NexFlash Technologies, Inc.

PRELIMINARY

NXSF012B-0599

02/22/00 ©

NX25Mxxx
NX26Mxxx

NX25Mxxx AND NX26Mxxx SERIES
REMOVABLE SERIAL FLASH MODULES

PRELIMINARY

FEBRUARY 1999

This document contains PRELIMINARY INFORMATION. NexFlash reserves the right to make changes to its product at any time without notice in order to improve design and supply the best
possible product. We assume no responsibility for any errors which may appear in this publication.

FEATURES

· Serial Flash Module (SFM)

Removable package for Serial Flash Memories
128KB, 256KB, 512KB, 1MB, 2MB, and 4MB-byte

capacities

Ideal for small portable/mobile products that store

voice, images or data

Enables unlimited storage, revision updates and

capacity upgrades

· Smallest Removable Flash Card

Relatively flat 15mm x 45mm (1.8"x 0.6") form

factor. Less than 15% area of PCMCIA Card

· Ultra-low Power and Fast Programming

Single 5V or 3V supply for read, Erase/Write
As low as 5 mA @3V, less than 1 µA standby
Up to 200KB/sec for Erase/Write

· Simple Interface

Supports NX25Fxxx SPI (4-pin) or NX26Fxxx NXS

(2-pin) interfaces

Smart card style self-cleaning connector, only

8-contact pads

Device Information Sector allows identification of

capacity, voltage and other characteristics

Optional electronic serial number

· Reduces Overall System Costs

Smaller case, simple PCB, low-cost connector
Fewer pins, simple microcontroller
Reduced power management, lower battery usage

· Development Support

PC-based Development Kit and Software

DESCRIPTION

The NX25Mxxx and NX26Mxxx Serial Flash Modules
(SFM) provide the benefits of

NexFlash's Serial Flash

Memories in an innovative removable package. SFM sup-
port capacities of 128KB, 256KB, 512KB, 1MB, 2MB, and
4MB. SFM's are ideal for microcontroller-based
applications, small portable and mobile products, and other
resource-limited systems that store data, voice, and
images. SFM's have a space-efficient form factor of 15mm
(0.6") by 45mm (1.8") that is easy to handle and transport
(see Figure 1). Simple electrical contacts, similar to those
used in smart cards, provide for a reliable and cost-effective
interface to a surface-mount slide-in connector (commonly
used in GSM phones). Up to two Serial Flash Memories can
be mounted onto the module which is made of standard FR4
Epoxy Glass PCB material.

There are two Serial Flash Module package types available:
TSOP and Chip on Board (COB). The leads of the TSOP
package are covered in molded epoxy. The COB version,
which offers a thinner profile, has the chip mounted directly
on the PCB covered in epoxy. Depending on the Serial Flash
device used, modules can be read from and written to at
supply voltages of 5V or 3V. Current consumption is as low

as 5 mA active and 1 µA standby making them highly
suitable for battery operation. The SFM's can accommo-
date

NexFlash's NX25Fxxx SPI 4-pin interface or NX26Fxxx

NXS 2-pin interface Serial Flash memory devices. DOS
compatible sectors allow for sustained
Erase/Write rates of over 200K bytes/sec. Other features of
the Serial Flash Module include on-chip SRAM, electronic
ID, flexible write protection and insertion/removal detection.
(Note: This document is supplementary to the NX25Fxxx
and NX26Fxxx Serial Flash Memory data sheets.)

1MB

SPI-5V

Serial
Flash
Module

N X 2 5 M 0 8 0 A - 5 T- R

45mm

(1.80)

15mm

(0.60)

Note: Inches are in parentheses

NXD010A-1298

Figure 1. Serial Flash Module

NX25Mxxx
NX26Mxxx

NexFlash Technologies, Inc.

