S E M I C O N D U C T O R S
SUMMARY
V
(BR)DSS
= 100V; R
DS(ON)
= 0.230
I
D
= 1.9A
DESCRIPTION
This new generation of TRENCH MOSFETs from Zetex utilizes a unique structure
that combines the benefits of low on-resistance with fast switching speed. This
makes them ideal for high efficiency, low voltage, power management
applications.
FEATURES
Low on-resistance
Fast switching speed
Low threshold
Low gate drive
SOT23-6 package
APPLICATIONS
DC - DC Converters
Power Management Functions
Disconnect switches
Motor control
DEVICE MARKING
10B8
ZXMN10B08E6
PROVISIONAL ISSUE B - MAY 2003
1
100V N-CHANNEL ENHANCEMENT MODE MOSFET
DEVICE
REEL
SIZE
TAPE
WIDTH
QUANTITY
PER REEL
ZXMN10B08E6TA
7"
8mm
3000 units
ZXMN10B08E6TC
13"
8mm
10000 units
ORDERING INFORMATION
Top View
PINOUT
SOT23-6
ZXMN10B08E6
S E M I C O N D U C T O R S
PROVISIONAL ISSUE B - MAY 2003
2
PARAMETER
SYMBOL
VALUE
UNIT
Junction to Ambient (a)
R
JA
113
C/W
Junction to Ambient (b)
R
JA
73
C/W
NOTES
(a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions
(b) For a device surface mounted on FR4 PCB measured at t 5 secs.
(c) Repetitive rating 25mm x 25mm FR4 PCB, D = 0.02, pulse width 300 s - pulse width limited by maximum junction temperature. Refer to
Transient Thermal Impedance graph
THERMAL RESISTANCE
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-Source Voltage
VDSS
100
V
Gate Source Voltage
VGS
20
V
Continuous Drain Current VGS=10V; TA=25C (b)
VGS=10V; TA=70C (b)
VGS=10V; TA=25C (a)
ID
1.9
1.5
1.6
A
Pulsed Drain Current (c)
IDM
9
A
Continuous Source Current (Body Diode) (b)
IS
2.5
A
Pulsed Source Current (Body Diode) (c)
ISM
9
A
Power Dissipation at TA=25C (a)
Linear Derating Factor
PD
1.1
8.8
W
mW/C
Power Dissipation at TA=25C (b)
Linear Derating Factor
PD
1.7
13.6
W
mW/C
Operating and Storage Temperature Range
Tj:Tstg
-55 to +150
C
ABSOLUTE MAXIMUM RATINGS.
CHARACTERISTICS
ZXMN10B08E6
S E M I C O N D U C T O R S
PROVISIONAL ISSUE B - MAY 2003
3
ZXMN10B08E6
S E M I C O N D U C T O R S
PROVISIONAL ISSUE B - MAY 2003
4
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT CONDITIONS.
STATIC
Drain-Source Breakdown Voltage
V(BR)DSS
100
V
ID=250 A, VGS=0V
Zero Gate Voltage Drain Current
IDSS
0.5
A
VDS=100V, VGS=0V
Gate-Body Leakage
IGSS
100
nA
VGS= 20V, VDS=0V
Gate-Source Threshold Voltage
VGS(th)
1.0
3.0
V
I
D
=250 A, VDS= VGS
Static Drain-Source On-State Resistance
(1)
RDS(on)
0.230
0.300
0.500
VGS=10V, ID=1.6A
VGS=4.5V, ID=1.4A
VGS=4.3V, ID=1.1A
Forward Transconductance (1)(3)
gfs
4.8
S
VDS=15V,ID=1.6A
DYNAMIC (3)
Input Capacitance
Ciss
497
pF
VDS=50 V, VGS=0V,
f=1MHz
Output Capacitance
Coss
29
pF
Reverse Transfer Capacitance
Crss
18
pF
SWITCHING(2) (3)
Turn-On Delay Time
td(on)
2.9
ns
VDD =50V, ID=1.0A
RG
6.0 , VGS=10V
Rise Time
tr
2.1
ns
Turn-Off Delay Time
td(off)
12.1
ns
Fall Time
tf
5.0
ns
Gate Charge
Qg
5.0
nC
VDS=50V,VGS=5V,
I
D
=1.6A
Total Gate Charge
Qg
9.2
nC
VDS=50V,VGS=10V,
I
D
=1.6A
Gate-Source Charge
Qgs
1.7
nC
Gate-Drain Charge
Qgd
2.5
nC
SOURCE-DRAIN DIODE
Diode Forward Voltage (1)
VSD
0.85
0.95
V
TJ=25C, IS=2.0A,
VGS=0V
Reverse Recovery Time (3)
trr
32.0
ns
TJ=25C, IF=1.7A,
di/dt= 100A/ s
Reverse Recovery Charge (3)
Qrr
40.0
nC
ELECTRICAL CHARACTERISTICS
(at T
A
= 25C unless otherwise stated).
NOTES
(1) Measured under pulsed conditions. Width
=
300
s. Duty cycle
2% .
(2) Switching characteristics are independent of operating junction temperature.
(3) For design aid only, not subject to production testing.
ZXMN10B08E6
S E M I C O N D U C T O R S
PROVISIONAL ISSUE B - MAY 2003
5
TYPICAL CHARACTERISTICS
PDF 
ZIP