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Электронный компонент: MF194SC

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1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2001-2004, Zarlink Semiconductor Inc. All Rights Reserved.
Features
860 nm Surface-Emitting LED
70 MHz Bandwidth
Designed for 50/125 m fiber
Applications
LANs
Test Equipment
General Purpose
Description
This device is designed for Ethernet and general
applications and offers an excellent price/performance
ratio for cost-effective solutions. Its double-lens optical
system results in optimum coupling of power into the
fiber.
September 2004
Ordering Information
MF194
TO-46 Package
MF194 ST
ST Housing
MF194 SC
SC Housing
MF194 SMA
SMA Housing
MF194 FC
FC Housing
-40
C to +85
C
Note: Rated Fiber coupled power apply only on the TO-46
package, for housing options fiber coupled power is
typically 10% less.
MF194
860 nm - 70 MHz High Performance LED
Data Sheet
Figure 1 - Pin Diagram
Figure 2 - Functional Schematic
ANODE
CASE
Bottom View
CATHODE
The diode chip is isolated from the case.
ANODE
CATHODE
MF194
Data Sheet
2
Zarlink Semiconductor Inc.
Note 1: Measured at the exit of 100 meters of fiber.
Optical and Electrical Characteristics - Case Temperature 25
C
Parameter
Symbol
Min
Typ
Max
Unit
Test Condition
Fiber-Coupled Power
(Figures 3, 4, and 5) (Table 1)
P
fiber
25
45
W
I
F
=60 mA
(Note 1)
Fiber:
50/125
m
Graded
Index
NA=0.20
Rise and Fall Time (10-90%)
t
r
,t
f
5
7
ns
I
F
=60 mA
(no bias)
Bandwidth (3dB
el
)
f
c
70
MHz
I
F
=60 mA
Peak Wavelength
p
840
860
880
nm
I
F
=60mA
Spectral Width (FWHM)
50
nm
I
F
=60 mA
Forward Voltage (Figure 7)
V
F
1.7
1.9
V
I
F
=60 mA
Reverse Current
I
R
20
A
V
R
=1 V
Capacitance
C
250
pF
V
R
-0 V, f=1 MHz
Absolute Maximum Ratings
Parameter
Symbol
Limit
Storage Temperature
T
stg
-55 to +125
C
Operating Temperature (derating: Figure 6)
T
op
-40 to +85
C
Electrical Power Dissipation (derating: Figure 6)
P
tot
160 mW
Continuous Forward Current (f<10 kHz)
I
F
80 mA
Peak Forward Current (duty cycle<50%,f>1 MHz
I
FRM
130 mA
Reverse Voltage
V
R
1.5 V
Soldering Temperature (2 mm from the case for 10 sec.)
T
sld
260
C
MF194
Data Sheet
3
Zarlink Semiconductor Inc.
Thermal Characteristics
Parameter
Symbol
Min.
Typ.
Max.
Unit
Thermal Resistance - Infinite Heat Sink
R
thjc
200
C/W
Thermal Resistance - No Heat Sink
R
thja
500
C/W
Temperature Coefficient - Optical Power
dP/dT
j
-0.5
%/
C
Temperature Coefficient - Wavelength
d
/dT
j
0.3
nm/
C
Typical Fiber-Coupled Power
Core Diameter/Cladding Diameter Numerical Aperture
50/12 5
m
0.20
62.5/125
m
0.275
100/140
m
0.29
200/230
m
0.37
45
W
95
W
210
W
440
W
MF194
Data Sheet
4
Zarlink Semiconductor Inc.
Figure 3 - Relative Fiber-coupled Power vs. z - Axial Displacement of Fiber
Figure 4 - Relative Fiber-coupled Power vs. r - Radial Displacement of Fiber
0
20
40
60
80
100
0.5
1
1.5
2
2.5
3
z - Axial Displacement of Fiber (mm)
Relative Fiber-coupled Power (%)
z
r
r - optimal
C
= 50
m
(
m)
0
20
40
60
80
100
0
20
40
60
80
100
r - Radial Displacem ent of Fiber (m)
Relative Fiber-coupled Power (%)
z
r
z - optimal
C
= 50
m
(
m)
MF194
Data Sheet
5
Zarlink Semiconductor Inc.
Figure 5 - Relative Fiber-coupled Power vs. Forward Current
Figure 6 - Max. Electrical Power Dissipation vs. Operating Temperature
0
20
40
60
80
100
0
20
40
60
80
100
120
140
160
180
200
Forw ard Current (mA)
Relative Fiber-coupled Power (%)
50% Duty Cycle
Heat Sinked
DC
0
50
100
150
200
250
300
0
25
50
75
100
125
150
Operating Temperature (
o
C)
Max. Electrical Po
wer
Di
ssi
pati
on (mW)
No Heat Sink
Infinite Heat Sink