PRELIMINARY

NXSF012B-0599

02/22/00 ©

MICROCONTROLLER

(DSP or ASIC)

Vcc

WPS

10K

(2)

(3)

(13)

(12)

(14)

(1)

CS0

SCK

CS1

Vcc

SI
SO
WP/DT
GND

CSO

SCK

CS1

Vcc

CS1

SCK

CSO

C3
C7
C8

GND

WP/DT

TOP VIEW

(LABEL SIDE)

GND
WP/DT

BOTTOM VIEW

(CONTACT SIDE)

Vcc

GND

SCK
SO

SI
WP/DT

CS0

CS1

B Hold*

Hold

(4)

(1)

Serial Flash

Memory

SPI Interface

25Fxxx Series

CS1*

CS0

SCK

WP/DT

Detect Control*

(11)

* OPTIONAL

NXD011A-0598

Figure 2. Typical interface for Serial Flash Module with SPI Interface using NX25Fxxx Series Devices.

Equivalent pin numbers for TSOP (Type II) are listed in parentheses. SPI contact assignments are shown for Bottom

and Top Views of Serial Flash Module and Top View of the ITT Cannon Slide-insertion Connector (Model CCM-03-3504).

PIN DESCRIPTIONS

SPI NX25Fxxx Series
Note: See NX25Fxxx Data Sheets for further information

Power Supply Pins (Vcc and Gnd)
Supply source for 5V or 3V. Contact layout allows for the
module to be inserted and removed while power is applied
("hot-socketing") without damaging the module's memory
device.

Serial Data Input (SI)
The SPI bus Serial Data Input (SI) provides a means for
commands or data to be written to (shifted into) the device.

Serial Data Output (SO)
The SPI bus Serial Data Output (SO) provides a means for
data to be read from (shifted out of) the device. When the
device is deselected (

CS=1) SO pin is in a high-impedance

state.

Serial Clock (SCK)
All commands and data written to the Serial Input (SI) are
clocked relative to the rising edge of Serial Clock (SCK). All
data read from the Serial Data Output (SO) is clocked
relative to the falling edge of SCK.

Chip Selects (

CS0

CS0 and CS1

CS1

CS1)

CS0 selects device location 0, which is on the contact side
of the module.

CS1 selects device location 1, which is

located on the opposite side of module from device #0.

CS1

is only used when a module has two serial flash memories.
Chip select inputs are asserted low.

Write Protect/Detect (

WP/DT)

The Write Protect/Detect pin is an optional dual function pin.

Write Protect (

WP)

Used as a Write Protect Input (

WP), when WP is asserted

(active low) the entire flash memory array is Write Pro-
tected.

WP can be controlled by the interface or as an

optionally available contact pad directly on the module.

Detect (DT)
Using a pull-up resistor, a card detect (DT) can provide a
low to high or high to low transition when the module is
inserted or removed. The pulse is best used in conjunction
with an interrupt input of a microcontroller or processor.

R/B

Hold

The Ready/Busy-Hold pin function is not available for use
with the SFM. This pin must be set to "No Connect" in the
NX25Fxxx configuration register.

NexFlash Technologies, Inc.

PRELIMINARY

NXSF012B-0599

02/22/00 ©

NX25Mxxx
NX26Mxxx

PIN DESCRIPTIONS

NXS NX26Fxxx Series
Note: See NX26Fxxx Data Sheets for further information

Power Supply Pins (Vcc and Gnd)
Supply source for 5 or 3.0V. Contact layout allows for the
module to be inserted and removed while power is applied
("hot-socketing") without damaging the module's memory
device.

Serial Data Input/Output (SIO)
The NXS bus Serial Data Input/Output (SIO) provides a
means for commands or data to be written to (shifted into)
the device or read from (shifted out of) the device. When the
device is deselected SIO pin is in a high-impedance state.

