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Электронный компонент: 1442

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Document Number: 63032
Revision 31-Jul-02
www.vishay.com
126
1442, 1445, 1446
Vishay Foil Resistors
THROUGH HOLE
VISHAY FOIL FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31
GERMANY +49.9287.710 FAX: +49 9287.70435
ISRAEL +972.3.557.0945 FAX: +972.3.558.9121
ITALY + 39.2.300.11919 FAX: +39.2.300.11999
JAPAN +81.42.729.0661 FAX: +81.42.729.3400
SINGAPORE +65.788.6668 FAX: +65.788.0988
SWEDEN +46.8.594.70590 FAX: +46.8.594.70581
UK +44 191 514 8237 FAX: +44 1953 457 722
USA +1 610 407-4800 FAX: +1 610 640-9081
Bulk Metal
Foil Technology
Dual-In-Line Hermetic Resistor Networks
5
4
7 6
1
8
2 3
8 7 6 5
1 2 3 4
NOTE:
Usable area is represented by
the dotted lines-- a rectangle
0.150 Inches x 0.200 Inches.
Illustrations not to scale. Chips
shown undersize for clarity.
Drawing view is from the top
looking down into the package.
FIGURE 1 - PACKAGE SIZES AND CHARACTERISTICS
FIGURE 2 - SAMPLE CIRCUIT DESIGN AND CHIP LAYOUT
Vishay Model 1442, 1445 and 1446 networks incorporate all the
performance features of Vishay Bulk Metal
Foil technology.
The 8, 14 and 16 pin side brazed DIPs are a ceramic package.
Ceramic has the advantage of electrical isolation on the underside,
and, in DIP form, a favorable pin arrangement when two networks
are to be placed side by side and connected together.
Review data sheet "7 Technical Reasons to Specify Bulk
Metal Foil Resistor Networks."
Networks are built to your requirements. Send your schematic
and electrical requirements to the Applications Engineering
Department. (See data sheet "Network Worksheet.") A unique
part number will be assigned which defines all aspects of your
network.
VISHAY
MODEL
MAXIMUM POWER RATING
(WATTS) @ +70
C
CHIP CAPACITY
MAXIMUM DIMENSIONS in Inches (mm)
NO. OF
PINS
L
W
B
LL
V5X5 V15X5
1442
8
0.520
0.020
0.295
0.010
0.054
0.125 minimum
12
4
0.4
(13.21
0.51)
(7.49
0.025)
(1.37)
(3.18)
1445
14
0.740
0.045 0.270 +0.035/0.030
0.046
0.135 +0.015/0.010
30
10
1.2
(18.80
1.14) (6.86 +0.89/0.76)
(1.17)
(3.43 +0.38/0.25)
1446
16
0.780
0.030
0.290
0.008
0.040 to 0.070 0.135 +0.015/0.010
36
12
1.4
(19.81
0.76)
(7.37
0.20)
(1.01 to 1.78)
(3.43 +0.38/0.25)
NOTE:
1.
These networks utilize Vishay Bulk Metal
Foil resistor chips V5X5 and V15X5 or VTF15X5 Thin Film chips.
2.
The V5X5 and V15X5 chips have maximum resistance values of 10K and 33K respectively in Bulk Metal
Foil and 500K in
VTF15X5 Thin Film chips.
3.
The V5X5 and V15X5 chip(s) can be intermixed in a package.
0.300
0.010
(7.62
0.25)
NO. 1 LEAD
L
B
W
0.200
(5.08)
MAXIMUM
LL
0.015 to 0.022
(0.38 to 0.56)
0.100
(2.54)
TYPICAL
0.008 to 0.016
(0.20 to 0.41)
Product may not
be to scale
www.vishay.com
127
1442, 1445, 1446
Vishay Foil Resistors
Document Number: 63032
Revision 31-Jul-02
THROUGH HOLE
VISHAY FOIL FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31
GERMANY +49.9287.710 FAX: +49 9287.70435
ISRAEL +972.3.557.0945 FAX: +972.3.558.9121
ITALY + 39.2.300.11919 FAX: +39.2.300.11999
JAPAN +81.42.729.0661 FAX: +81.42.729.3400
SINGAPORE +65.788.6668 FAX: +65.788.0988
SWEDEN +46.8.594.70590 FAX: +46.8.594.70581
UK +44 191 514 8237 FAX: +44 1953 457 722
USA +1 610 407-4800 FAX: +1 610 640-9081
R1 R2 R3 R4
R5 R6 R7 R8
R9 R10
R1
R2
R3
R4
R5
R6
R7
R8
R9
R10 R1
R2
R3
R4
R5
R6
R7
R8
R9
R1
R2
R3
R4
R5
R6
R7
R8
R9
R10
R1
R2
R3
R4
R5
R6
R7
R8
R9
R1 R2 R3 R4 R5 R6 R7 R8 R9 R10
1
14
2
12
4
11
5
10
6
8
7
14
13
12
11
10
9
8
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1
2
3
4
5
6
7
14
13
12 11 10
9
8
1
2
3
4
5
6
7
NOTE:
Usable area is represented by the dotted lines-- a rectangle 0.150 Inches x 0.500 Inches. Illustrations not to scale.
Chips shown undersize for clarity. Drawing view is from the top looking down into the package.
FOUR DIVIDERS PLUS
APPLICATION RESISTOR
TWO DECADES OF BCD LADDER
PLUS TWO SCALING RESISTORS
TEN RESISTOR DIVIDER
EIGHT RESISTOR
PACKAGE
ELEVEN RESISTOR
DIVIDER
NOTE:
Usable area is represented by the dotted lines-- a rectangle 0.150 Inches x 0.600 Inches. Illustrations
not to scale. Chips shown undersize for clarity. Drawing view is from the top looking down into the
package.
R1 R2
R3
R5
R8
R4
R6
R7
R1
R2
R3
R4
R5
R6
R7
R8
16 15 14 13
11
9
12
10
1
2
3
4
6
8
7
5
16 15 14 13
11
12
10
1
2
3
4
6
7
5
9
8
16 15 14 13
11
9
12
10
R1 R2 R3 R4 R5 R6 R7 R8R9 R
10
R
11
R4
R6
R7
R9 R
10
R1 R2 R3
R5
R8
R
11
1
2
3
4
6
8
7
5
1
2
4
5
8
7
16
15
12
10
13
9
FIGURE 3 - SAMPLE CIRCUIT DESIGNS AND CHIP LAYOUTS
FIGURE 4 - SAMPLE CIRCUIT DESIGNS AND CHIP LAYOUTS
Bulk Metal
Foil Technology
Dual-In-Line Hermetic Resistor Networks