vref voltage
Vref
0.5~ 7.0
V
PWM frequency
fpwm
15~ 80
kHz
Triangular-wave oscillation frequency
f
osc
45~
400
kHz

TB6562ANG
2004-07-02
4
Pin Description
Pin No.
Symbol
Function Description
Remarks
1 GND
Ground
pin
2 Vreg
5-V
output
pin
Connect a capacitor between this pin
and GND pin.
3
SB
Standby pin
HIGH: Start, LOW: Standby
4
Phase A
Rotation direction control pin (ch. A)
Apply a 0-V/5-V signal.
5 X1A
Input pin used to set output current level
(ch. A)
Apply a 0-V/5-V signal.
6 X2A
Input pin used to set output current level
(ch. A)
Apply a 0-V/5-V signal.
7 V
CC
Power supply voltage input pin
V
CC (opr)
=
10 V to 34 V
8
OUT1A
Output pin 1 (ch. A)
Connect to a motor coil pin.
9 VrefA
Input pin for external reference voltage
(ch. A)
10 RSA
Output current detection resistor
connection pin (ch. A)
11
OUT2A
Output pin 2 (ch. A)
Connect to a motor coil pin.
12 GND
Ground
pin
13 GND
Ground
pin
14
OUT2B
Output pin 2 (ch. B)
Connect to a motor coil pin.
15 RSB
Output current detection resistor
connection pin (ch. B)
16 VrefB
Power supply voltage input pin for motor
drive (ch. B)
17
OUT1B
Output pin 1 (ch. B)
Connect to a motor coil pin.
18 V
CC
Power supply voltage input pin
V
CC (opr)
=
10 V to 34 V
19 X2B
Input pin used to set output current level
(ch. B)
Apply a 0-V/5-V signal.
20 X1B
Input pin used to set output current level
(ch. B)
Apply a 0-V/5-V signal.
21
Phase B
Rotation direction control pin (ch. B)
Apply a 0-V/5-V signal.
22 OSC
Capacitor connection pin for
triangular-wave oscillation
23 V
CC
Power supply voltage input pin
V
CC (opr)
=
10 V to 34 V
24 GND
Ground
pin


TB6562ANG
2004-07-02
5
Electrical Characteristics
(V
CC
=
24 V, Ta
=
25C)
Characteristics Symbol
Test
Circuit
Test Condition
Min
Typ.
Max
Unit
ICC1
XT1A = XT2A = H, XT1B = XT2B = H
6.5 10
ICC2
XT1A = XT2A = L, XT1B = XT2B = L
7.0 12
Supply current
ICC3
Standby mode
2.0 4.0
mA
VINH
2
5.5
Input voltage
VINL
-0.2
0.8
Input hysteresis
voltage
VIN (HYS)
0.4
V
IINH
V
IN
=
5 V
30
50
75
Control circuit
(Note 1)
Input current
IINL
V
IN
=
0 V
5
A
VINSH
2
5.5
Input voltage
VINSL
-0.2
0.8
Input hysteresis
voltage
VIN (HYS)
0.4
V
IINSH
V
IN
=
5 V
30
50
75
Standby circuit
Input current
IINSL
V
IN
=
0 V
5
A
IO
=
1.5 A
1.5 2.0
Output ON-resistance
Ron (U
+
L)
IO
=
1.5 A
1.5 2.0
IL (U)
V
CC
=
40 V
10
Output leakage current
IL (L)
V
CC
=
40 V
10
A
VF (U)
IO
=
1.5 A
1.3 2.0
Diode forward voltage
VF (L)
IO
=
1.5 A
1.3 2.0
V
Internal reference voltage
Vreg
1 mA
4.75
5
5.25
V
Input current
Iref
Vref = 0.5 V
5
10
A
Vref (1/10)
X1
=
X2
=
L
Vref = 5 V
0.45
0.5
0.55
Vref (1/15)
X1
=
L, X2
=
H
Vref = 5 V
0.28
0.33
0.38
Vref circuit
Current limit
voltage
Vref (1/30)
X1
=
H, X2
=
L
Vref
5 V
0.12
0.17
0.22
V
Triangular-wave oscillation
frequency
f
osc
C = 4700 pF
88
110
132
kHz
Thermal shutdown circuit operating
temperature
TSD
160
C
Note 1: Phase, X1 and X2 pins

TB6562ANG
2004-07-02
6
Truth Tables
< 2-phase excitation >
Phase A
Phase B
Input Output
Input
Output
Phase A
X1A
X2A
I
O
(A) Phase
B
X1B X2B I
O
(B)
H L L
100%
H L L
100%
L L
L
-
100% H L L 100%
L L
L
-
100% L L L
-
100%
H L L
100%
L L L
-
100%

< 1-2 phase excitation >
Phase A
Phase B
Input Output
Input
Output
Phase A
X1A
X2A
I
O
(A)
Phase B
X1B
X2B
I
O
(B)
H L
L
100%
H L
L
100%
X H
H
0%
H L
L
100%
L L
L
-
100% H L L 100%
L L
L
-
100% X H H 0%
L L
L
-
100% L L L
-
100%
X H
H
0% L L
L
-
100%
H L
L
100%
L L
L
-
100%
H L
L
100%
X
H
H
0%