Device Address Pins (A0, A1, A2, A3)
There is no separate chip select signal for the NXS inter-
face (NX26Fxxx series), instead four static address signals
(A0, A1, A2, and A3) are provided for decoding one of 16
possible addresses. The A0 address signal, which is not

MICROCONTROLLER

(DSP or ASIC)

Vcc

WPS

10K

(2)

(3)

(13)

(12)

(14)

(1)

A3-0

SCK

A3-1

Vcc

A1
SIO
A2 &

WP/DT

GND

A3-0

SCK

A3-1

Vcc

A3-1

SCK

A3-0

C3
C7
C8

GND

A2 &

WP/DT

SIO

TOP VIEW

(LABEL SIDE)

GND

A2 &

WP/DT

SIO

BOTTOM VIEW

(CONTACT SIDE)

Vcc

GND

SCK
SIO

(4)

(1)

Serial Flash

Memory

NXS Interface

26Fxxx Series

A3-1*

A3-0

SCK

SIO

A2,

WP/DT

Detect Control*

(11)

SERIAL I/O,

AND GENERAL

PURPOSE

PORT PINS

* OPTIONAL

NXD012A-0598

Figure 3. Typical interface for Serial Flash Module with NXS Interface using NX26Fxxx Series Devices.

Equivalent pin numbers for TSOP (Type II) are listed in parentheses. NXS contact assignments are shown for Bottom

and Top Views of Serial Flash Module and Top View of the ITT Cannon Slide-insertion Connector (Model CCM-03-3504).

available on the contact pad, is tied low for device #0 (on the
contact side) and is tied high for device #1 (optionally used on
the top side). A1, A2, A3-0, and A3-1, which are available on
the contact pad, must be tied high or low at the connector
according to the desired address of device #0 or #1.

Write Protect/Detect (

WP/DT)

The Write Protect/Detect pin is an optional dual function pin.

Write Protect (

WP)

Write Protect Input (

WP) can be used as a status indicator

for the firmware to determine if a write protect condition
exists on the SFM (if optional

WP switch or contact pad is

available on the SFM). Unlike the NX25Fxxx SPI series the
low on

WP does not provide a direct electrical protection of

the device. Note that this pin also serves as the A2 address.
If used for write protect status the change in device address
must be taken into consideration.

Detect (DT)
Using a pull-up resistor, a card detect (DT) can provide a
low-to-high or high-to-low transition when the module is
inserted or removed. The pulse is best used in conjunction
with an interrupt input of a microcontroller or processor. Note
that this pin also serves as the A2 address. If used for detect
status the device address must be taken into consideration.

NX25Mxxx
NX26Mxxx

NexFlash Technologies, Inc.

PRELIMINARY

NXSF012B-0599

02/22/00 ©

OPTIONAL DUAL
CHIP DEVICE

OPTIONAL DUAL

CHIP DEVICE

TOLERANCES:

X.X

[X.XX]

= ±0.3

[±0.012]

X.XX X

[X.XXX] = ±0.1

[±0.004]

15.00 [0.591]

5.00 [0.20]

1.00
[0.040]

RADIUS 0.50 [0.020]

1.50 [0.060]

45.00 [1.772]

2.00 [0.079] MIN

23.00 [0.906] MAX

2.59 [0.102]

1.76 [0.069]

14.75 [0.581]

3.00 [0.118]

0.76±0.08
[0.030±0.003]

6.0 [0.24]

1.00 [0.039] MIN

3.20 [0.126] MAX

2.00 [0.079] MAX

RADIUS 0.8 [0.03] 3PLCS

NXD013A-0398

Figure 4. Serial Flash Module Package Dimensions TSOP with epoxy version

(Inches are in parentheses)

OPTIONAL DUAL
CHIP DEVICE

OPTIONAL DUAL

CHIP DEVICE

TOLERANCES:

X.X

[X.XX]

= ±0.3

[±0.012]

X.XX X

[X.XXX] = ±0.1

[±0.004]

15.00 [0.591]

5.00 [0.20]

1.00
[0.040]

RADIUS 0.50 [0.020]

1.50 [0.060]

45.00 [1.772]

2.00 [0.079] MIN

23.00 [0.906] MAX

2.59 [0.102]

1.76 [0.069]

14.75 [0.581]

3.00 [0.118]

0.76±0.08
[0.030±0.003]

6.0 [0.24]

1.00 [0.039] MIN

3.20 [0.126] MAX

2.00 [0.079] MAX

RADIUS 0.8 [0.03] 3PLCS

NXD013A-0398

Figure 5. Serial Flash Module Package Dimensions COB with epoxy version

(Inches are in parentheses)

NexFlash Technologies, Inc.

