VISHAY
TSOP5700
Document Number 82166
Rev. 5, 14-Aug-03
Vishay Semiconductors
www.vishay.com
1
16797
1
2
3
4
IR Receiver for High Data Rate PCM at 455 kHz
Description
The TSOP5700 is a miniaturized SMD IR receiver for
infrared remote control and IR data transmission. PIN
diode and preamplifier are assembled on lead frame,
the epoxy package is designed as IR filter.
The demodulated output signal can directly be
decoded by a microprocessor. The main benefit is the
operation with high data rates and long distances.
Features
Photo detector and preamplifier in one package
Internal Bandfilter for PCM frequency
Internal shielding against electrical field
disturbance
TTL and CMOS compatibility
Output active low
Small size package
Special Features
Data rate 20 kbit/s
Supply voltage 2.7 - 5.5 V
Short settling time after power on
High envelope duty cycle can be received
Enhanced immunity against disturbance from
energy saving lamps
Taping available for topview and sideview
assembly
Mechanical Data
Pinning:
1 = GND, 2 = NC, 3 = OUT, 4 = V
S
Block Diagram
Application Circuit
10 k
3
1
V
S
OUT
Demo-
GND
Pass
AGC
Input
PIN
Band
dulator
Control Circuit
4
16840
C
1
=
4.7 F
TSOPxxxx
OUT
GND
Circuit
C
R
1
= 47
+V
S
GND
Transmitter
with
TSHFxxxx
V
S
R
1
+ C
1
recommended to suppress power supply
disturbances.
V
O
R
2
>=
1 k
R
2
optional for improved pulse forming.
16843
www.vishay.com
2
Document Number 82166
Rev. 5, 14-Aug-03
VISHAY
TSOP5700
Vishay Semiconductors
Absolute Maximum Ratings
T
amb
= 25 C, unless otherwise specified
Electrical and Optical Characteristics
T
amb
= 25 C, unless otherwise specified
Parameter
Test condition
Symbol
Value
Unit
Supply Voltage
Pin 4
V
S
- 0.3 to + 6.0
V
Voltage at output to supply
Pin 3
V
S
- V
O
- 0.3 to
(V
S
+ 0.3)
V
Supply Current
Pin 4
I
S
5
mA
Output Voltage
Pin 3
V
O
- 0.3 to + 6.0
V
Output Current
Pin 3
I
O
15
mA
Junction Temperature
T
j
100
C
Storage Temperature Range
T
stg
- 40 to + 85
C
Operating Temperature Range
T
amb
- 25 to + 85
C
Power Consumption
T
amb
85 C
P
tot
50
mW
Parameter
Test condition
Symbol
Min
Typ.
Max
Unit
Supply Current (Pin 4)
Dark ambient
I
SD
2.0
2.7
mA
E
v
= 40 klx, sunlight
I
SH
2.3
mA
Supply Voltage (Pin 4)
V
S
2.7
5
5.5
V
Transmission Distance
p
= 870 nm,
IR Diode TSHF5400,
I
F
= 300 mA
d
max
15
m
p
= 950 nm,
IR Diode TSAL6400,
I
F
= 300 mA
d
max
9
m
Threshold Irradiance
p
= 870 nm,
optical test signal of Fig.1
E
e min
1.5
2.5
mW/m
2
Maximum Irradiance
Optical test signal of Fig.1
E
e max
30
W/m
2
Output Voltage Low (Pin 3)
1 k
external pull up resistor
V
QL
100
mV
Output Voltage High (Pin 3)
No external pull-up resistor,
test signal see fig. 1
V
QH
V
S
- 0.25
V
Bandpass filter quality
Q
10
Out-Pulse width tolerance
Optical test signal of Fig.1,
2.5 mW/m
2
E
e
30 W/m
2
tpo
- 15
+ 5
+ 15
s
Delay time of output pulse
Optical test signal of Fig.1,
E
e
> 2.5 mW/m
2
t
don
15
36
s
Receiver start up time
Valid data after power on
t
V
50
s
Falling time
Leading edge of output pulse
t
f
0.4
s
Rise time
No external pull up resistor
t
r
12
s
1 k
external pull up resistor
t
r
1.2
s
Directivity
Angle of half transmission
distance
1/2
50
deg
VISHAY
TSOP5700
Document Number 82166
