PLATED THRU HOLE
FOR STANDOFF MTG
3,30
0,08
4 x 0.130
0.003
17,78
0.700
25,4
1.000
35,56
1.400
10,16
0.400
48,26
0,05
1.900
0.002
1,59
0.063
48,26
1.900
3,18
0,05
2 x 0.125
0.002
40,64
1.600
7,62
0.300
1,59
0.063
6,35
0.250
6,36
0.250
13,61
0.536
53,24
2.096
2,47
0.097
13,61
0.536
6,36
0.251
DETAIL A
(MIRROR IMAGE TO OTHER SIDE)
ALL DIMENSIONS IN INCHES
SEE DETAIL B
SEE DETAIL A
PCB
2
4
3
1
9
8
7
6
5
PCB MOUNTING SPECIFICATIONS
(ALSO SEE EXCHANGE TOOL DETAILS IN RIGHT VIEWS)
PRODUCT APPLICATION SPECIFICATIONS
1,63
0,08
(#52 DRILL)
6 x 0.064
0.003
DETAIL B
(MIRROR IMAGE TO OTHER SIDE)
ALL DIMENSIONS IN INCHES
15
11,18
0.440
50,8
2.000
61,72
2.430
6,73
0.265
7,62
0.300
20,3
0,8
0.80
0.03
3,8
0.15
50,3
1.98
1,6
0.06
9,5
0.38
31,6
1.25
12,47
0.491
MAX
0.56
0,15
0.006
20,3
0.80
SURFMATE INPUT
CONNECTOR
PCB
MODULE
1
2
3
1
3
4
5
6
7
8
9
2
MODULE
EXCHANGE
TOOL
MODULE
EXCHANGE
TOOL-
BOTH ENDS
(PARTIAL)
MODULE
BASEPLATE
PCB
SURFMATE OUTPUT
CONNECTOR
DETAIL C
REF
BOTTOM OF
CAP TO TOP
OF PCB
EXCHANGE TOOL
HOOK AREA, 4 PLCS
(BOTH ENDS-SEE VIEWS)
38
55
0.131
0.467
0.027
0.230
0.115
0.159
0.318
0.034
0.604
0.027
0.277
TYP
0.230
0.065
0.115
0.340
0.202
TYP
0.050
0.027
TYP
0.050
0.027
0.027
0.340
0.226
0.328
0.265
0.254
0.065
0.138
TYP
0.050
TYP
0.050
0.034
0.065
0.027
0.027
0.027
FREE OF SOLDER MASK
SOLDER MASK KEEP-OUT AREA
EXCEPT ON PADS
SOLDER MASK KEEP-OUT AREA
EXCEPT ON PADS
FREE OF SOLDER MASK
3 VIA HOLES
0.032
0.003
29 VIA HOLES
0.032
0.003
2 x 0.316
7 x 0.233
16 VIA HOLES
0.032
0.003
3 VIA HOLES
0.032
0.003
7 PL
0.016 NON PLATED THRU
7 x 0.016
0.266
0.069
0.313
0.102
0.266
0.069
0.350
0.152
All dimensions are Inch or Inch / Metric
ANSI / IPC-D-300 specifications apply for Class "B" boards.
Recommended PCB construction:
Multilayer 3oz Cu with internal power and ground planes. Pad geometry and minimum number
of via holes for connection to power and ground planes shown in Details "A" & "B" for high
current applications. Pads to be covered with solder mask except in circular area shown in
Detail "A" & "B". Final pad height above laminate to be 0.004" +/- 0.0004".
Light gray area denotes stencil aperture (should include circular solder mask keep-out area on each pad).
Pin Symbol
Function
Symbol
Function
Pin
Dia.
Number
(Inches / mm)
1
+
+IN
N
Neutral
0.080 / 2,03
2
PC
Prim. Control EMI GRD
EMI
0.080 / 2,03
3
PR
Parallel
NC
0.080 / 2,03
4
IN
L
Line
0.080 / 2,03
5
OUT
Out
0.150 / 3,81
6
S
Sense
EN
Enable
0.080 / 2,03
7
SC
Sec. Control
ST
Strap
0.080 / 2,03
8
+S
+Sense
BOK
BUS OK
0.080 / 2,03
9
+
+Out
+
+ OUT
0.150 / 3,81
PIN LEGEND
Mini
FARM
4
www
.vicr
.
com
PCB Layout Drawing
for Mini Size Module
PDF 
ZIP