PRELIMINARY

NXSF012B-0599

02/22/00 ©

NX25Mxxx
NX26Mxxx

ABSOLUTE MAXIMUM RATINGS

(1, 2)

Symbol

Parameter

Conditions

Range

Unit

Vcc

Supply Voltage

0 to 7.0

, V

OUT

Voltage Applied to Any Pin

Relative to Ground

0.5 to V

+ 0.5

EDC

Electro-static Discharge: Contact

JEIDA 4.1 Specification

±7,000

to Insulating or Conductive Plate.

(Non A version devices)

JEIDA 4.1 Specification

±8,000

(A version devices)

EDA

Electro-static Discharge: Air Discharge

IEC-1000-4-2 Specification

±7,000

to Insulating or Conductive Plate.

(Non A version devices)

IEC-1000-4-2 Specification

±8,000

(A version devices)

Storage Temperature

40 to +85

°C

Note:
1. This device has been designed and tested for the specified operation ranges. Proper operation outside of these levels is not

guaranteed. Exposure beyond absolute maximum ratings (listed above) may cause permanent damage.

2. Proper care and handling of the Serial Flash Module is mandatory to ensure reliable operation. Avoid bending or subjecting the

module to sudden impact. Avoid directly touching the connectors to protect from damage caused by static discharge.

NexFlash

cannot accept and hereby disclaims liability for any damage to the modules, including data corruption that may occur due to
mishandling.

OPERATING RANGES

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

Supply Voltage for Reading and

See specific Serial Flash memory data sheet for 5V or 3V

Writing Main Flash Array

operating range.

CCDIS

Supply Voltage for Reading Device

DIS Read-only Voltage

2.7

5.5

Information Sector (DIS) to Identify

Specified Voltage of Module.

Ambient Temperature, Operating

Commercial

+55

°C

Extended

(2)

+70

°C

Industrial

(2)

+85

°C

IRO

Mechanical Insertion and

Office Environment

5,000

10,000

Cycles

Removal Cycles

(1)

Using ITT Cannon

Connector CCM03-3504

Note:

1. Tested on a sample basis or specified via design or characterization data.
2. Contact NexFlash for availability of extended and industrial grade devices.

AC AND DC ELECTRICAL CHARACTERISTICS

See associated NX25Fxxx or NX26Fxxx Serial Flash Memory Data Sheet

NX25Mxxx
NX26Mxxx

NexFlash Technologies, Inc.

PRELIMINARY

NXSF012B-0599

02/22/00 ©

ORDERING INFORMATION

Size

Order Part No.

Package

128K-Byte

NX25M011A-3V-R

SPI, SFM, TSOP (V Type I)

32 RS, 3V

128K-Byte

NX25M011A-5V-R

SPI, SFM, TSOP (V Type I)

32 RS, 5V

128K-Byte

NX26M011A-3V-R

NXS, SFM, TSOP (V Type I)

32 RS, 3V

128K-Byte

NX26M011A-5V-R

NXS, SFM, TSOP (V Type I)

32 RS, 5V

512K-Byte

NX25M041A-3V-R

SPI, SFM, TSOP (V Type I)

32 RS, 3V

512K-Byte

NX25M041A-5V-R

SPI, SFM, TSOP (V Type I)

32 RS, 5V

512K-Byte

NX26M041A-3V-R

NXS, SFM, TSOP (V Type I)

32 RS, 3V

512K-Byte

NX26M041A-5V-R

NXS, SFM, TSOP (T Type I)