< W1-2 phase excitation >
Phase A
Phase B
Input Output
Input
Output
Phase
A X1A X2A I
O
(A)
Phase B
X1B
X2B
I
O
(B)
X H H
0%
L
L
L
-
100%
H H L
33.3%
L
L
L
-
100%
H L H
66.7%
L
L
H
-
66.7%
H L L
100%
L
H
L
-
33.3%
H L L
100%
X
H
H
0%
H L L
100%
H
H
L
33.3%
H H L
33.3%
H
L
H
66.7%
H L H
66.7%
H
L
L
100%
X H H
0%
H
L
L
100%
L H L
-
33.3% H
L
L 100%
L L
H
-
66.7% H
L
H 66.7%
L L L
-
100% H H L 33.3%
L L L
-
100% X H H 0%
L L L
-
100% L H L
-
33.3%
L L
H
-
66.7% L
L
H
-
66.7%
L H L
-
33.3% L
L
L
-
100%
TB6562ANG
2004-07-02
7
Timing Charts
Timing charts may be simplified for explanatory purposes
.

< 2-phase excitation >


< 1-2 phase excitation >

I
O
(A)
100
-
100
100
-
100
H
L
H
L
H
L
H
L
H
L
H
L
I
O
(B)
Phase A
X1A
X2A
Phase B
X1B
X2B
H
L
H
L
H
L
H
L
H
L
H
L
Phase A
X1A
X2A
Phase B
X1B
X2B
I
O
(A)
100
0%
-
100
I
O
(B)
100
0%
-
100
TB6562ANG
2004-07-02
8
< W1-2 phase excitation >



H
L
H
L
H
L
H
L
H
L
H
L
Phase A
X1A
X2A
Phase B
X1B
X2B
I
O
(A)
100
66.7%
33.3%
0%
-
33.3
-
66.7%
-
100%
I
O
(B)
100
66.7%
33.3%
0%
-
33.3
-
66.7%
-
100%
TB6562ANG
2004-07-02
9
PWM Current Control
The IC enters CW (CCW) mode and short brake mode alternately during PWM current control.
To prevent shoot-through current caused by simultaneous conduction of upper and lower transistors in the
output stage, a dead time is internally generated for 500 ns (target spec) when the upper and lower transistors are
being switched.
Therefore synchronous rectification for high efficiency in PWM current control can be achieved without an
off-time generated via an external input.
Even when toggling between CW and CCW modes, and CW (CCW) and short brake modes, no off-time is required
due to the internally generated dead time.

V
CC
M
RS
V
CC
M
RS
PWM ON
t5
PWM OFF
ON
t4
=
500 ns (typ.)
V
CC
M
RS
PWM OFF
t3
PWM ON
OFF
t2
=
500 ns (typ.)
V
CC
M
RS
OUT1
OUT1
OUT1
OUT1
V
CC
M
RS
PWM ON
t1
OUT1
TB6562ANG
2004-07-02
10
(1) Constant current regulation
When V
RS
reaches the reference voltage (Vref), the IC enters discharge mode. After four clock signals
are generated from the oscillator, the IC moves from discharge mode to charge mode.
V
RS
Vref
Internal
clock
Discharge
Charge
Vref
OSC
V
RS
GND
Discharge
TB6562ANG
2004-07-02
11
(2) Transition from charge mode to discharge mode
If V
RS
> Vref after four clock signals in charge mode, the IC again enters discharge mode. After a
further four clock signals in discharge mode, V
RS
is compared with Vref. If V
RS
< Vref, the IC
operates in charge mode until V
RS
reaches Vref.






















(3) Transition from discharge mode to charge mode
Even when the reference voltage has risen, discharge mode lasts for four clock signals and is then
toggled to charge mode.





















Internal oscillation frequency (fosc)
The internal oscillation frequency is determined by the charging and discharging of the external capacitor (Cosc):

osc = 1 / (0.523 (Cosc 3700 Cosc 600))
theoretical formula

Internal
clock
Discharge
Charge
Discharge
Charge
Internal
clock
Discharge
Discharge
Charge
Vref
V
RS
OSC
GND
Vref
V
RS
OSC
GND
TB6562ANG
2004-07-02
12
Reference Voltage Generator
The current value at 100% is determined by applying voltage at the Vref pin.
The value can be calculated as:
I
O
(100) = Vref 1/10 1/RS[A] (X1 = X2 = L)