Rev. 5, 14-Aug-03
Vishay Semiconductors
www.vishay.com
3
Typical Characteristics
(T
amb
= 25
C unless otherwise specified)
Figure 1. Output Function
Figure 2. Output Fucntion (mit Jitter)
Figure 3. Output Pulse Diagram (t
don
, t
po
)
E
e
V
Q
V
QH
V
QL
Optical Test Signal
(f=455kHz, 10 cycles/burst)
Output Signal of TSOP5700
t
pi
= 22
s
t
t
don
t
po
t
f
16563
2.2
s
t
r
50%
90%
10%
t
po
= t
pi i
15
s
> 48.6
s
(min. duty cycle)
t
E
e
V
O
V
OH
V
OL
t
Optical Test Signal
(IR diode TSHF5400,
p
870 nm, I
F
= 300 mA, f = 455 kHz, 10 cycles/burst)
Output Signal of TSOP5700
j
tdon
t
don
t
po
jitter of leading edge
jitter of output pulse width
j
tpo
16565
t
pi
= 22
s
t
0
5
10
15
20
25
30
35
0.1
1.0
10.0 100.0 1000.010000.0
100000.0
E
e
Irradiance (mW/m
2
)
16790
don
t , t Output Pulse Length ( s )
Output pulse width t
po
Delay time t
don
1
10
100 1000 10000 100000
N = 10 cycles/burst
p
o
Figure 4. Jitter of Output Pulse
Figure 5. Frequency Dependence of Responsivity
Figure 6. Sensitivity in Bright Ambient
0
5
10
15
20
25
30
0.1
1.0
10.0
100.0 1000.010000.0
100000.0
E
e
Irradiance (mW/m
2
)
16791
j
N=10 cycles/burst
Jitter t
don
Jitter t
po
1
10
100 1000 10000 100000
tdon,
tpo
j
Jitter of Output Pulse ( s )
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
300
350
400
450
500
550
600
f Frequency ( kHz )
16751
/
E
e min
e
rel
E Responsitivity
0
2
4
6
8
10
12
14
0.1
1.0
10
100
E - DC Irradiance (W/m
2
)
16558
e
min
E
-
Threshold
Irradiance
(
mW/m
)
2
i
Ambient,
= 950 nm
i
i
Correlation with ambient light sources:
10W/m
2
1.4klx (Std.illum.A,T= 2855 K)
10W/m
8.2klx (Daylight,T = 5900 K)
2
www.vishay.com
4
Document Number 82166
Rev. 5, 14-Aug-03
VISHAY
TSOP5700
Vishay Semiconductors
Figure 7. Sensitivity vs. Supply Voltage
Figure 8. Rel. Sensitivity vs. Burstlength
Figure 9. Supply Current vs. Ambient Temperature
1.0
1.2
1.4
1.6
1.8
2.0
2.2
2.4
2.6
2.8
3.0
2
3
4
5
6
V
S
- Supply Voltage ( V )
16559
Sensitivity in dark ambient
e
min
E
Threshold
Irradiance
(
mW/m
)
2
0.5
0.6
0.7
0.8
0.9
1.0
1.1
N - Burstlength ( carriercycles/burst )
16788
e
min
E
-
Relative
Sensitivity
26
22
18
14
28
24
20
16
12
10
8
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
5 15 25 35 45 55 65 75 85
T
amb
- Ambient Temperature ( C )
16754
I
-
Supply
Current
(
m
A
)
s
V
S
= 5.5 V
V
S
= 2.7 V
-5
-15
-25
Figure 10. Relative Spectral Sensitivity vs. Wavelength
Figure 11. Directivity
0.0
0.2
0.4
0.6
0.8
1.0
1.2
750 800 850 900 950 1000 10501100 1150
- Wavelength ( nm )
16789
S
(
)
-
Relative
Spectral
Sensitivity
rel
16801
0.4
0.2
0
0.2
0.4
0.6
0.6
0.9
0
30
10
20
40
50
60
70
80
1.0
0.8
0.7
d
rel
- Relative Transmission Distance
VISHAY
TSOP5700
Document Number 82166
Rev. 5, 14-Aug-03
Vishay Semiconductors
www.vishay.com
5
Recommendation for Suitable Data
Formats
The circuit of the TSOP5700 is designed in that way
that disturbance signals are identified and unwated
output pulses due to noise or disturbances are
avoided. A bandpass filter, an automatic gain control
and an integrator stage is used to suppress such dis-
turbances. The distinguishing marks between data
signal and disturbance are carrier frequency, burst
length and the envelope duty cycle.