32 RS, 5V

1M-Byte

NX25M080A-3T-R

SPI, SFM, TSOP (T Type II)

64 RS, 3V

1M-Byte

NX25M080A-5T-R

SPI, SFM, TSOP (T Type II)

64 RS, 5V

1M-Byte

NX26M080A-3T-R

NXS, SFM, TSOP (T Type II)

64 RS, 3V

1M-Byte

NX26M080A-5T-R

NXS, SFM, TSOP (T Type II)

64 RS, 5V

2M-Byte

NX25M080A-3T2-R

SPI, SFM, Dual TSOP (T Type II)

64 RS, 3V

2M-Byte

NX25M080A-5T2-R

SPI, SFM, Dual TSOP (T Type II)

64 RS, 5V

2M-Byte

NX26M080A-3T2-R

NXS, SFM, Dual TSOP (T Type II)

64 RS, 3V

2M-Byte

NX26M080A-5T2-R

NXS, SFM, Dual TSOP (T Type II)

64 RS, 5V

2M-Byte

NX26M160-3T-R

NXS, SFM, TSOP (T Type II)

64 RS, 3.0-3.6V

2M-Byte

NX26M160-3C-R

NXS, SFM, COB (T Type II)

64 RS, 3.0-3.6V

2M-Byte

NX26M160-5T-R

NXS, SFM, TSOP (T Type II)

64 RS, 5V

2M-Byte

NX26M160-5C-R

NXS, SFM, COB (T Type II)

64 RS, 5V

4M-Byte

NX26M160-3T2-R

NXS, SFM, Dual TSOP (T Type II)

64 RS, 3.0-3.6V

4M-Byte

NX26M160-3C2-R

NXS, SFM, Dual COB (T Type II)

64 RS, 3.0-3.6V

4M-Byte

NX26M160-5T2-R

NXS, SFM, Dual TSOP (T Type II)

64 RS, 5V

4M-Byte

NX26M160-5C2-R

NXS, SFM, Dual COB (T Type II)

64 RS, 5V

Note: To order SFM's without labels contact

NexFlash's Serial Flash Marketing Department.

NexFlash Technologies, Inc.

PRELIMINARY

NXSF012B-0599

02/22/00 ©

NX25Mxxx
NX26Mxxx

PRELIMINARY DESIGNATION

The "Preliminary" designation on an

NexFlash data sheet

indicates that the product is not fully characterized. The
specifications are subject to change and are not guaran-
teed.

NexFlash or an authorized sales representative

should be consulted for current information before using
this product.

IMPORTANT NOTICE

NexFlash reserves the right to make changes to the
products contained in this publication in order to improve
design, performance or reliability.

NexFlash assumes no

responsibility for the use of any circuits described herein,
conveys no license under any patent or other right, and
makes no representation that the circuits are free of
patent infringement. Charts and schedules contained
herein reflect representative operating parameters, and
may vary depending upon a user's specific application.
While the information in this publication has been
carefully checked,

NexFlash shall not be liable for any

damages arising as a result of any error or omission.

LIFE SUPPORT POLICY

NexFlash does not recommend the use of any of its
products in life support applications where the failure or
malfunction of the product can reasonably be expected to
cause failure in the life support system or to significantly
affect its safety or effectiveness. Products are not autho-
rized for use in such applications unless

NexFlash receives

written assurances, to its satisfaction, that:

(a) the risk of injury or damage has been minimized;

(b) the user assumes all such risks; and

NexFlash is adequately protected

under the circumstances.

Trademarks:
NexFlash is a trademark of NexFlash Technologies, Inc. All
other marks are the property of their respective owner.

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ÐÐ»ÐµÐºÑ‚Ñ€Ð¾Ð½Ð½Ñ‹Ð¹ ÐºÐ¾Ð¼Ð¿Ð¾Ð½ÐµÐ½Ñ‚: NX25M080A-3T2-R