Thermal Shutdown Circuit (TSD)
The IC incorporates a thermal shutdown circuit. When the junction temperature (T
j
) reaches 160C (typ.), the
output transistors are turned off.
After 50 s (typ.), the output transistors are turned on automatically.
The IC has 20C of temperature hysteresis.
TSD = 160C (target spec)
TSD = 20C (target spec)
Overcurrent Protection Circuit (ISD)
The IC incorporates an overcurrent protection circuit to detect voltage flowing through the output transistors. The
overcurrent threshold is 2.5 A (typ.).
Currents flowing through the output transistors are monitored individually. If overcurrent is detected in at least
one of the transistors, all transistors are turned off.
The IC incorporates a timer to count the 50 s (typ.) for which the transistors are off. After the 50 s, the
transistors are turned on automatically. If an overcurrent occurs again, the same operation is repeated. To prevent
false detection due to glitches, the circuit turns off the transistors only when current exceeding the overcurrent
threshold flows for 10 s or longer.
The target specification for the overcurrent limiter value (overcurrent threshold) is 2.5 A (typ.), and varies in a
range from approximately 1.5 A to 3.5 A.
These protection functions are intended only as a temporary means of preventing output short circuits or other
abnormal conditions and are not guaranteed to prevent damage to the IC.
- If the guaranteed operating ranges of this product are exceeded, these protection features may not operate and
some output short circuits may result in the IC being damaged.
The overcurrent protection feature is intended to protect the IC from temporary short circuits only.
Short circuits persisting over long periods may cause excessive stress and damage the IC. Systems should be
configured so that any overcurrent condition will be eliminated as soon as possible.
Decoder
Control
circuit
I
LIM
50
s
(typ.)
0
10
s
(typ.)
Not detected
50
s
(typ.)
10
s
(typ.)
Output current
V
CC
M
IO
OUT1
1/10
1/15
1/30
RS
Vref
X1
X2
IO
OUT2
TB6562ANG
2004-07-02
13
Application Circuit

























Note 1: A power supply capacitor should be connected between V
CC
and RSA (RSB) and as close as possible to
the IC.
Note 2: C2 and C3 should be connected as close as possible to S-GND.
Note 3: When changing the Vref, a DAC output can be connected directly to the Vref pin.
Note 4: The V
CC
pins (pin 23, pin 7, pin 18) should be shorted externally.
Caution on Use
The IC may be destroyed by short circuits between output pins, an output pin and the V
CC
pin, or an output pin
and the ground pin. Exercise due care when designing output lines, V
CC
lines and ground lines.
Install the product correctly. Otherwise, breakdown, damage and/or degradation to the product or equipment
may result.













(Note 2)
24 V
V
CC
OSC
Vreg
GND
OUT1A
RSA
TB6562ANG
2
22
23
7
18
3
4
5
6
27
26
25
8
11
10
17
14
15
PORT1
PORT2
PORT3
PORT4
PORT5
PORT6
PORT7
PORT8
PORT9
GND
DAC output signal
SB
Phase A
XA1
XA2
Phase B
XB1
XB2
9
16
OUT2A
OUT1B
RSB
OUT2B
VrefA VrefB
1,12,13,24
C1
C2
C3
(Note 4)
(Note 1)
R1
R1
R2
V
DD
Stepping
motor
5 V
Vcc
Vcc
TB6562ANG
2004-07-02
14





























Weight: 1.62 g (typ.)
TB6562ANG
2004-07-02
15

Notes on contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Maximum Ratings
The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must not
be exceeded during operation, even for an instant.
If any of these ratings are exceeded during operation, the electrical characteristics of the device may be
irreparably altered, in which case the reliability and lifetime of the device can no longer be guaranteed.
Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation in
other equipment. Applications using the device should be designed so that no maximum rating will ever be
exceeded under any operating conditions.
Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set
forth in this document.
5. Application Circuits
The application circuits shown in this document are provided for reference purposes only. Thorough evaluation
is required in the mass production design phase.
In furnishing these examples of application circuits, Toshiba does not grant the use of any industrial property
rights.
6. Test Circuits
Components in test circuits are used only to obtain and confirm device characteristics. These components and
circuits are not guaranteed to prevent malfunction or failure in application equipment.
Handling of the IC
Ensure that the product is installed correctly to prevent breakdown, damage and/or degradation in the product
or equipment.

Overcurrent protection and heat protection circuits
These protection functions are intended only as a temporary means of preventing output short circuits or other
abnormal conditions and are not guaranteed to prevent damage to the IC.
If the guaranteed operating ranges of this product are exceeded, these protection features may not operate
and some output short circuits may result in the IC being damaged.
The overcurrent protection feature is intended to protect the IC from temporary short circuits only.
Short circuits persisting over long periods may cause excessive stress and damage the IC. Systems should
be configured so that any overcurrent condition will be eliminated as soon as possible.
Counter-electromotive force
When the motor reverses or stops, the effect of counter-electromotive force may cause the current to flow to the
power source.
If the power supply is not equipped with sink capability, the power and output pins may exceed the maximum
rating.
The counter-electromotive force of the motor will vary depending on the conditions of use and the features of
the motor. Therefore make sure there will be no damage to or operational problem in the IC, and no damage to
or operational errors in peripheral circuits caused by counter-electromotive force.
TB6562ANG
2004-07-02
16
The information contained herein is subject to change without notice.
The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others.
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability
Handbook" etc..
The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer's own risk.
The products described in this document are subject to the foreign exchange and foreign trade laws.
TOSHIBA products should not be embedded to the downstream products which are prohibited to be produced
and sold, under any law and regulations.
030619EBA
RESTRICTIONS ON PRODUCT USE