The data signal should fulfill the following conditions:
The carrier frequency should be close to 455 kHz.
The burstlength should be at least 22
s (10 cycles
of the carrier signal) and shorter than 500
s.
The separation time between two consecutive
bursts should be at least 26
s.
If the data bursts are longer than 500
s then the
envelope duty cycle is limited to 25 %
The duty cycle of the carrier signal (455 kHz) may be
between 50 % (1.1
s pulses) and 10 % (0.2 s
pulses). The lower duty cycle may help to save bat-
tery power.
www.vishay.com
6
Document Number 82166
Rev. 5, 14-Aug-03
VISHAY
TSOP5700
Vishay Semiconductors
Package Dimensions in mm
16776
VISHAY
TSOP5700
Document Number 82166
Rev. 5, 14-Aug-03
Vishay Semiconductors
www.vishay.com
7
Taping Version TSOP5700..TT
16584
www.vishay.com
8
Document Number 82166
Rev. 5, 14-Aug-03
VISHAY
TSOP5700
Vishay Semiconductors
Taping Version TSOP5700..TR
16585
VISHAY
TSOP5700
Document Number 82166
Rev. 5, 14-Aug-03
Vishay Semiconductors
www.vishay.com
9
Reel Dimensions
16734
www.vishay.com
10
Document Number 82166
Rev. 5, 14-Aug-03
VISHAY
TSOP5700
Vishay Semiconductors
Leader and Trailer
Cover Tape Peel Strength
According to DIN EN 60286-3
0.1 to 1.3 N
300 10 mm/min
165 - 180 peel angle
Label
Standard bar code labels for finished goods
The standard bar code labels are product labels and
used for identification of goods. The finished goods
are packed in final packing area. The standard pack-
ing units are labeled with standard bar code labels
before transported as finished goods to warehouses.
The labels are on each packing unit and contain
Vishay Semiconductor GmbH specific data.
Trailer
Leader
no devices
no devices
min. 200
min. 400
Start
End
devices
96 11818
VISHAY
TSOP5700
Document Number 82166
Rev. 5, 14-Aug-03
Vishay Semiconductors
www.vishay.com
11
Dry Packing
The reel is packed in an anti-humidity bag to protect
the devices from absorbing moisture during transpor-
tation and storage.
Final Packing
The sealed reel is packed into a cardboard box. A
secondary cardboard box is used for shipping pur-
poses.
Item-Description
Item-Number
Selection-Code
LOT-/ Serial-Number
Data-Code
Plant-Code
Quantity
Accepted by:
Packed by:
Mixed Code Indicator
Origin
INO
BATCH
SEL
COD
PTC
QTY
ACC
PCK
MIXED CODE
xxxxxxx
+
18
8
3
10
3 (YWW)
2
8
Company Logo
Plain Writing
Abbreviation
Length
Item-Number
Sequence-Number
Plant-Code
Quantity
Total Length
N
8
2
3
8
21
Long Bar Code Top
Type
Length
N
X
N
SelectionCode
Batch-Number
Data-Code
Filter
Total Length
X
3
3
10
1
17
Short Bar Code Bottom
Type
Length
N
X
16942
Vishay Semiconductor GmbH standard bar code product label (finished goods)
Aluminium bag
Label
Reel
15973
www.vishay.com
12
Document Number 82166
Rev. 5, 14-Aug-03
VISHAY
TSOP5700
Vishay Semiconductors
Recommended Method of Storage
Dry box storage is recommended as soon as the alu-
minium bag has been opened to prevent moisture
absorption. The following conditions should be
observed, if dry boxes are not available:
Storage temperature 10 C to 30 C
Storage humidity
60 % RH max.
