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Электронный компонент: W005G

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W005G thru W10G
Vishay Semiconductors
formerly General Semiconductor
Document Number 88769
www.vishay.com
19-Feb-02
1
Glass Passivated Single-Phase
Bridge Rectifier
Reverse Voltage 50 and 1000V
Forward Current 1.5A
Maximum Ratings & Thermal Characteristics
Ratings at 25C ambient temperature unless otherwise specified.
Parameter
Symbols W005G W01G
W02G
W04G
W06G W08G
W10G
Units
Maximum repetitive peak reverse voltage
V
RRM
50
100
200
400
600
800
1000
V
Maximum RMS voltage
V
RMS
35
70
140
280
420
560
700
V
Maximum DC blocking voltage
V
DC
50
100
200
400
600
800
1000
V
Maximum average forward rectified current at
0.375" (9.5mm) lead length at T
A
=25C
I
F(AV)
1.5
A
Peak forward surge current single sine-wave
superimposed on rated load (JEDEC Method)
I
FSM
50
A
Rating for fusing (t<8.3ms)
I
2
t
10
A
2
sec
Typical thermal resistance per leg
(1)
R
JA
36
C/W
R
JL
11
Operating junction temperature range
T
J
-55 to +150
C
Storage temperature range
T
STG
-55 to +150
C
Electrical Characteristics
Ratings at 25C ambient temperature unless otherwise specified.
Parameter
Symbols W005G W01G
W02G
W04G
W06G W08G
W10G
Units
Maximum instantaneous forward voltage drop
per leg at 1.0A
V
F
1.0
V
Maximum DC reverse current at rated T
A
=25C
5.0
DC blocking voltage per leg
T
A
=125C
I
R
500
A
Typical junction capacitance per leg at 4.0V, 1MHz
C
J
14
pF
Notes: (1) Thermal resistance from junction to ambient and from junction to lead at 0.375" (9.5mm) lead length P.C.B. mounting
0.220 (5.6)
0.160 (4.1)
0.388 (9.86)
0.348 (8.84)
0.032 (0.81)
0.028 (0.71)
1.0
(25.4)
MIN.
0.060 (1.52)
0.020 (0.51)
0.348 (8.84)
0.308 (7.82)
0.220 (5.6)
0.180 (4.6)
0.220 (5.6)
0.180 (4.6)
Dimensions in inches
and (millimeters)
Features
Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
This series is UL listed under the Recognized
Component Index, file number E54214
Glass passivated chip junction
High case dielectric strength
Typical I
R
less than 0.1
A
High overload surge current
Ideal for printed circuit boards
High temperature soldering guaranteed:
260C/10 seconds, 0.375 (9.5mm) lead length,
5lbs. (2.3kg) tension
Mechanical Data
Case: Molded plastic body over passivated junctions
Terminals: Plated leads solderable per MIL-STD-750,
Method 2026
Mounting Position: Any
Weight: 0.04 oz., 1.1 g
Packaging codes/options: 1/100 EA. per Bulk Bag
Case Style WOG
W005G thru W10G
Vishay Semiconductors
formerly General Semiconductor
www.vishay.com
Document Number 88769
2
19-Feb-02
Ratings and
Characteristic Curves
(T
A
= 25C unless otherwise noted)
Ambient Temperature (
C)
Fig. 1 -- Derating Curve
Output Rectified Current
A
verage Forward Output Current (A)
Fig. 3 -- Typical Forward
Characteristics Per Leg
Instantaneous Forward Voltage (V)
Instantaneous Forward Current (A)
Percent of Rated Peak Reverse Voltage (%)
Instantaneous Reverse Current (
A)
Fig. 4 -- Typical Reverse Leakage
Characteristics Per Leg
Fig. 6 -- Typical Transient
Thermal Impedance
Number of Cycles at 60 H
Z
t, Heating Time (sec.)
Fig. 2 -- Maximum Non-Repetitive
Peak Forward Surge Current Per Leg
Peak Forward Surge Current (A)
Reverse Voltage (V)
Junction Capacitance (pF)
T
ransient
Thermal Impedance (
C/W)
Fig. 5 -- Typical Junction
Capacitance Per Leg
20
40
60
80
100
120
140
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
150
Capacitive Load
5.0
10
20
=
I
(pk)
I
(AV)
1
0
10
40
50
60
30
20
10
100
T
A
= 25
C
Single Sine-Wave
(JEDEC Method)
1.0 Cycle
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.01
0.1
1
10
20
T
J
= 25
C
Pulse Width = 300
s
1% Duty Cycle
0
20
40
60
80
100
0.01
0.1
1
10
50
0.1
1
10
100
1
10
100
T
J
= 25
C
f = 1.0MH
Z
Vsig = 50mVp-p
0.1
0.01
1
10
100
1
10
100
0.1
T
J
= 100
C
T
J
= 25
C
P.C.B.
0.375"
(9.5mm)
Copper Pads
0.22 x 0.22"
(5.5 x 5.5mm)
60 H
Z
Resistive or
Inductive Load