After more than 72 hours under these conditions
moisture content will be too high for reflow soldering.
In case of moisture absorption, the devices will
recover to the former condition by drying under the
following condition:
192 hours at 40 C + 5 C/ -0 C and < 5 % RH (dry
air/ nitrogen) or
96 hours at 60 C +5 C and < 5 % RH for all device
containers or
24 hours at 125 C +5 C not suitable for reel or
tubes.
An EIA JEDEC Standard JESD22-A112 Level 4 label
is included on all dry bags.
Example of JESD22-A112 Level 4 label
ESD Precaution
Proper storage and handling procedures should be
followed to prevent ESD damage to the devices espe-
cially when they are removed from the Antistatic
Shielding Bag. Electro-Static Sensitive Devices warn-
ing labels are on the packaging.
Vishay Semiconductors Standard
Bar-Code Labels
The Vishay Semiconductors standard bar-code labels
are printed at final packing areas. The labels are on
each packing unit and contain Vishay Semiconduc-
tors specific data.
Operating Instructions
Reflow Soldering
Reflow soldering must be done within 48 hours
stored under max. 30 C, 80 % RH after opening
envelop
Recommended soldering paste (composition: SN 63
%, Pb 37 %)
Melting temperature 178 C to 192 C
Apply solder paste to the specified soldering pads,
by using a dispenser or by screen printing.
Recommended thickness of metal mask is 0.2 mm
for screen printing.
The recommended reflow furnace is a combination-
type with upper and lower heaters.
Set the furnace temperatures for pre-heating and
heating in accordance with the reflow temperature
profile as shown below. Excercise extreme care to
keep the maximum temperature below 230 C. The
following temperature profile means the tempera ture
at the device surface. Since temperature difference
occurs between the work and the surface of the circuit
board depending on the pes of circuit board or reflow
furnace, the operating conditions should be verified
prior to start of operation.
Handling after reflow should be done only after the
work surface has been cooled off.
Manual Soldering
Use the 6/4 solder or the solder containing silver.
Use a soldering iron of 25 W or smaller. Adjust the
temperature of the soldering iron below 300 C.
Finish soldering within three seconds.
Handle products only after the temperature is cooled
off.
Cleaning
Perform cleaning after soldering strictly in conform-
ance to the following conditions:
Cleaning agent:
2-propanol (isopropyl alcohol).
Commercially available grades (industrial use) should
be used.
16943
16962
VISHAY
TSOP5700
Document Number 82166
Rev. 5, 14-Aug-03
Vishay Semiconductors
www.vishay.com
13
Demineralized or distilled water having a resistivity of
not less than 500 m
corresponding to a conductivity
of 2 mS/m.
Temperature and time: 30 seconds under the tem-
perature below 50 C or 3 minutes below 30 C.
Ultrasonic cleaning: Below 20 W.
Reflow Solder Profile
Assembly Instructions
Reflow Soldering
Reflow soldering must be done within 72 hours
stored under max. 30 C, 60 % RH after opening
envelop
Recommended soldering paste (composition: SN 63
%, Pb 37 %) Melting temperature 178 C to 192 C
Apply solder paste to the specified soldering pads,
by using a dispenser or by screen printing.
Recommended thickness of metal mask is 0.2 mm
for screen printing.
The recommended reflow furnace is a combination-
type with upper and lower heaters.
Set the furnace temperatures for pre-heating and
heating in accordance with the reflow temperature
profile as shown below. Excercise extreme care to
keep the maximum temperature below 230 C. The
following temperature profile means the tempera ture
at the device surface. Since temperature differ ence
occurs between the work and the surface of the circuit
board depending on the pes of circuit board or reflow
furnace, the operating conditions should be verified
prior to start of operation.
Handling after reflow should be done only after the
work surface has been cooled off.
Manual Soldering
Use the 6/4 solder or the solder containing silver.
Use a soldering iron of 25 W or smaller. Adjust the
temperature of the soldering iron below 300 C.
Finish soldering within three seconds.
Handle products only after the temperature is cooled
off.
Cleaning
Perform cleaning after soldering strictly in conform-
ance to the following conditions:
Cleaning agent:
2-propanol (isopropyl alcohol)
Commercially available grades (industrial use) should
be used.
Demineralized or distilled water having a resistivity of
not less than 500 m
corresponding to a conductivity
of 2 mS/m.
Temperature and time: 30 seconds under the tem-
perature below 50 C or 3 minutes below 30 C.
Ultrasonic cleaning: Below 20 W.
Reflow Solder Profile
0
20
40
60
80
100
120
140
160
180
200
220
240
0
50
100
150
200
250
300
350
Time ( s )
T
e
mperature
(
C
)
16735
2
C - 4 C/s
10 s max.
@ 230
C
90 s max
120 s - 180 s
2
C - 4 C/s
10 s max.
@ 230 C
90 s max
0
20
40
60
80
100
120
140
160
180
200
220
240
0
50
100
150
200
250
300
350
Time ( s )
T
emperature ( C )
16944
2 C - 4 C/s
120 s - 180 s
2 C - 4 C/s
www.vishay.com
14
Document Number 82166
Rev. 5, 14-Aug-03
VISHAY
TSOP5700
Vishay Semiconductors
Taping Version TSOP..TT
VISHAY
TSOP5700
Document Number 82166
Rev. 5, 14-Aug-03
Vishay Semiconductors
www.vishay.com
15
Taping Version TSOP..TR
www.vishay.com
16
Document Number 82166
Rev. 5, 14-Aug-03
VISHAY
TSOP5700
Vishay Semiconductors
Reel Dimensions
VISHAY
TSOP5700
Document Number 82166
Rev. 5, 14-Aug-03
Vishay Semiconductors
www.vishay.com
17
Leader and Trailer
Cover Tape Peel Strength
According to DIN EN 60286-3
0.1 to 1.3 N
300 10 mm/min
165 - 180 peel angle
Label
Standard bar code labels for finished goods
The standard bar code labels are product labels and
used for identification of goods. The finished goods
are packed in final packing area. The standard pack-
ing units are labeled with standard bar code labels
before transported as finished goods to warehouses.
The labels are on each packing unit and contain
Vishay Semiconductor GmbH specific data.
Dry Packing
The reel is packed in an anti-humidity bag to protect
the devices from absorbing moisture during transpor-
tation and storage.
Final Packing
The sealed reel is packed into a cardboard box. A
secondary cardboard box is used for shipping pur-
poses.
www.vishay.com
18
Document Number 82166
Rev. 5, 14-Aug-03
VISHAY
TSOP5700
Vishay Semiconductors
Recommended Method of Storage
Dry box storage is recommended as soon as the alu-
minium bag has been opened to prevent moisture
absorption. The following conditions should be
observed, if dry boxes are not available:
Storage temperature 10 C to 30 C
Storage humidity
60 % RH max.
After more than 72 hours under these conditions
moisture content will be too high for reflow soldering.
In case of moisture absorption, the devices will
recover to the former condition by drying under the
following condition:
192 hours at 40 C + 5 C/ -0 C and < 5 % RH (dry
air/ nitrogen) or
96 hours at 60 C +5 C and < 5 % RH for all device
containers or
24 hours at 125 C +5 C not suitable for reel or
tubes.
An EIA JEDEC Standard JESD22-A112 Level 4 label
is included on all dry bags.
Example of JESD22-A112 Level 4 label
ESD Precaution
Proper storage and handling procedures should be
followed to prevent ESD damage to the devices espe-
cially when they are removed from the Antistatic
Shielding Bag. Electro-Static Sensitive Devices warn-
ing labels are on the packaging.
Vishay Semiconductors Standard
Bar-Code Labels
The Vishay Semiconductors standard bar-code labels
are printed at final packing areas. The labels are on
each packing unit and contain Vishay Telefunken
specific data.
VISHAY
TSOP5700
Document Number 82166
Rev. 5, 14-Aug-03
Vishay Semiconductors
www.vishay.com
19
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and
operatingsystems with respect to their impact on the health and safety of our employees and the public, as
well as their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the
use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
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